Insert molding around glass members for portable electronic devices

Patent metadata

Field	Value
Publication number	US-9235240-B2
Application number	US-94467110-A
Country	US
Kind code	B2
Filing date	Nov 11, 2010
Priority date	Nov 11, 2010
Publication date	Jan 12, 2016
Grant date	Jan 12, 2016

Abstract

An electronic device having an enclosure formed from at least one glass cover and a peripheral structure formed adjacent the periphery of the glass cover is disclosed. The peripheral structure can be secured adjacent to the glass cover with an adhesive. The peripheral structure can be molded adjacent the glass cover so that a gapless interface is formed between the peripheral structure and the periphery of the glass cover. In one embodiment, the peripheral structure includes at least an inner peripheral structure and an outer peripheral structure.

First claim

What is claimed is:

1. An electronic device enclosure, comprising:
a glass cover for a top surface for the electronic device enclosure;
an adhesive deposited around a bottom surface periphery of the glass cover;
a first peripheral structure for providing a support surface for the glass cover and for providing side protective surfaces for the glass cover, the first peripheral structure having an extended portion including a first surface parallel a second surface, the first surface configured to receive the adhesive such that the first peripheral structure is at least partially secured to the glass cover by the adhesive; and
an enclosure support structure having an upper surface coupled to the second surface of the first peripheral structure, the enclosure support structure further comprises a lower surface, the lower surface opposite the upper surface, the lower surface coupled to a second peripheral structure,
wherein the first peripheral structure is molded about the periphery of the glass cover, molded adjacent the adhesive, and molded adjacent to the enclosure support structure.

2. An electronic device enclosure as recited in claim 1 , wherein the enclosure support structure comprises an outer periphery member for the electronic device enclosure.

3. An electronic device enclosure as recited in claim 1 , wherein the adhesive is thermally activated, and
wherein the adhesive is thermally activated while the first peripheral structure is molded about the glass cover.

4. An electronic device enclosure as recited in claim 3 , wherein the molding of the first peripheral structure about the glass cover provides a gap-free interface between edges of the glass cover and the first peripheral structure provided about the periphery of the glass cover.

5. An electronic device enclosure as recited in claim 1 , wherein the molding of the first peripheral structure about the glass cover provides a gap-free interface between edges of the glass cover and the first peripheral structure provided about the periphery of the glass cover.

6. An electronic device enclosure as recited in claim 1 ,
wherein the adhesive is deposited on the bottom surface of the glass cover, and
wherein the first peripheral structure is molded about the periphery of the glass cover and molded adjacent the adhesive.

7. An electronic device enclosure as recited in claim 6 , wherein the adhesive is thermally activated.

8. An electronic device enclosure as recited in claim 6 , wherein the first peripheral structure comprises a polymer, and wherein the polymer includes additives such that the CTE of the first peripheral structure is made closer to the CTE of the glass cover.

9. An electronic device enclosure as recited in claim 8 , wherein the additives comprise particles or fibers made of glass or ceramic.

10. An electronic device enclosure as recited in claim 1 ,
wherein the adhesive is thermally activated, and
wherein the adhesive is applied as a film or a layer.

11. An electronic device enclosure as recited in claim 1 , wherein the first peripheral structure comprises a polymer.

12. An electronic device enclosure as recited in claim 1 , wherein the first peripheral structure comprises a polymer strengthened by containing glass fibers.

13. An electronic device enclosure as recited in claim 1 ,
wherein the first peripheral structure is molded about the periphery of the glass cover and molded adjacent the adhesive, and
wherein the adhesive includes a feature to which the first peripheral structure is formed.

14. An electronic device enclosure as recited in claim 1 , wherein the enclosure support structure comprises a metal support structure.

15. An electronic device enclosure as recited in claim 14 ,
wherein the metal support structure has at least one feature that provides a mechanical interlock with the first peripheral structure after the first peripheral structure has been molded.

16. An electronic device enclosure as recited in claim 1 , wherein the thickness of the glass cover window is about 0.3-1.0 mm.

17. An electronic device enclosure as recited in claim 1 ,
wherein the first peripheral structure includes an inner peripheral member and an outer peripheral member,
wherein the inner peripheral member is attached to the glass cover via the adhesive, and
wherein at least the outer peripheral member is molded about at least a portion of the periphery of the glass cover and about at least a portion of the inner peripheral member.

18. An electronic device enclosure as recited in claim 17 , wherein the molding of the outer peripheral member about at least the portion of the periphery of the glass cover provides a gap-free interface between edges of the glass cover and the outer peripheral member provided about at least a portion of the periphery of the glass cover.

19. An electronic device enclosure, comprising:
a glass cover for a top surface for the electronic device enclosure;
an adhesive deposited at a periphery of the glass cover;
a first peripheral structure for providing a support surface for the glass cover and for providing side protective surfaces for the glass cover, the first peripheral structure having an extended portion including a first surface parallel to a second surface, the first surface configured to receive the adhesive such that the first peripheral structure is at least partially secured to the glass cover by the adhesive; and
a support structure having a top side, the top side including at least one interlock feature for coupling to the first peripheral structure, wherein the support structure further comprises a bottom side, the bottom side opposite the top side, the bottom side coupled to a second peripheral structure,
wherein the first peripheral structure is molded about the periphery of the glass cover, molded adjacent the adhesive, and molded adjacent to the support structure and against the at least one interlock feature.

20. An electronic device enclosure as recited in claim 19 , wherein the first peripheral structure comprises a polymer strengthened by containing glass fibers.

21. An electronic device enclosure as recited in claim 19 ,
wherein the adhesive is deposited on the bottom surface of the glass cover, and
wherein the first peripheral structure is molded about the periphery of the glass cover and molded adjacent the adhesive.

22. An electronic device enclosure as recited in claim 21 , wherein the adhesive is thermally activated.

23. An electronic device enclosure as recited in claim 19 , further comprising a second glass cover coupled to the second peripheral structure.

24. An electronic device enclosure as recited in claim 19 , wherein the first peripheral structure comprises a polymer, and wherein the polymer includes additives such that the CTE of the first peripheral structure is made closer to the CTE of the glass cover.

25. An electronic device enclosure as recited in claim 24 , wherein the additives comprise particles or fibers made of glass or ceramic.

26. An electronic device enclosure as recited in claim 19 , wherein the support structure comprises a metal support structure.

27. An electronic device enclosure as recited in claim 19 , wherein the thickness of the glass cover window is about 0.3-1.0 mm.

28. An electronic device enclosure as recited in claim 19 , wherein the support structure comprises an outer periphery

Assignees

• Pakula David
• Lynch Stephen Brian
• Dinh Richard Hung Minh
• Tan Tang Yew
• Tan Lee Hua
• Apple Inc

Inventors

• Pakula David
• Lynch Stephen Brian
• Dinh Richard Hung Minh
• Tan Tang Yew
• Tan Lee Hua

Classifications

• G06F2200/1631

  Panel PC, e.g. single housing hosting PC and display panel · CPC title

• G06F1/1656 Primary

  Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories (mounting of accessories to a computer display G06F1/1607; display hoods G06F1/1603; cooling arrangements for portable computers G06F1/203) · CPC title

• G06F1/1626 Primary

  with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs] · CPC title

• A45C11/00

  Receptacles for purposes not provided for in groups A45C1/00-A45C9/00 (specially adapted for toiletry or cosmetic equipment A45D29/20, A45D44/18; travelling sewing kits A45F3/48) · CPC title

• H04M1/0249

  Details of the mechanical connection between the housing parts or relating to the method of assembly · CPC title