Heat-Insulation Film, and Heat-Insulation-Film Structure

Patent metadata

Field	Value
Publication number	US-2016258383-A1
Application number	US-201615157534-A
Country	US
Kind code	A1
Filing date	May 18, 2016
Priority date	Jun 20, 2012
Publication date	Sep 8, 2016
Grant date	—

Abstract

In a heat-insulation film, porous plate fillers are dispersed in a matrix to bond the porous plate fillers. The porous plate filler includes plates having an aspect ratio of 3 or more, a minimum length of 0.1 to 50 μm and a porosity of 20 to 90%. In the heat-insulation film, a volume ratio between the porous plate fillers and the matrix is from 50:50 to 95:5. In the heat-insulation film in which the porous plate fillers are used, a length of a heat transfer path increases and a thermal conductivity can be decreased, as compared with a case where spherical or cubic fillers are used.

First claim

1 . A heat-insulation film in which porous plate fillers comprising plates having an aspect ratio of 3 or more, a minimum length of 0.1 to 50 μm and a porosity of 20 to 90% are dispersed in a matrix to bond the porous plate fillers, and a volume ratio between the porous plate fillers and the matrix is from 50:50 to 95:5.

2 . The heat-insulation film according to claim 1 ,
wherein when a line is drawn from a first surface to a second surface on an opposite side to the first surface in a thickness direction in a cross section parallel to the thickness direction, a ratio between a sum of lengths of line segments present on the porous plate fillers and a sum of lengths of line segments present on the matrix is from 50:50 to 95:5.

3 . The heat-insulation film according to claim 1 ,
wherein a thermal conductivity of the porous plate filler is 1 W/(m·K) or less.

4 . The heat-insulation film according to claim 1 ,
wherein a heat capacity of the porous plate filler is from 10 to 3000 kJ/(m 3 ·K).

5 . The heat-insulation film according to claim 1 ,
wherein the porous plate filler comprises pores of a nanoorder.

6 . The heat-insulation film according to claim 1 ,
wherein the porous plate filler includes a metal oxide.

7 . The heat-insulation film according to claim 1 ,
wherein the porous plate filler comprises particles having particle diameters of 1 nm to 10 μm.

8 . The heat-insulation film according to claim 1 ,
wherein a heat capacity is 1500 kJ/(m 3 ·K) or less.

9 . The heat-insulation film according to claim 1 ,
wherein a thermal conductivity is 1.5 W/(m·K) or less.

10 . A heat-insulation-film structure in which the heat-insulation film according to claim 1 is formed on a substrate.

11 . The heat-insulation-film structure according to claim 10 ,
which has, on the surface of the heat-insulation film, a surface dense layer including ceramics and/or glass and having a porosity of 5% or less.

12 . The heat-insulation-film structure according to claim 11 ,
which comprises a buffer bonding layer having a thickness smaller than the heat-insulation film, between the substrate and the heat-insulation film and/or between the heat-insulation film and the surface dense layer.

Assignees

• Ngk Insulators Ltd

Inventors

• Kobayashi Hiroharu
• Tomita Takahiro
• Oribe Akinobu

Classifications

• B32B5/30

  one layer {being formed of particles, e.g. chips,} granules, powder · CPC title

• F02F3/12 Primary

  on piston heads · CPC title

• C04B2235/3246

  Stabilised zirconias, e.g. YSZ or cerium stabilised zirconia · CPC title

• C01P2004/20

  extending in two dimensions, e.g. plate-like · CPC title

• B32B2307/3065

  Flame resistant or retardant, fire resistant or retardant · CPC title