Display module and display device

Patent metadata

Field	Value
Publication number	US-10444557-B2
Application number	US-201715743180-A
Country	US
Kind code	B2
Filing date	Apr 5, 2017
Priority date	Apr 13, 2016
Publication date	Oct 15, 2019
Grant date	Oct 15, 2019

Abstract

The present disclosure relates to a display module and a display device. The display module includes a display panel, at least one chip-on-film, a printed circuit board and a cover plate, wherein: the printed circuit board is located on a back side of the display panel; one end of the chip-on-film is connected with the display panel, the other end of the chip-on-film is bent towards the back side of the display panel and is connected with a printed circuit board, with a chip being packaged in a portion of the chip-on-film which is bent towards the back side of the display panel; the cover plate is located on the back side of the printed circuit board and covers the same; the cover plate is provided with thermal conductive blocks which are in thermal contact with the chip at each location of the cover plate corresponding to one of the chip-on-film respectively. The display module according to the present disclosure improves the assembly convenience of the display module, improves the heat dissipation performance of the chip, and further improves the product quality of the display device.

First claim

What is claimed is:

1. A display module comprising a display panel, at least one chip-on-film, a printed circuit board and a cover plate, wherein,
the printed circuit board is located on a back side of the display panel;
one end of the chip-on-film is connected with the display panel, the other end of the chip-on-film is bent towards the back side of the display panel and is connected with the printed circuit board, with a chip being packaged in a portion of the chip-on-film which is bent towards the back side of the display panel;
the cover plate is located on the back side of the printed circuit board and covers the same; the cover plate being provided with thermal conductive blocks which are in thermal contact with the chip at each location of the cover plate corresponding to one of the chip-on-film respectively, and wherein
the thermal-conducting block comprises a first stopper and a second stopper positioned on either side of the cover plate respectively, and a connecting portion for connecting the first stopper with the second stopper.

2. The display module according to claim 1 ,
wherein the thermal conductive block is a thermal conductive rubber block.

3. The display module according to claim 1 ,
wherein a notch is provided at each position of the cover plate corresponding to one of the chip-on-film, and the thermal conductive blocks are fitted in the notches by interference fit respectively.

4. The display module according to claim 3 ,
wherein the connecting portion is fitted with the notches by interference fit.

5. The display module according to claim 3 ,
wherein a pair of limiting protrusions are provided at an entrance of the notch.

6. The display module according to claim 1 ,
wherein the display module further comprises a front frame and a metal back housing connected with the front frame, with the display panel, the at least one chip-on-film, the printed circuit board and the cover plate being located between the front frame and the metal back housing successively, and the thermal conductive blocks being in thermal contact with the metal back housing.

7. The display module according to claim 1 ,
wherein the display module further comprises a front frame and a metal back housing connected with the front frame, with a heat sink being provided inside the metal back housing, the display panel, the at least one chip-on-film, the printed circuit board and the cover plate being located between the front frame and the metal back housing successively, and the thermal conductive blocks being in thermal contact with the heat sink.

8. The display module according to claim 7 ,
wherein the heat sink is bonded by adhesive onto the inner surface of the back housing.

9. The display module according to claim 7 ,
wherein the heat sink has a laminated structure which comprises at least one of a graphite layer, a metal layer, and a thermal conductive adhesive layer.

10. A display device, comprising the display module according to claim 1 .

11. A display device, comprising the display module according to claim 2 .

12. A display device, comprising the display module according to claim 3 .

13. A display device, comprising the display module according to claim 4 .

14. A display device, comprising the display module according to claim 5 .

15. A display device, comprising the display module according to claim 6 .

16. A display device, comprising the display module according to claim 7 .

17. The display module according to claim 1 ,
wherein the thermal-conducting block has a thickness larger than that of the cover plate, so as to be in a compressive contact with the chip.

18. The display module according to claim 3 ,
wherein orthographic projections of the first stopper and the second stopper of the thermal-conducting block on the cover plate completely cover the notches.

19. The display module according to claim 7 ,
wherein the heat sink has a first surface directly contact with the first stopper and a second surface directly contact with the metal back housing.

Assignees

• Boe Technology Group Co Ltd

Inventors

• Wang Zifeng
• Ren Yan
• Hu Nannan
• Cao Lei
• Lin She

Classifications

• H05K7/20454

  with a conformable or flexible structure compensating for irregularities, e.g. cushion bags, thermal paste · CPC title

• G02F1/13452 Primary

  Conductors connecting driver circuitry and terminals of panels · CPC title

• G02F1/1333

  Constructional arrangements; {Manufacturing methods}(G02F1/135, G02F1/136 take precedence) · CPC title

• G02F1/133 Primary

  Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements (arrangements or circuits for control of liquid crystal elements in a matrix, not structurally associated with these elements G09G3/36) · CPC title

• F21V29/71

  using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements · CPC title