Compound for forming organic film, composition for forming organic film, method for forming organic film, and patterning process

Patent metadata

Field	Value
Publication number	US-10444628-B2
Application number	US-201615371815-A
Country	US
Kind code	B2
Filing date	Dec 7, 2016
Priority date	Dec 24, 2015
Publication date	Oct 15, 2019
Grant date	Oct 15, 2019

Abstract

A compound for forming an organic film shown by the formula (1A),

R X) m1   (1A)

wherein R represents a single bond or an organic group having 1 to 50 carbon atoms; X represents a group shown by formula (1B); and m1 represents an integer satisfying 2≤m1≤10,

wherein X 2 represents a divalent organic group having 1 to 10 carbon atoms; n1 represents 0 or 1; n2 represents 1 or 2; X 3 represents a group shown by the formula (1C); and n5 represents 0, 1, or 2,

wherein R 10 represents a hydrogen atom or a saturated or unsaturated hydrocarbon group having 1 to 10 carbon atoms, wherein a hydrogen atom of the benzene ring in formula (1C) may be substituted with a methyl group or methoxy group. This compound for forming an organic film can provide organic film composition having good dry etching resistance, heat resistance to 400° C. or higher, high filling and planarizing properties.

First claim

The invention claimed is:

1. A compound for forming an organic film shown by the formula (1A),
R X) m1   (1A)

wherein m1 is 2, 4 or 6; and formula (1A) is at least one selected from the following compounds:

wherein X represents a group shown by at least one selected from the following structures represented by formula (1B):

wherein n1 represents 1; n2 represents 1 or 2; X 3 represents a group shown by the formula (1C); and n5 represents 0, 1, or 2,

wherein R 10 represents a hydrogen atom or a saturated or unsaturated hydrocarbon group having 1 to 10 carbon atoms, in which a hydrogen atom of the benzene ring in the formula (1C) may be substituted with a methyl group or a methoxy group, and
wherein the compound satisfies 1.00≤Mw/Mn≤1.25 where Mw is a weight average molecular weight and Mn is a number average molecular weight measured by gel permeation chromatography in terms of polystyrene.

2. The compound for forming an organic film according to claim 1 , wherein the compound has a molecular weight of 2,500 or less, the molecular weight being calculated on the basis of the formula (1A).

3. A composition for forming an organic film, comprising the compound according to claim 1 and an organic solvent.

4. The composition for forming an organic film according to claim 3 , further comprising either or both of a compound shown by the formula (2A) and a compound shown by the formula (3A),
R X′) m2   (2 A)

wherein R represents a single bond or an organic group having 1 to 50 carbon atoms; X′ represents a group shown by the formula (2B); and m2 represents an integer satisfying 1≤m2≤5,

wherein n3 represents 0 or 1; n4 represents 1 or 2; X 4 represents a group shown by the formula (2C); and n6 represents 0, 1, or 2,

wherein R 11 represents a hydrogen atom or a saturated or unsaturated hydrocarbon group having 1 to 10 carbon atoms, in which a hydrogen atom of the benzene ring in the formula (2C) may be substituted with a methyl group or a methoxy group,

wherein R 101 , R 102 , R 103 , and R 104 independently represent a hydroxyl group; m100 represents 1, 2, or 3; R 100 represents a hydrogen atom or a hydroxyl group when m100 is 1, R 100 represents a single bond or a group shown by the formula (3B) when m100 is 2, and R 100 represents a group shown by the formula (3C) when m100 is 3; a hydrogen atom of the aromatic ring in the formula (3A) may be substituted with a methyl group, a methoxy group, a hydroxymethyl group, or a methoxymethyl group; m101 represents 0 or 1, m102 represents 1 or 2; m103 represents 0 or 1; m104 represents 1 or 2; m105 represents 0 or 1; when m101 is 0, n101 and n102 represent an integer satisfying 0≤n101≤3, 0≤n102≤3, and 1≤n101+n102≤4, and when m101 is 1, n101, n102, n103, and n104 represent an integer satisfying 0≤n101≤2, 0≤n102≤2, 0≤n103≤2,0≤n104≤2, and 2n101+n102+n103+n104≤8,

wherein * represents a bonding site; R 106 and R 107 represent a hydrogen atom or an organic group having 1 to 24 carbon atoms, and R 106 and R 107 may be bonded to form a cyclic structure,

wherein * represents a bonding site; and R 108 represents a hydrogen atom or an organic group having 1 to 15 carbon atoms.

