On-chip coplanar waveguide having a shielding layer comprising a capacitor formed by sets of interdigitated fingers

Patent metadata

Field	Value
Publication number	US-10446898-B2
Application number	US-201715687129-A
Country	US
Kind code	B2
Filing date	Aug 25, 2017
Priority date	Jun 29, 2017
Publication date	Oct 15, 2019
Grant date	Oct 15, 2019

Abstract

A coplanar waveguide may include a first transmission line extending between a first ground plane and a second ground plane at a first interconnect level. The coplanar waveguide may further include a shielding layer at a second interconnect level. The shielding layer may include a first set of conductive fingers coupled to the first ground plane. The first set of conductive fingers may be interdigitated with a second set of conductive fingers that are coupled to the second ground plane. Only a dielectric layer may be between the first set of conductive interdigitated fingers and the second set of conductive interdigitated fingers. The first ground plane, the second ground plane, the dielectric layer, and the shielding layer may form a capacitor.

First claim

What is claimed is:

1. A coplanar waveguide comprising:
a first signal transmission line extending in a direction parallel to and between a first ground plane and a second ground plane at a first interconnect level; and
a shielding layer at a second interconnect level below the first interconnect level, the shielding layer comprising a first set of conductive fingers oriented orthogonal to the first ground plane and interdigitated with a second set of conductive fingers oriented orthogonal to the second ground plane, and only a dielectric layer between the first set of conductive interdigitated fingers and the second set of conductive interdigitated fingers, the first ground plane, the second ground plane, the dielectric layer, and the shielding layer comprising a capacitor, in which the first set of conductive fingers and the second set of conductive fingers of the shielding layer comprise polysilicon traces.

2. The coplanar waveguide of claim 1 , integrated into a mobile phone, a set top box, a music player, a video player, an entertainment unit, a navigation device, a computer, a hand-held personal communication systems (PCS) unit, a portable data unit, and/or a fixed location data unit.

3. The coplanar waveguide of claim 1 , further comprising a second signal transmission line between the first signal transmission line and one of the first ground plane and the second ground plane.

4. The coplanar waveguide of claim 1 , in which the coplanar waveguide is on-chip or on a printed circuit board (PCB).

5. The coplanar waveguide of claim 1 , in which the first set of conductive fingers are coupled to the first ground plane through a first set of vias, and the second set of conductive fingers are coupled to the second ground plane through a second set of vias.

6. The coplanar waveguide of claim 1 , in which the capacitor comprises a metal-oxide-metal (MOM) capacitor.

7. A method for fabricating a coplanar waveguide, comprising:
fabricating a first signal transmission line extending in a direction parallel to and between a first ground plane and a second ground plane at a first interconnect level;
fabricating a first set of shield layer fingers interdigitated with a second set of shield layer fingers at a second interconnect level below the first interconnect level, with only a dielectric layer between the first set of shield layer fingers and the second set of shield layer fingers, in which the first set of shield layer fingers and the second set of shield layer fingers are fabricated by depositing polysilicon traces;
electrically coupling the first set of shield layer fingers oriented orthogonal to the first ground plane with a first set of vias; and
electrically coupling the second set of shield layer fingers oriented orthogonal to the second ground plane with a second set of vias.

8. The method of claim 7 , further comprising fabricating a second signal transmission line between the first signal transmission line and one of the first ground plane and the second ground plane.

9. The method of claim 7 , in which the coplanar waveguide is integrated into a mobile phone, a set top box, a music player, a video player, an entertainment unit, a navigation device, a computer, a hand-held personal communication systems (PCS) unit, a portable data unit, and/or a fixed location data unit.

10. A coplanar waveguide comprising:
first means for signal transmission, extending in a direction parallel to and between a first ground plane and a second ground plane at a first interconnect level; and
a shielding layer at a second interconnect level below the first interconnect level, the shielding layer comprising a first set of conductive fingers oriented orthogonal to the first ground plane and interdigitated with a second set of conductive fingers oriented orthogonal to the second ground plane, and only a dielectric layer between the first set of conductive interdigitated fingers and the second set of conductive interdigitated fingers, the first ground plane, the second ground plane, the dielectric layer, and the shielding layer comprising a capacitor, in which the first set of conductive fingers and the second set of conductive fingers of the shielding layer comprise polysilicon traces.

11. The coplanar waveguide of claim 10 , integrated into a mobile phone, a set top box, a music player, a video player, an entertainment unit, a navigation device, a computer, a hand-held personal communication systems (PCS) unit, a portable data unit, and/or a fixed location data unit.

12. The coplanar waveguide of claim 10 , in which the capacitor comprises a metal-oxide-metal (MOM) capacitor.

13. The coplanar waveguide of claim 10 , in which the first set of conductive fingers are coupled to the first ground plane through a first set of vias, and the second set of conductive fingers are coupled to the second ground plane through a second set of vias.

14. The coplanar waveguide of claim 10 , further comprising second means for signal transmission in a direction parallel to and between the first signal transmission means and one of the first ground plane and the second ground plane.

15. The coplanar waveguide of claim 14 , in which the first signal transmission means and the second signal transmission means transmit differential signals.

16. The coplanar waveguide of claim 10 , in which the coplanar waveguide is on-chip or on a printed circuit board (PCB).

Assignees

• Qualcomm Inc

Inventors

• Cheng Haitao
• Jin Zhang

Classifications

• H01P1/20345

  Multilayer filters · CPC title

• H01P3/006 Primary

  Conductor backed coplanar waveguides · CPC title

• H01P3/026

  Coplanar striplines [CPS] · CPC title

• H01P1/2005

  Electromagnetic photonic bandgaps [EPB], or photonic bandgaps [PBG] · CPC title

• H01P3/003 Primary

  Coplanar lines · CPC title