Insulating inductor conductors with air gap using energy evaporation material (EEM)

Patent metadata

Field	Value
Publication number	US-10453605-B2
Application number	US-201715729992-A
Country	US
Kind code	B2
Filing date	Oct 11, 2017
Priority date	Oct 11, 2017
Publication date	Oct 22, 2019
Grant date	Oct 22, 2019

Abstract

A first layer on a substrate includes an insulator material portion adjacent an energy-reactive material portion. The energy-reactive material portion evaporates upon application of energy during manufacturing. Processing patterns the first layer to include recesses extending to the substrate in at least the energy-reactive material portion. The recesses are filled with a conductor material, and a porous material layer is formed on the first layer and on the conductor material. Energy is applied to the porous material layer to: cause the energy to pass through the porous material layer and reach the energy-reactive material portion; cause the energy-reactive material portion to evaporate; and fully remove the energy-reactive material portion from an area between the substrate and the porous material layer, and this leaves a void between the substrate and the porous material layer and adjacent to the conductor material.

First claim

What is claimed is:

1. A method comprising:
forming a first layer on a substrate to include an insulator material portion adjacent an energy-reactive material portion, wherein the energy-reactive material portion evaporates upon application of energy during manufacturing;
patterning the first layer to include recesses extending to the substrate in at least the energy-reactive material portion;
filling the recesses with a conductor material extending from the substrate to a top of the insulator material portion;
forming a porous material layer on the first layer and on the conductor material; and
applying energy to the porous material layer to: cause the energy to pass through the porous material layer and reach the energy-reactive material portion; cause the energy-reactive material portion to evaporate; and fully remove the energy-reactive material portion from an area between the substrate and the porous material layer and leave a void between the substrate and the porous material layer and adjacent to the conductor material, wherein the void is the same height between the substrate and the porous material layer as the conductor material.

2. The method according to claim 1 , wherein the energy-reactive material portion comprises an energy evaporation material (EEM) comprising a carbon-based compound or silicon-based CxHy compound.

3. The method according to claim 1 , wherein the applying energy comprises applying light energy through pores of the porous material layer while simultaneously applying heat to the substrate and the porous material layer.

4. The method according to claim 1 , further comprising forming an insulator layer on the porous material layer to cap pores of the porous material layer to seal the void.

5. The method according to claim 1 , further comprising forming a liner along the recesses before the filling of the recesses with the conductor material.

6. The method according to claim 1 , wherein the porous material layer comprises at least one of an oxide layer and a nitride layer treated to have pores.

7. The method according to claim 1 , wherein a process of forming the first layer comprises:
supplying the first layer comprising the insulator material portion;
patterning the first layer to create openings for the energy-reactive material portion; and
depositing the energy-reactive material portion in the openings.

8. A method comprising:
forming a first layer on a substrate to include an insulator material portion adjacent an ultraviolet light-reactive material portion, wherein the ultraviolet light-reactive material portion evaporates upon application of ultraviolet light during manufacturing;
patterning the first layer to include recesses extending to the substrate in the insulator material portion and the ultraviolet light-reactive material portion;
filling the recesses with a conductor material extending from the substrate to a top of the insulator material portion, wherein the patterning shapes the recesses to form an inductor structure in the ultraviolet light-reactive material portion and to form electrical connectors separate from the inductor structure in the insulator material portion;
forming a porous material layer on the first layer and on the conductor material; and
applying ultraviolet light to the porous material layer to:
cause the ultraviolet light to pass through the porous material layer and reach the ultraviolet light-reactive material portion; and
cause the ultraviolet light-reactive material portion to evaporate, fully removing the ultraviolet light-reactive material portion from an area between the substrate and the porous material layer and leaving a void between the substrate and the porous material layer and adjacent to the inductor structure,

wherein the void is the same height between the substrate and the porous material layer as the inductor structure, and
wherein the insulator material portion and the conductor material provide mechanical support for the void.

9. The method according to claim 8 , wherein the ultraviolet light-reactive material portion comprises an ultraviolet light evaporation material (EEM) comprising a carbon-based compound or silicon-based CxHy compound.

10. The method according to claim 8 , wherein the applying ultraviolet light comprises applying light ultraviolet light through pores of the porous material layer while simultaneously applying heat to the substrate and the porous material layer.

11. The method according to claim 8 , further comprising forming an insulator layer on the porous material layer to cap pores of the porous material layer to seal the void.

12. The method according to claim 8 , further comprising forming a liner along the recesses before the filling of the recesses with the conductor material.

13. The method according to claim 8 , wherein the porous material layer comprises at least one of an oxide layer and a nitride layer treated to have pores.

14. The method according to claim 8 , wherein a process of forming the first layer comprises:
supplying the first layer comprising the insulator material portion;
patterning the first layer to create openings for the ultraviolet light-reactive material portion; and
depositing the ultraviolet light-reactive material portion in the openings.

Assignees

• Globalfoundries Inc

Inventors

• Singh Sunil K
• Singh Jagar

Classifications

• H01F5/003

  Printed circuit coils · CPC title

• H01F5/06

  Insulation of windings · CPC title

• H01F41/042

  by thin film techniques · CPC title

• H01F2017/0073

  with a special conductive pattern, e.g. flat spiral · CPC title

• H01F2005/006

  with conical spiral form · CPC title