System for treating solution for use in electroplating application and method for treating solution for use in electroplating application

Patent metadata

Field	Value
Publication number	US-2016115618-A1
Application number	US-201414524677-A
Country	US
Kind code	A1
Filing date	Oct 27, 2014
Priority date	Oct 27, 2014
Publication date	Apr 28, 2016
Grant date	—

Abstract

Electroplating techniques including a system for treating a solution for use in an electroplating application and a method for using the system are provided. The system can have: a gas dispersing portion configured to treat the solution by dispersing a gas into the solution to control a concentration of a predetermined cation of a metal to be electroplated in the electroplating application; a filter portion configured to treat the solution by filtering the solution to remove a quantity of metal residue; and a circulation mechanism configured to divert the solution to one of a plating tool and a combination of the gas dispersing portion and the filter portion based on a result of an analysis of the solution.

First claim

What is claimed is:

1 . A system for treating a solution for use in an electroplating application, the system comprising:
a gas dispersing portion configured to treat the solution by dispersing a gas into the solution to control a concentration of a predetermined cation of a metal to be electroplated in the electroplating application; a filter portion configured to treat the solution by filtering the solution to remove a quantity of a metal residue; and a circulation mechanism configured to divert the solution to one of a plating tool and a combination of the gas dispersing portion and the filter portion based on a result of an analysis of the solution.

2 . The system according to claim 1 ,
wherein the metal to be electroplated in the electroplating application is copper (Cu), and wherein the gas dispersing portion is configured to treat the solution by dispersing oxygen into the solution to oxidize Cu(I) to Cu(II) to control a concentration of Cu(I) in the solution.

3 . The system according to claim 2 ,
wherein the circulation mechanism is configured to divert the solution to the plating tool based on a first result of the analysis of the solution, the first result indicating that the concentration of Cu(I) is at or below a predetermined concentration, and wherein the circulation mechanism is configured to divert the solution to the combination of the gas dispersing portion and the filter portion for treatment based on a second result of the analysis of the solution, the second result indicating that the concentration of Cu(I) is above the predetermined concentration.

4 . The system according to claim 1 ,
wherein the metal to be electroplated in the electroplating application is tin (Sn), and wherein the gas dispersing portion is configured to treat the solution by dispersing an inert gas into the solution to displace oxygen that is dissolved or dispersed in the solution to prevent the oxidation of Sn(II) to Sn(IV) to control the concentration of Sn(IV) in the solution.

5 . The system according to claim 4 ,
wherein the circulation mechanism is configured to divert the solution to the plating tool based on a first result of the analysis of the solution, the first result indicating that the concentration of Sn(IV) is at or below a predetermined concentration, and wherein the circulation mechanism is configured to divert the solution to the combination of the gas dispersing portion and the filter portion for treatment based on a second result of the analysis of the solution, the second result indicating that the concentration of Sn(IV) is above the predetermined concentration.

6 . The system according to claim 4 , wherein the filter portion is configured to treat the solution by filtering the solution to remove a quantity of Sn(IV) oxide.

7 . The system according to claim 4 , further comprising a mesh portion of unoxidized tin, wherein the mesh portion has a high surface area through which the solution is passed such that the Sn(IV) reacts with the unoxidized tin to form Sn(II).

8 . The system according to claim 1 , wherein the gas dispersing portion comprises:
a reservoir configured to hold the solution; and a disperser configured to disperse the gas from a gas source into the solution held in the reservoir.

9 . The system according to claim 8 , wherein the gas dispersing portion further comprises a heat injector configured to heat the solution prior to, during, or both the dispersing of the gas into the solution.

10 . The system according to claim 8 , further comprising a degasser configured to remove a quantity of gas bubbles dispersed in the solution by the disperser.

11 . The system according to claim 1 ,
wherein the solution is an electroplating solution used in the electroplating application in the plating tool, wherein the electroplating solution comprises an organic additive, and wherein the system further comprises a carbon treatment portion for removing a quantity of the organic additives from the electroplating solution.

12 . An analysis apparatus comprising:
the system according to claim 1 ; and an analysis device configured to perform the analysis of the solution, wherein the circulation mechanism is configured to divert the solution to one of the plating tool and the combination of the gas dispersing portion and the filter portion based on the result of the analysis of the solution performed by the analysis device.

13 . A plating apparatus comprising:
the system according to claim 1 ; and the plating tool.

14 . The system according to claim 1 , wherein the solution for use in the electroplating application is a metal concentrate.

15 . The system according to claim 1 , further comprising a controller configured to:
receive the result of the analysis of the solution, and control the circulation mechanism to divert the solution to one of the plating tool and the combination of the gas dispersing portion and the filter portion based on the result of the analysis of the solution.

16 . A method for treating a solution for use in an electroplating application, the method comprising:
operating a gas dispersing portion to treat the solution by dispersing a gas into the solution to control a concentration of a predetermined cation of a metal to be electroplated in the electroplating application; operating a filter portion to treat the solution by filtering the solution to remove a quantity of a metal residue; and operating a circulation mechanism to divert the solution to one of a plating tool and a combination of the gas dispersing portion and the filter portion based on a result of an analysis of the solution.

17 . The method according to claim 16 ,
wherein the metal to be electroplated in the electroplating application is copper (Cu), and wherein the step of operating the gas dispersing portion comprises treating the solution by dispersing oxygen into the solution to oxidize Cu(I) to Cu(II) to control the concentration of Cu(I) in the solution.

18 . The method according to claim 17 ,
wherein the step of operating the circulating mechanism comprises diverting the solution to the plating tool based on a first result of the analysis of the solution, the first result indicating that the concentration of Cu(I) is at or below a predetermined concentration, and wherein the step of operating the circulating mechanism further comprises diverting the solution to the combination of the gas dispersing portion and the filter portion for treatment based on a second result of the analysis of the solution, the second result indicating that the concentration of Cu(I) is above the predetermined concentration.

19 . The method according to claim 16 ,
wherein the metal to be electroplated in the electroplating application is tin (Sn), and wherein the step of operating the gas dispersing portion comprises treating the solution by dispersing an inert gas into the solution to displace oxygen that is dissolved or dispersed in the solution to prevent the oxidation of Sn(II) to Sn(IV) to control the concentration of Sn(IV) in the solution.

20 . The method according to claim 19 ,
wherein the step of operating the circulation mechanism comprises diverting the solution to the plating tool based on a first result of the analysis of the solution, the first result indicating that the concentration of Sn(IV) is at or below a predetermined concentration, and wherein the step of operating the circulation mechanism further comprises diverting the solution

Assignees

• IBM

Inventors

• Arvin Charles L
• Biggs Glen N
• Palmatier Phillip W
• Sorbello Joseph C
• Tong Tracy A
• Torres Freddie

Classifications

• C25D3/30

  of tin · CPC title

• C25D3/38

  of copper · CPC title

• C25D21/06

  Filtering {particles other than ions (filtering ions C25D21/22)} · CPC title

• C25D21/14

  Controlled addition of electrolyte components · CPC title

• C25D21/18 Primary

  of electrolytes (C25D21/22 takes precedence) · CPC title