Vacuum chuck, beveling/polishing device, and silicon wafer beveling/polishing method

Patent metadata

Field	Value
Publication number	US-10460975-B2
Application number	US-201515529667-A
Country	US
Kind code	B2
Filing date	Oct 5, 2015
Priority date	Dec 4, 2014
Publication date	Oct 29, 2019
Grant date	Oct 29, 2019

Abstract

A vacuum chuck includes: a vacuum chuck stage having a circular vacuum surface; a vacuum protection pad provided to the vacuum surface; an annular or arc-shaped concave portion dividing the vacuum surface into a central region located closer to a center of the vacuum surface and an outer circumferential region located on an outer circumferential side; and radially-extending concave portions formed in the central region. The vacuum protection pad has through holes in communication with the radially-extending concave portions, and the vacuum protection pad is bonded to the vacuum surface at the central region excluding the radially-extending concave portions.

First claim

The invention claimed is:

1. A vacuum chuck comprising:
a vacuum chuck stage comprising a circular vacuum surface;
a vacuum protection pad provided to the vacuum surface;
an annular or arc-shaped concave portion dividing the vacuum surface into a central region located closer to a center of the vacuum surface and an outer circumferential region located on an outer circumferential side; and
radially-extending concave portions formed in the central region, wherein
the vacuum protection pad has through holes in communication with the radially-extending concave portions, and
the vacuum protection pad is bonded to the vacuum surface at the central region excluding the radially-extending concave portions and is unbonded to the vacuum surface in the outer circumferential region.

2. The vacuum chuck according to claim 1 , wherein
the vacuum protection pad is shaped in a circle having a diameter equal to or more than a diameter of the vacuum surface.

3. A beveling-and-polishing device comprising the vacuum chuck according to claim 1 .

4. The vacuum chuck according to claim 1 , wherein an entirety of the radially extending concave portions are formed in the central region.

5. A method of beveling and polishing a silicon wafer using a vacuum chuck, the vacuum chuck comprising: a vacuum chuck stage comprising a circular vacuum surface; and a vacuum protection pad provided to the vacuum surface, the method comprising:
sucking and holding the silicon wafer with the vacuum protection pad; and
polishing a beveled portion of the silicon wafer,
the vacuum chuck further comprising:
an annular or arc-shaped concave portion dividing the vacuum surface into a central region located closer to a center of the vacuum surface and an outer circumferential region located on an outer circumferential side; and
radially-extending concave portions formed in the central region, wherein

the vacuum protection pad has through holes in communication with the radially-extending concave portions, and
the vacuum protection pad is bonded to the vacuum surface at the central region excluding the radially-extending concave portions and is unbonded to the vacuum surface in the outer circumferential region.

6. The method of beveling and polishing the silicon wafer according to claim 5 , wherein
the vacuum protection pad is shaped in a circle having a diameter equal to or more than a diameter of the vacuum surface.

7. The method of beveling and polishing the silicon wafer according to claim 5 , wherein an entirety of the radially extending concave portions are formed in the central region.

Assignees

• Sumco Corp

Inventors

• Torii Kantarou

Classifications

• H10P90/129

  by polishing · CPC title

• H10P90/128

  by edge treatment, e.g. chamfering · CPC title

• H10P72/0428

  Apparatus for mechanical treatment or grinding or cutting · CPC title

• H10P72/78

  using vacuum or suction, e.g. Bernoulli chucks · CPC title

• H10P72/76 Primary

  using mechanical means, e.g. clamps or pinches · CPC title