Method and apparatus for cleaning semiconductor wafer
US-2015332940-A1 · Nov 19, 2015 · US
US10453709B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10453709-B2 |
| Application number | US-201715488538-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 17, 2017 |
| Priority date | May 13, 2016 |
| Publication date | Oct 22, 2019 |
| Grant date | Oct 22, 2019 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
Embodiments of the present disclosure generally relate to cleaning substrates, and more particularly, to methods and apparatus for endpoint detection of a cleaning process. The apparatus includes an outer cleaning basin, a liner, and a circulation system coupled to the liner. The circulation system includes a filter for removing particles from a fluid. A liquid particle counter is fluidly coupled to fluid in the liner for performing particle counting. Methods for using the apparatus are also described.
Opening claim text (preview).
What is claimed is: 1. A cleaning system, comprising: an outer basin; a liner disposed within the outer basin for maintaining fluid; a circulation system coupled to the outer basin for circulating the fluid in the liner, the circulation system comprising: a first piping in fluid communication with an interior of the liner; a filter disposed on the first piping for removing particles from the fluid; and a first liquid particle counter disposed on the first piping and upstream from the filter; a second liquid particle counter offline from the circulation system; a second piping configured to provide the fluid contained in the liner to the second liquid particle counter; and a controller configured to control flow of the fluid in the cleaning system, wherein the controller is configured to cause the first liquid particle counter to perform inline measurements while flowing fluid through the circulation system and to cause the second liquid particle counter to perform offline measurements while not flowing fluid through the circulation system. 2. The cleaning system of claim 1 , wherein the liner comprises polypropylene, polyethylene, or polyvinyl difluoride. 3. The cleaning system of claim 1 , wherein the outer basin comprises stainless steel. 4. The cleaning system of claim 1 , wherein the outer basin comprises a coated metal. 5. The cleaning system of claim 4 , wherein the coated metal is aluminum coated with ethylene tetrafluoroethylene. 6. The cleaning system of claim 1 , further comprising a transducer positioned between the outer basin and the liner for agitating solutions contained with the outer basin and the liner. 7. The cleaning system of claim 1 , further comprising a transducer positioned outside the outer basin and the liner for agitating solutions contained within the outer basin and the liner, the transducer positioned beneath a bottom of the outer basin. 8. The cleaning system of claim 7 , further comprising one or more additional transducers coupled to vertical walls of the outer basin. 9. The cleaning system of claim 7 , wherein the transducer generates vibrations at ultrasonic or megasonic frequencies. 10. A cleaning system, comprising: an outer basin; a liner disposed within the outer basin for maintaining fluid; a circulation system coupled to the liner for circulating the fluid therein; a first liquid particle counter inline with the circulation system; a filter inline with the first liquid particle counter; a second liquid particle counter offline from the circulation system; and a controller configured to control flow of the fluid in the cleaning system, wherein the controller is configured to cause the first liquid particle counter to perform inline measurements while flowing fluid through the circulation system and to cause the second liquid particle counter to perform offline measurements while not flowing fluid through the circulation system. 11. The cleaning system of claim 10 , wherein the first and second liquid particle counters are connected to different pumps. 12. The cleaning system of claim 10 , further comprising a support positioned between the outer basin and the liner for supporting the liner. 13. The cleaning system of claim 10 , further comprising a pump that delivers fluid from an interior of the liner to the second liquid particle counter. 14. The cleaning system of claim 10 , wherein the liner comprises polypropylene, polyethylene, or polyvinyl difluoride. 15. The cleaning system of claim 10 , wherein the outer basin comprises stainless steel. 16. The cleaning system of claim 10 , wherein the outer basin comprises a coated metal. 17. The cleaning system of claim 16 , wherein the coated metal is aluminum coated with ethylene tetrafluoroethylene. 18. The cleaning system of claim 10 , further comprising a transducer positioned between the outer basin and the liner for agitating solutions contained with the outer basin and the liner. 19. The cleaning system of claim 10 , further comprising: a transducer positioned outside the outer basin and the liner for agitating solutions contained with the outer basin and the liner, the transducer positioned beneath a bottom of the outer basin; and one or more additional transducers coupled to vertical walls of the outer basin. 20. A cleaning system, comprising: an outer basin comprising stainless steel; a liner disposed within the outer basin for maintaining fluid, the liner comprising polypropylene, polyethylene, or polyvinyl difluoride; a circulation system coupled to the liner for circulating the fluid therein, the circulation system comprising a first pump and a filter for removing particles from the fluid; a liquid particle counter in fluid communication with an interior of the liner; a second pump disposed upstream of the liquid particle counter to move fluid from the interior of the liner through the liquid particle counter; and a controller configured to control flow of the fluid in the cleaning system, wherein the liquid particle counter is offline from the circulation system, and the controller is configured to cause the liquid particle counter to perform inline measurements while flowing fluid through the circulation system and offline measurements while not flowing fluid through the circulation system.
comprising acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection or in-situ thickness measurement · CPC title
Process monitoring, e.g. flow or thickness monitoring · CPC title
with the semiconductor substrates being dipped in baths or vessels · CPC title
by sonic or ultrasonic vibrations · CPC title
Cleaning by methods involving the use or presence of liquid or steam (B08B9/00 takes precedence) · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.