5. The composition for forming an organic film according to claim 3 , wherein the organic solvent is a mixture of one or more organic solvents having a boiling point of lower than 180° C. and one or more organic solvents having a boiling point of 180° C. or higher.

6. A method for forming an organic film that functions as an organic planarizing film used in a semiconductor apparatus manufacturing process, the method comprising: applying the composition for forming an organic film according to claim 3 on a substrate to be processed by spin coating; and heating the substrate, on which the composition has been applied, at 100° C. to 600° C. for 10 to 600 seconds to form a cured film.

7. The method for forming an organic film according to claim 6 , wherein the substrate to be processed has steps or a structure with a height of 30 nm or more.

8. A method for forming an organic film that functions as an organic planarizing film used in a semiconductor apparatus manufacturing process, the method comprising: applying the composition for forming an organic film according to claim 3 on a substrate to be processed by spin coating; and heating the substrate, on which the composition has been applied, under an atmosphere having an oxygen concentration of 0.1% to 21% to form a cured film.

9. A patterning process comprising: forming an organic film on a body to be processed from the composition for forming an organic film according to claim 3 ; forming a resist underlayer film on the organic film from a resist underlayer film composition containing a silicon atom; forming a resist upper layer film on the resist underlayer film from a resist upper layer film composition composed of a photoresist composition; forming a circuit pattern in the resist upper layer film; transferring the pattern to the resist underlayer film by etching using the resist upper layer film having the formed circuit pattern as a mask; transferring the pattern to the organic film by etching using the resist underlayer film having the transferred pattern as a mask; and further transferring the pattern to the body to be processed by etching using the organic film having the transferred pattern as a mask.

10. The patterning process according to claim 9 , the circuit pattern is formed by a photolithography with a wavelength ranging from 10 nm to 300 nm, a direct drawing with electron beam, a nanoimprinting, or a combination thereof.

11. The patterning process according to claim 9 , the circuit pattern is developed by alkaline development or development with an organic solvent.

12. The patterning process according to claim 9 , wherein the body to be processed is a semiconductor apparatus substrate or the semiconductor apparatus substrate coated with any of a metal film, a metal carbide film, a metal oxide film, a metal nitride film, a metal oxycarbide film, and a metal oxynitride film.

13. The patterning process according to claim 12 , wherein the metal of the body to be processed is silicon, titanium, tungsten, hafnium, zirconium, chromium, germanium, copper, silver, gold, aluminum, indium, gallium, arsenic, palladium, iron, tantalum, iridium, molybdenum, or an alloy thereof.

14. A patterning process comprising: forming an organic film on a body to be processed from the composition for forming an organic film according to claim 3 ; forming a resist underlayer film on the organic film from a resist underlayer film composition containing a silicon atom; forming an organic antireflective film on the resi

Assignees

• Shinetsu Chemical Co

Inventors

• Kori Daisuke
• Ogihara Tsutomu
• Watanabe Takeru
• Taneda Yoshinori
• Maeda Kazunori

Classifications

• H10P50/287

  by chemical means · CPC title

• H10P50/283

  by chemical means · CPC title

• H10P76/2041

  Photolithographic processes · CPC title

• H10P76/405

  characterised by their composition, e.g. multilayer masks · CPC title

• H10P50/695

  characterised by the process involved to create the mask, e.g. lift-off masks or sidewalls or to modify the mask · CPC title