Electronic device, socket, and spacer to alter socket profile

Patent metadata

Field	Value
Publication number	US-10455685-B1
Application number	US-201816159840-A
Country	US
Kind code	B1
Filing date	Oct 15, 2018
Priority date	Oct 15, 2018
Publication date	Oct 22, 2019
Grant date	Oct 22, 2019

Abstract

An electronic device may include a circuit board, and the circuit board may include a dielectric material. A socket may be coupled to a first side of the circuit board, and the socket may be configured to receive a semiconductor package. A backing plate may be positioned on a second side of the circuit board. A spacer may be positioned between the backing plate and the circuit board. The spacer may alter the profile of the socket to provide a curved profile to the socket. The spacer may displace a portion of the socket in a first direction, for instance when the spacer is coupled between the backing plate and the circuit board.

First claim

The claimed invention is:

1. An electronic device, comprising:
a circuit board including a dielectric material;
a socket coupled to a first side of the circuit board and the socket is configured to receive a semiconductor package;
a backing plate positioned on a second side of the circuit board;
a spacer positioned between the backing plate and the circuit board; and
wherein the spacer alters a profile of the socket to provide a curved socket profile to the socket and displaces a portion of the socket in a first direction when the spacer is coupled between the backing plate and the circuit board.

2. The electronic device of claim 1 , further comprising a bolster plate assembly coupled with the circuit board, wherein the bolster plate assembly defines an aperture, and the aperture is sized and shaped to receive the socket.

3. The electronic device of claim 2 , wherein the bolster plate assembly has a curved bolster profile.

4. The electronic device of claim 1 , wherein the circuit board has a curved board profile.

5. The electronic device of claim 1 , further comprising an insulator coupled with the backing plate, wherein the spacer is coupled with the insulator and the spacer projects from a surface of the insulator.

6. The electronic device of claim 1 , wherein the spacer substantially surrounds a periphery of an opening in the backing plate.

7. The electronic device of claim 1 , wherein the spacer is a first spacer and further comprising a second spacer, and the first spacer is separated from the second spacer by a first dimension.

8. The electronic device of claim 1 , wherein the spacer is positioned proximate a central region of the backing plate or the socket.

9. The electronic device of claim 1 , wherein the circuit board is a motherboard.

10. An electronic device, comprising:
a semiconductor package including a semiconductor die;
a circuit board including a dielectric material;
a socket coupled to a first side of the circuit board and the socket is configured to receive the semiconductor package;
a backing plate positioned on a second side of the circuit board;
a spacer positioned between the backing plate and the circuit board; and
wherein the semiconductor package is received by the socket and is coupled with the socket, and the backing plate has a curved profile, and the curved profile of the backing plate provides a force to the socket by reacting against the spacer.

11. The electronic device of claim 10 , further comprising a bolster plate assembly coupled with the circuit board, wherein:
the bolster plate assembly is configured to couple with a heat sink;
the bolster plate assembly defines an aperture and the aperture is sized and shaped to receive the semiconductor package; and
wherein the coupling of the heat sink with the bolster plate assembly provides an enabling load to the semiconductor package and the enabling load couples the semiconductor package with the socket.

12. The electronic device of claim 11 , wherein the heat sink is coupled with the bolster plate assembly, and the coupling of the heat sink with the bolster plate assembly provides the curved profile to the backing plate.

13. The electronic device of claim 11 , wherein the backing plate defines a plate opening extending through a thickness of the backing plate, and the spacer is positioned proximate the plate opening.

14. A method for manufacturing an electronic device, comprising:
positioning a spacer between a backing plate and a socket;
coupling the backing plate with the socket or a circuit board; and
wherein the coupling of the backing plate with the socket or the circuit board alters a profile of the socket and provides a curved profile to the socket and displaces a portion of the socket in a first direction.

15. The method of claim 14 , further comprising:
coupling a semiconductor package with the socket or with the circuit board, wherein the coupling of the semiconductor package with the socket or the circuit board decreases the curved profile of the socket, and displaces the socket in a second direction.

16. The method of claim 15 , wherein the second direction is opposite the first direction.

17. The method of claim 15 , wherein the coupling of the semiconductor package with the socket or with the circuit board includes displacing the backing plate in the second direction, and provides the backing plate with a curved profile.

18. The method of claim 14 , wherein the coupling of the backing plate with the socket or the circuit board provides a curved profile to the circuit board, and displaces a portion of the circuit board in the first direction.

19. The method of claim 14 , further comprising positioning the spacer proximate a central region of the circuit board or the socket.

20. The method of claim 14 , further comprising positioning the spacer proximate a central region of the socket.

Assignees

• Intel Corp

Inventors

• Klein Steven A
• Liu Kuang
• Boyd Thomas A
• Gil Rangel Luis
• Mukadem Muffadal
• Ferguson Shelby A
• Toth Jr Francis
• Buddrius Eric
• Miele Ralph V
• Srinivasan Sriram
• Smalley Jeffory L

Classifications

• H05K2201/10325

  Sockets, i.e. female type connectors comprising metallic connector elements integrated in, or bonded to a common dielectric support · CPC title

• H05K3/301

  by means of a mounting structure (H05K3/325 takes precedence) · CPC title

• H10W78/00

  Detachable holders for supporting packaged chips in operation · CPC title

• H10W40/22

  characterised by their shape, e.g. having conical or cylindrical projections · CPC title

• H10W20/40

  Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes · CPC title