Wedge bonding tools, wedge bonding systems, and related methods

Patent metadata

Field	Value
Publication number	US-10449627-B2
Application number	US-201815924056-A
Country	US
Kind code	B2
Filing date	Mar 16, 2018
Priority date	Jan 26, 2016
Publication date	Oct 22, 2019
Grant date	Oct 22, 2019

Abstract

A wedge bonding tool including a body portion including a tip portion is provided. The tip portion includes a working surface configured to contact a wire material during formation of a wedge bond. A plurality of notches are defined by one or more surfaces of the body portion.

First claim

What is claimed:

1. A wedge bonding tool comprising:
a body portion including a tip portion, the tip portion including a working surface configured to contact a wire material during formation of a wedge bond,
wherein a plurality of notches are defined by one or more surfaces of the body portion away from the tip portion, wherein each of the plurality of notches is provided coincident with an anti-node of the wedge bonding tool.

2. The wedge bonding tool of claim 1 wherein the plurality of notches are provided on each of a first side and a second side of the body portion.

3. The wedge bonding tool of claim 1 wherein the plurality of notches are provided on opposite sides of the body portion.

4. The wedge bonding tool of claim 1 wherein each of the plurality of notches are provided opposite another of the plurality of notches.

5. The wedge bonding tool of claim 1 wherein a depth of each of the plurality of notches is in a range between 5-30 mils.

6. The wedge bonding tool of claim 1 wherein a width of each of the plurality of notches is in a range between 5-30 mils.

7. The wedge bonding tool of claim 1 wherein each of the plurality of notches extends in a linear direction.

8. The wedge bonding tool of claim 1 wherein each of the plurality of notches is provided coincident with the anti-node of the wedge bonding tool in an off-axis direction.

9. The wedge bonding tool of claim 1 wherein the tip portion of the wedge bonding tool is configured to scrub in a direction from a front of the wedge bonding tool to a back of the wedge bonding tool, and wherein the plurality of notches are provided along side surfaces between the front and the back of the wedge bonding tool.

10. The wedge bonding tool of claim 1 wherein the plurality of notches include at least three pairs of notches, each of the pairs of notches including a notch opposite another notch on opposite sides of the body portion.

11. A wedge bonding system comprising:
an ultrasonic transducer;
a wedge bonding tool carried by the ultrasonic transducer, the wedge bonding tool including a body portion having a tip portion, the tip portion including a working surface configured to contact a wire material during formation of a wedge bond, a plurality of notches being defined by one or more surfaces of the body portion away from the tip portion, wherein each of the plurality of notches is provided coincident with an anti-node of the wedge bonding tool; and
a support structure configured to support a workpiece during formation of the wedge bond on the workpiece.

12. The wedge bonding system of claim 11 wherein the plurality of notches are provided on each of a first side and a second side of the body portion.

13. The wedge bonding system of claim 11 wherein the plurality of notches are provided on opposite sides of the body portion.

14. The wedge bonding system of claim 11 wherein each of the plurality of notches is provided coincident with the anti-node of the wedge bonding tool in an off-axis direction.

15. The wedge bonding system of claim 11 wherein the tip portion of the wedge bonding tool is configured to scrub in a direction from a front of the wedge bonding tool to a back of the wedge bonding tool, and wherein the plurality of notches are provided are provided along side surfaces between the front and the back of the wedge bonding tool.

16. A method of providing a wedge bonding tool, the method comprising the steps of:
(a) determine a location of at least one anti-node of a wedge bonding tool away from a tip portion direction of the wedge bonding tool; and
(b) forming a plurality of notches in a surface of the wedge bonding tool at the at least one anti-node.

17. The method of claim 16 wherein step (a) includes modeling the wedge bonding tool to determine the location of the at least one anti-node of the wedge bonding tool.

18. The method of claim 16 wherein step (a) includes taking vibration measurements to determine the location of the at least one anti-node of the wedge bonding tool.

19. The method of claim 16 wherein step (b) includes forming a plurality of notches in the surface of the wedge bonding tool, wherein a portion of the plurality of notches are provided on each of a first side and a second side of a body portion of the wedge bonding tool.

20. The method of claim 16 wherein step (b) includes forming a plurality of notches in the surface of the wedge bonding tool, wherein the plurality of notches includes a plurality of pairs of notches, wherein each of the pairs of notches being provided on opposite sides of a body portion of the wedge bonding tool.

Assignees

• Kulicke & Soffa Ind Inc

Inventors

• Deangelis Dominick A

Classifications

• H10W72/07141

  Means for applying energy, e.g. ovens or lasers · CPC title

• H10W72/534

  being rectangular · CPC title

• B23K20/106 Primary

  Features related to sonotrodes · CPC title

• B23K20/005 Primary

  Capillary welding · CPC title

• B23K20/004

  Wire welding · CPC title