Porous plate-shaped filler, method for producing same, and heat insulation film

US10464287B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10464287-B2
Application numberUS-201615297429-A
CountryUS
Kind codeB2
Filing dateOct 19, 2016
Priority dateApr 23, 2014
Publication dateNov 5, 2019
Grant dateNov 5, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A porous plate-shaped filler of the present invention is a plate shape having an aspect ratio of 3 or more, a surface shape is one of a round shape, an oval and a round-corner polygonal shape, and its minimum length is from 0.1 to 50 μm. Furthermore, a sectional shape is one of an arch shape, an elliptic shape, and a quadrangular shape in which at least a part of corners is rounded. Consequently, it is possible to obtain the heat insulation film in which the porous plate-shaped fillers 1 are easy to be laminated and the heat insulation effect improves.

First claim

Opening claim text (preview).

The invention claimed is: 1. A heat insulation film comprising a porous plate-shaped filler which is a plate shape having major surfaces each of which contains a plurality of pores, a thickness of from 0.1 to 50 μm, a length to thickness aspect ratio of 3 or more and in which a surface shape is a round-corner polygonal shape, wherein a radius R of an arc of the round-corner polygonal shape in the surface shape is not less than the thickness, wherein a thermal conductivity of the heat insulation film is 1 W/(m·K) or less. 2. The heat insulation film according to claim 1 , wherein the porous plate-shaped filler has a cross-sectional shape parallel to a thickness direction thereof that is one of an arch shape, an elliptic shape, and a quadrangular shape in which at least a part of corners is rounded. 3. The heat insulation film according to claim 2 , wherein the porous plate-shaped filler has a radius R of an arc of the quadrangular shape in which at least a part of corners in the cross-sectional shape parallel to the thickness direction is rounded is ⅕ or more of the thickness. 4. The heat insulation film according to claim 1 , wherein the porous plate-shaped filler includes pores having an average pore diameter of 10 to 500 nm. 5. The heat insulation film according to claim 1 , wherein a thermal conductivity of the porous plate-shaped filler is 1 W/(m·K) or less. 6. The heat insulation film according to claim 1 , wherein a heat capacity of the porous plate-shaped filler is from 10 to 3000 kJ/(m 3 ·K) or less. 7. A method for producing the heat insulation film according to claim 1 , which comprises processing a green sheet made from a material including a component of the porous plate-shaped filler by use of a laser processing machine capable of performing irradiation with laser at a pulse width of 10 picoseconds or less, before or after firing, to form the porous plate-shaped filler having a predetermined surface shape. 8. A method for producing the heat insulation film according to claim 1 , which comprises dropping or discharging slurry made from a material including a component of the porous plate-shaped filler and adjusted into a viscosity of 100 to 10000 cps, to form the porous plate-shaped filler whose cross-sectional shape parallel to a thickness direction thereof is one of an arch shape, an elliptic shape, and a quadrangular shape in which at least a part of corners is rounded. 9. The method for producing the heat insulation film according to claim 8 , which comprises dropping or discharging the slurry by use of an ink jet type spotter device. 10. A method for producing the heat insulation film according to claim 1 , which comprises adhering, to an adhering portion having a predetermined shape, slurry made from a material including a component of the porous plate-shaped filler and adjusted into a viscosity of 100 to 10000 cps; and pressing the adhering portion onto a substrate surface, thereby adhering the slurry adhered to the adhering portion to the substrate surface, to form the porous plate-shaped filler whose cross-sectional shape parallel to a thickness direction thereof is one of an arch shape, an elliptic shape, and a quadrangular shape in which at least a part of corners is rounded. 11. The method for producing the heat insulation film according to claim 10 , which comprises adhering the slurry to the substrate surface by use of a needle type dispenser device. 12. The heat insulation film according to claim 1 , wherein the porous plate-shaped fillers are arranged in the form of layers. 13. The heat insulation film according to claim 1 , wherein a thickness of the heat insulation film is from 1 μm to 5 mm.

Assignees

Inventors

Classifications

  • B32B5/30Primary

    one layer {being formed of particles, e.g. chips,} granules, powder · CPC title

  • extending in two dimensions, e.g. plate-like · CPC title

  • using ultrashort pulses, i.e. pulses of 1 ns or less · CPC title

  • with a polygonal circumferential shape · CPC title

  • by boring or cutting · CPC title

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What does patent US10464287B2 cover?
A porous plate-shaped filler of the present invention is a plate shape having an aspect ratio of 3 or more, a surface shape is one of a round shape, an oval and a round-corner polygonal shape, and its minimum length is from 0.1 to 50 μm. Furthermore, a sectional shape is one of an arch shape, an elliptic shape, and a quadrangular shape in which at least a part of corners is rounded. Consequentl…
Who is the assignee on this patent?
Ngk Insulators Ltd, Nkg Insulators Ltd
What technology area does this patent fall under?
Primary CPC classification B32B5/30. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Nov 05 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).