Material joining

Patent metadata

Field	Value
Publication number	US-10450643-B2
Application number	US-201615209550-A
Country	US
Kind code	B2
Filing date	Jul 13, 2016
Priority date	Jul 13, 2016
Publication date	Oct 22, 2019
Grant date	Oct 22, 2019

Abstract

A method of joining includes bringing a bulk metallic glass (BMG) material to a temperature lower than the crystallization temperature of the BMG material and depositing the BMG material onto a first substrate with interlock surface features such that the BMG material interlocks with the interlock surface features of the substrate. The method includes joining a second substrate to the BMG material, wherein the second substrate includes interlock surface features such that the BMG material interlocks with the interlock surface features of both the first and second substrates, joining the first and second substrates together to produce a fully amorphous joint between the first and second substrates.

First claim

What is claimed is:

1. A method of joining comprising:
bringing a bulk metallic glass (BMG) material to a temperature lower than the crystallization temperature of the BMG material;
depositing the BMG material onto a first substrate with interlock surface features such that the BMG material interlocks with the interlock surface features of the substrate; and
joining a second substrate to the BMG material, wherein the second substrate includes interlock surface features such that the BMG material interlocks with the interlock surface features of both the first and second substrates, joining the first and second substrates together to produce a fully amorphous joint between the first and second substrates, further comprising forming the interlock surface features on a surface of at least one of the first or second substrates, wherein forming the interlock surface features includes forming interlock surface features with receptacles for BMG material that narrow in a direction going deeper within the substrate, wherein forming the interlock surface features includes forming interlock surface features with receptacles for BMG material that form a repeating pattern of substantially identical triangular receptacles with triangular cross-sections in side elevation.

2. The method as recited in claim 1 , wherein depositing the BMG material includes at least one of thermoplastic forming, rolling, compression molding, hot pressing, autoclaving, thermal spraying, or cold spraying the BMG material onto the substrate such that the BMG material interlocks with the interlocking surface features of the substrate.

3. The method as recited in claim 1 , wherein bringing the BMG material to a temperature lower than the crystallization temperature of the BMG material includes bringing a BMG material to a temperature greater than or equal to the glass transition temperature of the BMG material and lower than the crystallization temperature of the BMG material.

4. The method as recited in claim 1 , further comprising depositing a portion of the BMG material onto the second substrate such that the portion of the BMG material interlocks with the interlock surface features of the second substrate prior to joining the first and second substrates, wherein joining the first and second substrates includes forming a BMG to BMG bond between the portion of the BMG material deposited on the second substrate, and the BMG material deposited on the first substrate.

5. A method of joining comprising:
bringing a bulk metallic glass BMG material to a temperature lower than the crystallization temperature of the BMG material;
depositing the BMG material onto a first substrate with interlock surface features such that the BMG material interlocks with the interlock surface features of the substrate; and
joining a second substrate to the BMG material, wherein the second substrate includes interlock surface features such that the BMG material interlocks with the interlock surface features of both the first and second substrates, joining the first and second substrates together to produce a fully amorphous joint between the first and second substrates, further comprising forming the interlock surface features on a surface of at least one of the first or second substrates, wherein forming the interlock surface features includes forming interlock surface features with receptacles for BMG material that narrow in a direction going deeper within the substrate, wherein forming the interlock surface features includes forming interlock surface features with receptacles for BMG material that form an alternating pattern of two sets of receptacles with differently oriented triangular cross-sections in side elevation pointed in opposite directions from each other.

6. A method of joining comprising:
bringing a bulk metallic glass (BMG) material to a temperature lower than the crystallization temperature of the BMG material;
depositing the BMG material onto a first substrate with interlock surface features such that the BMG material interlocks with the interlock surface features of the substrate; and
joining a second substrate to the BMG material, wherein the second substrate includes interlock surface features such that the BMG material interlocks with the interlock surface features of both the first and second substrates, joining the first and second substrates together to produce a fully amorphous joint between the first and second substrates, further comprising forming the interlock surface features on a surface of at least one of the first or second substrates, wherein forming the interlock surface features includes forming interlock surface features with receptacles for BMG material that narrow in a direction going deeper within the substrate, wherein forming the interlock surface features includes forming interlock surface features with receptacles for BMG material that form a repeating pattern of substantially identical receptacles with truncated triangular teeth cross-sections in side elevation separating each respective adjacent pair of the receptacles.

Assignees

• Hamilton Sundstrand Corp

Inventors

• Magdefrau Neal
• Sheedy Paul
• Tulyani Sonia

Classifications

• C23C24/08

  by application of heat or pressure and heat (C23C24/04 takes precedence) · CPC title

• C23C14/568

  Transferring the substrates through a series of coating stations (C23C14/562 takes precedence) · CPC title

• C23C4/18

  After-treatment · CPC title

• B23K20/16

  with interposition of special material to facilitate connection of the parts, e.g. material for absorbing or producing gas · CPC title

• C23C24/04

  Impact or kinetic deposition of particles · CPC title