Liquid immersion techniques for improved resistance to conductive anodic filament formation
US-2018273426-A1 · Sep 27, 2018 · US
US10462900B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10462900-B2 |
| Application number | US-201615364938-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 30, 2016 |
| Priority date | Nov 30, 2016 |
| Publication date | Oct 29, 2019 |
| Grant date | Oct 29, 2019 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
A process of improving resistance to conductive anodic filament (CAF) formation is disclosed. The process includes dissolving a base resin material, a lubricant material, and a coupling agent in a solvent to form a functionalized sizing agent solution. The process also includes applying the functionalized sizing agent solution to individual glass fibers following a glass fiber formation process. The process further includes removing the solvent via a thermal process that partially converts the base resin material. The thermal process results in formation of coated glass fibers having a flowable resin coating that is compatible with a pre-impregnated (prepreg) matrix material utilized to form a prepreg material for manufacturing a printed circuit board. During one or more printed circuit board manufacturing operations, the flowable resin coating flows to fill voids between the individual glass fibers that represent CAF formation pathways.
Opening claim text (preview).
What is claimed is: 1. A process of improving resistance to conductive anodic filament (CAF) formation, the process comprising: dissolving a base resin material, a lubricant material, and a coupling agent in a solvent to form a functionalized sizing agent solution, the base resin material including one or more peroxide initiators; applying the functionalized sizing agent solution to individual glass fibers following a glass fiber formation process; and removing the solvent via a thermal process that partially converts the base resin material, resulting in formation of coated glass fibers having a flowable resin coating that is compatible with a pre-impregnated (prepreg) matrix material, the prepreg matrix material including a polyphenylene oxide (PPO)-based matrix material; forming a prepreg material; and incorporating the prepreg material into the manufacturing of a printed circuit board, wherein, during one or more printed circuit board manufacturing operations, the flowable resin coating flows to fill voids between the individual glass fibers that represent conductive anodic filament (CAF) formation pathways. 2. The process of claim 1 , further comprising weaving the coated glass fibers to form a woven glass cloth having the flowable resin coating. 3. The process of claim 2 , wherein forming the prepreg material includes utilizing the prepreg matrix material and the woven glass cloth having the flowable resin coating. 4. The process of claim 3 , wherein the flowable resin coating at least partially fills voids between the individual glass fibers during formation of the prepreg material. 5. The process of claim 3 , wherein the printed circuit board includes a printed circuit board laminate. 6. The process of claim 1 , wherein the one or more peroxide initiators include 2,5-di-(t-butylperoxy)-2,5-dimethyl-3-hexyne (PA), alpha, alpha′-Bis(t-butylperoxy)diisopropylbenzene (PB), or a combination thereof. 7. The process of claim 1 , wherein the lubricant material includes one or more amine salts of fatty acids. 8. The process of claim 1 , wherein the coupling agent includes a silane coupling agent. 9. The process of claim 8 , wherein the silane coupling agent includes diallylpropylisocyanuratetrimethoxysilane.
Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer · CPC title
Anti metal-migration, e.g. avoiding tin whisker growth · CPC title
Polyphenylene oxides · CPC title
Polyphenylene oxides · CPC title
glass fibres · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.