Cooling electronic devices in a data center

Patent metadata

Field	Value
Publication number	US-10462935-B2
Application number	US-201514747448-A
Country	US
Kind code	B2
Filing date	Jun 23, 2015
Priority date	Jun 23, 2015
Publication date	Oct 29, 2019
Grant date	Oct 29, 2019

Abstract

A thermosiphon includes a condenser; an evaporator that includes a fluid channel and a heat transfer surface, the heat transfer surface defining a plurality of fluid pathways in the fluid channel that extend through the fluid channel, the evaporator configured to thermally couple to one or more heat-generating electronic devices; and a transport member that fluidly couples the condenser and the evaporator, the transport member including a liquid conduit that extends through the transport member to deliver a liquid phase of a working fluid into the fluid pathways, the transport member further including a surface to vertically enclose the plurality of fluid pathways.

First claim

What is claimed is:

1. A thermosiphon, comprising:
a condenser;
an evaporator that comprises a fluid channel and a heat transfer surface, the heat transfer surface comprising a plurality of fins or ridges that form a plurality of fluid pathways in the fluid channel that extend through the fluid channel, the evaporator configured to thermally couple to one or more heat-generating electronic devices; and
a transport member that fluidly couples the condenser and the evaporator, the transport member comprising a liquid conduit that extends through the transport member, the liquid conduit comprising an elongated slot aligned with a center of the evaporator to deliver a liquid phase of a working fluid into the fluid pathways, the transport member further comprising a bottom surface to contact a top of the heat transfer surface and vertically enclose the plurality of fluid pathways at the top of the heat transfer surface such that each of the plurality of fluid pathways comprises sidewalls formed by adjacent fins or ridges, a top barrier formed by the bottom surface of the transport member, and a bottom formed by a floor of the fluid channel,
wherein the fluid pathways are configured to transfer heat from the heat-generating electronic devices to the working fluid to change the working fluid from the liquid phase at inlets of the fluid pathways, as the working fluid flows in the fluid pathways, to a vapor phase or mixed-phase at outlets of the fluid pathways, the inlets of the fluid pathways comprising apertures defined by the sidewalls and top of the fluid pathways, and the outlets of the fluid pathways comprising apertures defined by a vertical plane perpendicular to the floor of the fluid channel, and
each of the inlets and outlets are oriented in a direction axially parallel to the sidewalls, and the working fluid flows from the inlets, in a direction transverse to the height of the fins or ridges and across at least a portion of the evaporator, to the outlets, the vapor phase or mixed-phase of the working fluid being vertically enclosed within the fluid pathways as the working fluid flows to the outlets of the fluid pathways.

2. The thermosiphon of claim 1 , wherein the fluid channel is oriented transverse to the fluid pathways.

3. The thermosiphon of claim 1 , wherein the transport member further comprises a vapor conduit that extends through the transport member to receive the vapor phase or mixed-phase of the working fluid from the fluid pathways.

4. The thermosiphon of claim 1 , wherein the inlets of the fluid pathways are positioned at a first end of the fluid pathways and the outlets of the fluid pathways are positioned at a second end of the fluid pathways opposite the first end.

5. The thermosiphon of claim 1 , wherein the inlets of the fluid pathways are positioned at a midpoint of the fluid pathways, and the outlets of the fluid pathways are positioned at opposed ends of the fluid pathways.

6. The thermosiphon of claim 1 , wherein the plurality of fluid pathways extend transverse to the fluid channel.

7. The thermosiphon of claim 1 , wherein the plurality of fluid pathways extend parallel with the fluid channel.

8. The thermosiphon of claim 1 , wherein the transport member further comprises a heat transfer interface between the liquid conduit and the vapor conduit to transfer heat from the working fluid in the vapor conduit to the working fluid in the liquid conduit.

9. The thermosiphon of claim 1 , wherein the liquid phase is at or near a saturation temperature of the working fluid.

10. The thermosiphon of claim 3 , wherein the vapor conduit comprises at least two vapor conduits.

11. The thermosiphon of claim 3 , wherein at least a portion of the vapor conduit is positioned in an upper half of the transport member, and at least a portion of the liquid conduit is positioned in a lower half of the transport member.

12. The thermosiphon of claim 3 , wherein the transport member comprises a condenser end that comprises an inlet of the liquid conduit that is offset in the transport member relative to an outlet of the vapor conduit in the condenser end of the transport member.

13. The thermosiphon of claim 3 , wherein a cross sectional area of the liquid conduit and a cross-sectional area of the vapor conduit is based, at least in part, on a heat load of the heat-generating electronic devices.

14. The thermosiphon of claim 3 , wherein the transport member slopes from the condenser to the evaporator, and a magnitude of the slope defines, at least in part, a liquid pressure head of the working fluid.

15. The thermosiphon of claim 14 , wherein the liquid pressure head of the working fluid is equal to a sum of a plurality of pressure losses in a closed loop fluid circuit that comprises the liquid conduit, the evaporator, the vapor conduit, and the condenser.

16. The thermosiphon of claim 1 , further comprising a spacer positioned in the fluid channel.

Assignees

• Google Llc

Inventors

• Farshchian Soheil
• Shaul Kenneth Dale

Classifications

• H10W40/475

  using jet impingement (H10W40/776 takes precedence) · CPC title

• H10W40/47

  by flowing liquids, e.g. forced water cooling · CPC title

• G06F2200/201

  Cooling arrangements using cooling fluid · CPC title

• H05K7/20809 Primary

  within server blades for removing heat from heat source · CPC title

• G06F1/20

  Cooling means · CPC title