Liquid-vapor separating type heat conductive structure

Patent metadata

Field	Value
Publication number	US-10048015-B1
Application number	US-201715603463-A
Country	US
Kind code	B1
Filing date	May 24, 2017
Priority date	May 24, 2017
Publication date	Aug 14, 2018
Grant date	Aug 14, 2018

Abstract

A liquid-vapor separating type heat conductive structure includes a vapor chamber, a heat pipe, a separation plate, and a working fluid. The vapor chamber includes a housing and a cavity. The housing includes a bottom plate and an upright plate. A first capillary structure is disposed on an inner surface of the bottom plate, and a through hole is formed on the upright plate. The heat pipe includes a pipe body and a second capillary structure. The pipe body includes an open end, the open end of the pipe body is inserted and sealingly connected to the through hole. The separation plate is disposed at the open end and covers the first capillary structure and the second capillary structure, so as to form a vapor passage and a liquid passage at two sides of the separation plate respectively. The working fluid is filled inside the cavity.

First claim

What is claimed is:

1. A liquid-vapor separating type heat conductive structure, comprising:
a vapor chamber, the vapor chamber including a housing and a cavity formed inside the housing, the housing including a bottom plate and an upright plate extending from the bottom plate, a first capillary structure being disposed on an inner surface of the bottom plate, a through hole communicating with the cavity being formed on the upright plate;
a heat pipe, the heat pipe including a pipe body and a second capillary structure disposed inside the pipe body, the pipe body including an open end, the open end of the pipe body being inserted and sealingly connected to the through hole;
a separation plate, the separation plate being disposed at the open end and covering the first capillary structure and the second capillary structure, so that a vapor passage and a liquid passage are formed at two sides of the separation plate respectively; and
a working fluid filled inside the cavity,
wherein the liquid-vapor separating type heat conductive structure includes multiple heat pipes, each of the heat pipes is inserted and connected to the vapor chamber, the separation plate includes an elongated covering plate and multiple curved plates connected to the elongated covering plate, the elongated covering plate is disposed on an inner surface of the first capillary structure, and each of the curved plates is disposed on the second capillary structure of each of the corresponding heat pipes.

2. The liquid-vapor separating type heat conductive structure according to claim 1 , wherein the separation plate is a gas-impermeable plate.

3. The liquid-vapor separating type heat conductive structure according to claim 2 , wherein the separation plate is a copper foil sheet or an aluminum foil sheet.

4. The liquid-vapor separating type heat conductive structure according to claim 1 , wherein the curved plates have a radius of curvature equal to a radius of curvature of an inner surface of the second capillary structure.

5. The liquid-vapor separating type heat conductive structure according to claim 1 , wherein an end face of the second capillary structure is in contact with the first capillary structure.

6. The liquid-vapor separating type heat conductive structure according to claim 1 , wherein the first capillary structure consists of a metal web, a fiber bundle or sintered metal powder.

7. The liquid-vapor separating type heat conductive structure according to claim 1 , wherein the second capillary structure consists of a metal web, a fiber bundle or sintered metal powder.

Assignees

• Taiwan Microloops Corp

Inventors

• Lin Chun-Hung

Classifications

• F28F9/22

  Arrangements for directing heat-exchange media into successive compartments, e.g. arrangements of guide plates · CPC title

• F28D2021/0028

  for cooling heat generating elements, e.g. for cooling electronic components or electric devices · CPC title

• F28D15/046

  characterised by the material or the construction of the capillary structure · CPC title

• F28D15/0266

  with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers (F28D15/043 takes precedence) · CPC title

• F28D15/04 Primary

  with tubes having a capillary structure · CPC title