Substrate treatment apparatus and substrate treatment method

Patent metadata

Field	Value
Publication number	US-10453729-B2
Application number	US-201815915559-A
Country	US
Kind code	B2
Filing date	Mar 8, 2018
Priority date	Sep 13, 2017
Publication date	Oct 22, 2019
Grant date	Oct 22, 2019

Abstract

According to an embodiment, a substrate treatment apparatus includes a support unit, a silane coupler supplier, an organic functional group remover, and a drive mechanism. The support supports a substrate having a patterned film. The silane coupler supplier supplies the film with a silane coupler. The organic functional group remover removes an organic functional group from the film silylated with the silane coupler. The drive mechanism drives at least one of the support, the silane coupler supplier, and the organic functional group remover in such a way that the supply of the silane coupler and the supply of light or gas are repeated by a predetermined number.

First claim

The invention claimed is:

1. A substrate treatment apparatus comprising:
a support unit to support a substrate having a patterned film;
a silane coupler supplier to supply the film with a silane coupler;
an organic functional group remover to supply light or gas that removes an organic functional group from the film silylated with the silane coupler; and
a drive mechanism to drive at least one of the support, the silane coupler supplier, and the organic functional group remover in such a way that the supply of the silane coupler and the supply of the light or the gas are repeated by a predetermined number, wherein
the support unit is configured in a form of a belt,
the drive mechanism linearly reciprocates the support unit in a horizontal direction, and
the silane coupler supplier, the rinse liquid supplier, the dry gas supplier, and the organic functional group remover are arranged along a direction in which the support unit moves.

2. The substrate treatment apparatus according to claim 1 , wherein the silane coupler is liquid.

3. The substrate treatment apparatus according to claim 1 , wherein the light is ultraviolet light, or the gas is ozone.

4. The substrate treatment apparatus according to claim 1 , wherein the number of organic functional group removers is greater than that of silane coupler suppliers.

5. The substrate treatment apparatus according to claim 1 , further comprising:
a rinse liquid supplier to supply a rinse liquid that rinses away the silane coupler after the silane coupler is supplied; and
a dry gas supplier to supply a dry gas after the rinse liquid is supplied.

6. The substrate treatment apparatus according to claim 1 , wherein the film includes at least a silicon oxide film.

7. The substrate treatment apparatus according to claim 1 , wherein the coupler agent supplier, the rinse liquid supplier, the dry gas supplier, and the organic functional group remover are each a nozzle.

8. A substrate treatment method comprising:
supplying a substrate having a pattered film with a silane coupler;
supplying light or gas that removes an organic functional group from the film silylated with the silane coupler; and
repeating the supply of the silane coupler and the supply of the light or the gas by a predetermined number by linearly reciprocating the substrate in a horizontal direction.

9. The substrate treatment method according to claim 8 , wherein the silane coupler is liquid.

10. The substrate treatment method according to claim 8 , wherein the light is ultraviolet light, or the gas is ozone.

11. The substrate treatment method according to claim 8 , wherein
the silane coupler is rinsed away after the silane coupler is supplied, and
a dry gas is supplied after the rinse liquid is supplied.

12. The substrate treatment method according to claim 8 , wherein the film includes at least a silicon oxide film.

Assignees

• Toshiba Memory Corp

Inventors

• Koide Tatsuhiko
• Iimori Hiroyasu
• Kimura Shinsuke

Classifications

• H10P72/3202

  Mechanical details, e.g. rollers or belts · CPC title

• H10P72/3314

  Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers · CPC title

• H10P72/1921

  characterised by substrate supports · CPC title

• H10P72/1918

  characterised by coupling elements, kinematic members, handles or elements to be externally gripped · CPC title

• H10P72/0436

  mainly by radiation · CPC title