Method for manufacturing silicon carbide single crystal
US-2017335487-A1 · Nov 23, 2017 · US
US10458044B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10458044-B2 |
| Application number | US-201715654266-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 19, 2017 |
| Priority date | Mar 29, 2011 |
| Publication date | Oct 29, 2019 |
| Grant date | Oct 29, 2019 |
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Dust that is accumulated in an exhaust passage provided in a chamber, the exhaust passage for discharging gas in the chamber of a semiconductor crystal manufacturing device, is removed by being sucked from the outside of the chamber. Moreover, an opening and closing valve for cleaning that is detachably attached to an opening of the exhaust passage, the opening facing the chamber, is opened and closed intermittently in a suction state. Furthermore, the opening and closing valve for cleaning is driven by a valve driving unit. The dust accumulated in the exhaust passage is removed efficiently, whereby the time required to clean the exhaust passage is shortened and fluctuations of the pressure inside the chamber when a semiconductor crystal is manufactured are suppressed.
Opening claim text (preview).
The invention claimed is: 1. A method for cleaning an exhaust passage for a semiconductor crystal manufacturing device, the cleaning method by which dust that is accumulated in the exhaust passage is removed by sucking the dust from outside of a chamber, the exhaust passage provided in the chamber to discharge atmosphere gas in the chamber of the semiconductor crystal manufacturing device, wherein an atmosphere introduction process in which an opening of the exhaust passage, the opening facing the chamber, is opened by an opening and closing valve for cleaning that is detachably attached to the opening, and the atmosphere gas is introduced into the exhaust passage and an atmosphere discharge process in which the atmosphere gas in the exhaust passage is discharged by suction of the atmosphere gas in a state in which the opening is closed are performed in such a way that each process is performed once or are repeated more than once. 2. The method for cleaning an exhaust passage for a semiconductor crystal manufacturing device according to claim 1 , wherein a repetition cycle of the atmosphere discharge process and the atmosphere introduction process is 1 to 30 seconds.
Silicon · CPC title
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Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor · CPC title
Apparatus for preparing, pre-treating the source material to be used for crystal growth · CPC title
AIIIBV compounds {wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi} · CPC title
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