System for treating solution for use in electroplating application and method for treating solution for use in electroplating application

Patent metadata

Field	Value
Publication number	US-10450667-B2
Application number	US-201414524677-A
Country	US
Kind code	B2
Filing date	Oct 27, 2014
Priority date	Oct 27, 2014
Publication date	Oct 22, 2019
Grant date	Oct 22, 2019

Abstract

Electroplating techniques including a system for treating a solution for use in an electroplating application and a method for using the system are provided. The system can have: a gas dispersing portion configured to treat the solution by dispersing a gas into the solution to control a concentration of a predetermined cation of a metal to be electroplated in the electroplating application; a filter portion configured to treat the solution by filtering the solution to remove a quantity of metal residue; and a circulation mechanism configured to divert the solution to one of a plating tool and a combination of the gas dispersing portion and the filter portion based on a result of an analysis of the solution.

First claim

What is claimed is:

1. A system for treating a solution for use in an electroplating application, the system comprising:
a gas dispersing portion configured to treat the solution by dispersing a gas into the solution to control a concentration of a predetermined cation of a metal to be electroplated in the electroplating application, wherein the solution flows into the gas dispersing portion through an inlet of the gas dispersing portion and out of the gas dispersing portion through an outlet of the gas dispersing portion;
a filter portion configured to treat the solution by filtering the solution to remove a quantity of a metal residue, wherein the filter portion is provided upstream of the gas dispersing portion in the flow direction of the solution and in direct fluid communication with the inlet of the gas dispersing portion;
a circulation mechanism configured to divert the solution to one of a plating tool and a combination of the gas dispersing portion and the filter portion based on a result of an analysis of the solution, wherein the circulation mechanism is provided downstream of the gas dispersing portion and upstream of the filter portion in the flow direction of the solution;
a degasser configured to remove a quantity of gas bubbles dispersed in the solution by the gas dispersing portion, wherein the degasser is provided downstream of the gas dispersing portion in the flow direction of the solution and comprises an inlet and an outlet; and
an analysis device configured to perform the analysis of the solution, wherein the analysis device is provided downstream of the degasser and upstream of the circulation mechanism in the flow direction of the solution and wherein the analysis device is in direct fluid communication with the outlet of the degasser.

2. The system according to claim 1 ,
wherein the metal to be electroplated in the electroplating application is copper (Cu), and
wherein the gas dispersing portion is configured to treat the solution by dispersing oxygen into the solution to oxidize Cu(I) to Cu(II) to control a concentration of Cu(I) in the solution.

3. The system according to claim 2 ,
wherein the circulation mechanism is configured to divert the solution to the plating tool based on a first result of the analysis of the solution, the first result indicating that the concentration of Cu(I) is at or below a predetermined concentration, and
wherein the circulation mechanism is configured to divert the solution to the combination of the gas dispersing portion and the filter portion for treatment based on a second result of the analysis of the solution, the second result indicating that the concentration of Cu(I) is above the predetermined concentration.

4. The system according to claim 1 ,
wherein the metal to be electroplated in the electroplating application is tin (Sn), and
wherein the gas dispersing portion is configured to treat the solution by dispersing an inert gas into the solution to displace oxygen that is dissolved or dispersed in the solution to prevent the oxidation of Sn(II) to Sn(IV) to control the concentration of Sn(IV) in the solution.

5. The system according to claim 4 ,
wherein the circulation mechanism is configured to divert the solution to the plating tool based on a first result of the analysis of the solution, the first result indicating that the concentration of Sn(IV) is at or below a predetermined concentration, and
wherein the circulation mechanism is configured to divert the solution to the combination of the gas dispersing portion and the filter portion for treatment based on a second result of the analysis of the solution, the second result indicating that the concentration of Sn(IV) is above the predetermined concentration.

6. The system according to claim 4 , wherein the filter portion is configured to treat the solution by filtering the solution to remove a quantity of Sn(IV) oxide.

7. The system according to claim 4 , further comprising a mesh portion of unoxidized tin, wherein the mesh portion has a high surface area through which the solution is passed such that the Sn(IV) reacts with the unoxidized tin to form Sn(II).

8. The system according to claim 1 , wherein the gas dispersing portion comprises:
a reservoir configured to hold the solution; and
a disperser configured to disperse the gas from a gas source into the solution held in the reservoir.

9. The system according to claim 8 , wherein the gas dispersing portion further comprises a heat injector configured to heat the solution prior to, during, or both the dispersing of the gas into the solution.

10. The system according to claim 1 ,
wherein the solution is an electroplating solution used in the electroplating application in the plating tool,
wherein the electroplating solution comprises an organic additive, and
wherein the system further comprises a carbon treatment portion for removing a quantity of the organic additives from the electroplating solution.

11. The system of claim 1 , wherein the circulation mechanism is configured to divert the solution to one of the plating tool and the combination of the gas dispersing portion and the filter portion based on the result of the analysis of the solution performed by the analysis device.

12. A plating apparatus comprising:
the system according to claim 1 ; and
the plating tool.

13. The system according to claim 1 , wherein the solution for use in the electroplating application is a metal concentrate.

14. The system according to claim 1 , further comprising a controller configured to:
receive the result of the analysis of the solution, and
control the circulation mechanism to divert the solution to one of the plating tool and the combination of the gas dispersing portion and the filter portion based on the result of the analysis of the solution.

Assignees

• IBM

Inventors

• Arvin Charles L
• Biggs Glen N
• Palmatier Phillip W
• Sorbello Joseph C
• Tong Tracy A
• Torres Freddie

Classifications

• C25D21/14

  Controlled addition of electrolyte components · CPC title

• C25D21/06

  Filtering {particles other than ions (filtering ions C25D21/22)} · CPC title

• C25D3/38

  of copper · CPC title

• C25D3/30

  of tin · CPC title

• C25D21/18 Primary

  of electrolytes (C25D21/22 takes precedence) · CPC title