Wiring device for wiring an electronic apparatus
US-9661775-B2 · May 23, 2017 · US
Sensor with symmetrically embedded sensor elements
US10451646B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10451646-B2 |
| Application number | US-201615540791-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 26, 2016 |
| Priority date | Jan 28, 2015 |
| Publication date | Oct 22, 2019 |
| Grant date | Oct 22, 2019 |
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- Title
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Abstract
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A sensor for detecting a physical variable, including: —a sensor element for outputting an electrical signal dependent on the physical variable, —a substrate carrying the sensor element, —a printed circuit board, conducting the electrical signal, on the substrate, and —an embedding compound, in which the sensor element is completely embedded and the printed circuit board is at least partly embedded, —wherein at least one compensation element is embodied in the embedding compound, by which compensation element a mechanical stress caused by an element of the sensor at least partly embedded in the embedding compound is counteracted.
First claim
Opening claim text (preview).
The invention claimed is: 1. A sensor for detecting a physical variable, comprising: a sensor element for outputting an electrical signal dependent on the physical variable, a substrate supporting the sensor element, a conductor track conducting the electrical signal on the substrate, and an embedding compound, in which the sensor element is completely embedded and the conductor track is at least partially embedded, wherein at least one compensation element is at least partially embedded in the embedding compound, by which compensation element a mechanical stress induced by an element of the sensor at least partially embedded in the embedding compound is counteracted, the at least one compensation element comprising an electrical component which differs from the sensor element. 2. The sensor as claimed in claim 1 , wherein the compensation element and the element of the sensor which causes the mechanical stress are arranged symmetrically. 3. The sensor as claimed in claim 2 , wherein the compensation element is made of a different material from the embedding compound. 4. The sensor as claimed in claim 1 , wherein the compensation element is made of a different material from the embedding compound. 5. The sensor as claimed in claim 1 , wherein the element of the sensor at least partially embedded in the embedding compound comprises the sensor element. 6. The sensor as claimed in claim 1 , wherein the electrical component that differs from the sensor element is a filter element or a signal processing circuit. 7. A control device for a vehicle for controlling a behavior of the vehicle based on a detected physical variable, comprising a sensor as claimed in claim 1 , for detecting the physical variable. 8. The sensor as claimed in claim 1 , wherein an electrical contact between the conductor track and the sensor element is different from an electrical contact of the compensation element with the conductor track or with another conductor track. 9. A sensor for detecting a physical variable, comprising: a sensor element for outputting an electrical signal dependent on the physical variable, a substrate supporting the sensor element, a conductor track conducting the electrical signal on the substrate, and an embedding compound, in which the sensor element is completely embedded and the conductor track is at least partially embedded, wherein at least one compensation element is provided, by which compensation element a mechanical stress induced by an element of the sensor at least partially embedded in the embedding compound is counteracted, and wherein an electrical contact between the conductor track and the sensor element is different from an electrical contact of the compensation element with the conductor track or with another conductor track. 10. The sensor as claimed in claim 9 , wherein the electrical contacts differ in their size. 11. The sensor as claimed in claim 10 , wherein the size difference is designed in such a way that the mechanical stress is further reduced.
Assignees
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Classifications
between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title
between laterally-adjacent chips · CPC title
the micromechanical device and the control or processing electronics being separate parts in the same package · CPC title
between other parts not provided for in B81B7/0048 - B81B7/0051 · CPC title
- G01D11/245Primary
Housings for sensors · CPC title
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Frequently asked questions
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- What does patent US10451646B2 cover?
- A sensor for detecting a physical variable, including: —a sensor element for outputting an electrical signal dependent on the physical variable, —a substrate carrying the sensor element, —a printed circuit board, conducting the electrical signal, on the substrate, and —an embedding compound, in which the sensor element is completely embedded and the printed circuit board is at least partly embe…
- Who is the assignee on this patent?
- Continental Teves Ag & Co Ohg
- What technology area does this patent fall under?
- Primary CPC classification G01D11/245. Mapped technology areas include Physics.
- When was this patent published?
- Publication date Tue Oct 22 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 7 related publications on this page (citations in our corpus or others sharing the same primary CPC).