Semiconductor package carrier, and a corresponding system and method of use
US-2025112392-A1 · Apr 3, 2025 · US
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Buddrius Eric patents
Buddrius Eric is listed as an inventor on 4 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Buddrius Eric |
| Total patents | 4 |
| First publication | Oct 22, 2019 |
| Latest publication | Apr 3, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Methods, systems, apparatus, and articles of manufacture to control load distribution of integrated circuit packages
US-2023027076-A1 · Jan 26, 2023 · US
Integrated separator devices for hardware component separation
US-2023019643-A1 · Jan 19, 2023 · US
Electronic device, socket, and spacer to alter socket profile
US-10455685-B1 · Oct 22, 2019 · US
Recent patents
Latest publications not already listed above.
No data yet.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Intel Corp | 4 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W40/641 | 3 |
| H10W40/611 | 2 |
| H05K7/20736 | 2 |
| H10W40/22 | 2 |
| H10W40/60 | 1 |