Display module, display apparatus having the same, and fabricating method thereof

Patent metadata

Field	Value
Publication number	US-10459266-B2
Application number	US-201615543555-A
Country	US
Kind code	B2
Filing date	Aug 4, 2016
Priority date	Aug 4, 2016
Publication date	Oct 29, 2019
Grant date	Oct 29, 2019

Abstract

The present application discloses a display module including a display substrate having a display area and a peripheral area surrounding the display area; a packaging cover facing the display substrate; and a mold frame having a frame shape and configured to receive the display substrate and the packaging cover. In the present display module, the mold frame includes a main body and a protrusion protruding away from an inner surface of the mold frame, the protrusion is between the display substrate and the packaging cover; the packaging cover has a recess in an area corresponding to the protrusion for receiving the protrusion; the recess and the protrusion complementarily match each other; and the protrusion has a first surface abutting the peripheral area of the display substrate and a second surface opposite to the first surface, the second surface abutting a surface of the recess.

First claim

What is claimed is:

1. A display module, comprising: a display substrate having a display area and a peripheral area surrounding the display area; a packaging cover facing the display substrate; and a mold frame configured to receive the display substrate and the packaging cover; wherein the mold frame comprises a main body and a protrusion protruding away from an inner surface of the mold frame, the protrusion is between the display substrate and the packaging cover; the packaging cover has a recess in an area corresponding to the protrusion for receiving the protrusion; the recess and the protrusion complementarily match each other; and the protrusion has a first surface abutting the peripheral area of the display substrate and a second surface opposite to the first surface, the second surface abutting a surface of the recess; wherein the protrusion partitions the inner surface into a first portion and a second portion; the display module further comprising: a sealant between the first portion of the inner surface and the display substrate, and a sealant between the second portion of the inner surface and the packaging cover, for sealing the display substrate and the packaging cover together and encapsulating display elements therebetween.

2. The display module of claim 1 , wherein an inner cover surface of the packaging cover abuts an inner substrate surface of the display substrate facing the inner cover surface; the inner cover surface and a surface of the recess are connected through a side surface of the recess.

3. The display module of claim 2 , wherein the first surface of the protrusion is substantially level with the inner cover surface of the packaging cover.

4. The display module of claim 2 , wherein the inner substrate surface is adhered to the first surface of the protrusion and the inner cover surface by an adhesive, and the second surface of the protrusion is adhered to the packaging cover by an adhesive.

5. The display module of claim 2 , wherein the protrusion has a third surface connecting the first surface and the second surface, the third surface facing the side surface of the recess and configured to form a gap therebetween.

6. The display module of claim 2 , further comprising a printed circuit board assembly in a printed circuit board assembly area corresponding to an area within the peripheral area; the printed circuit board assembly comprises a printed circuit board abutting the inner substrate surface, a flexible connector, and an interface;
a maximum thickness of the display module in the printed circuit board assembly area is no more than a maximum thickness of the display module in areas other than the printed circuit board assembly area.

7. The display module of claim 6 , the packaging cover has a cut-out section corresponding to the printed circuit board assembly area.

8. The display module of claim 6 , further comprising a back cover on side of the printed circuit board assembly distal to the display substrate.

9. The display module of claim 6 , the maximum thickness of the display module in areas other than the printed circuit board assembly area is defined by a maximum thickness of the mold frame along a direction substantially perpendicular to the first surface and the second surface of the protrusion.

10. The display module of claim 1 , further comprising a circular polarizer on a side of the display substrate distal to the packaging cover.

11. The display module of claim 10 , wherein a maximum thickness of display module in an area corresponding to the display area is substantially the same, as a sum of thicknesses of the display substrate, the packaging cover, and the circular polarizer.

12. A display apparatus comprising a display module of claim 1 .

13. A method of fabricating a display module, comprising: providing a mold frame comprising a main body and a protrusion protruding away from an inner surface of the mold frame; providing a packaging cover having a recess complementary to the protrusion; providing a display substrate having a display area and a peripheral area surrounding the display area; and assembling the mold frame, the packaging cover, and the display substrate so that the protrusion is sandwiched by the display substrate and the packaging cover, and the recess and the protrusion complementarily match each other; wherein the display substrate, the packaging cover, and the mold frame are assembled together so that the protrusion has a first surface abutting the peripheral area of the display substrate and a second surface opposite to the first surface, the second surface abutting a surface of the recess; wherein the step of assembling the mold frame, the packaging cover, and the display substrate comprises: adhering a first surface of the protrusion onto the peripheral area of the display substrate, to receive the display substrate in the mold frame; adhering a second surface of the protrusion onto the surface of the recess, to receive the packaging cover in the mold frame, and to receive the protrusion in the recess; the second surface opposite to the first surface; and adhering an inner cover surface of the packaging cover onto an inner substrate surface of the display substrate facing the inner cover surface; the inner cover surface and a surface of the recess are connected through a side surface of the recess.

14. The method of claim 13 , subsequent to the assembling step, further comprising encapsulating display elements between the display substrate and the packaging cover by sealing a space formed among the mold frame, the display substrate, and the packaging cover.

15. The method of claim 14 , wherein the protrusion partitions the inner surface into a first portion and a second portion; wherein the encapsulating step comprises sealing a gap between the first portion of the inner surface and the display substrate and sealing a gap between the second portion of the inner surface and the packaging cover.

16. The method of claim 13 , further comprising attaching a printed circuit board assembly in a printed circuit board assembly area corresponding to an area within the peripheral area.

17. The method of claim 16 , further comprising fabricating the packaging cover having the recess complementary to the protrusion and a cut-out portion corresponding to the printed circuit board assembly area.

Assignees

• Boe Technology Group Co Ltd

Inventors

• Wang Zifeng
• Ren Yan
• Cao Lei
• Hu Nannan
• Lin She

Classifications

• G02F1/133308 Primary

  Support structures for LCD panels, e.g. frames or bezels · CPC title

• G02F1/133528

  Polarisers · CPC title

• G02F2202/28

  Adhesive materials or arrangements · CPC title

• H05K5/03

  Covers · CPC title

• G02F2001/133314

  Physics · mapped topic