Display device
US-2024314987-A1 · Sep 19, 2024 · US
Chip heat dissipation structure and liquid crystal display having thereof
US9075261B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9075261-B2 |
| Application number | US-201213637024-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 4, 2012 |
| Priority date | Jun 28, 2012 |
| Publication date | Jul 7, 2015 |
| Grant date | Jul 7, 2015 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
A chip heat dissipation structure and a liquid crystal display having thereof are provided. The chip heat dissipation structure includes a metal heat dissipation member contacted with a chip. The metal heat dissipation member is connected to a metal protection cover of a printed circuit board. The metal heat dissipation member is perpendicular to the metal protection cover. The present invention also relates to a liquid crystal display. The chip heat dissipation structure and a liquid crystal display having thereof of the present invention have a good heat dissipation effect.
First claim
Opening claim text (preview).
What is claimed is: 1. A chip heat dissipation structure, which is disposed in a liquid crystal display, wherein the chip heat dissipation structure comprising: a metal beat dissipation member, being closely adjacent to a chip in the liquid crystal display and contacting with the chip, the metal heat dissipation member being connected to a metal protection cover of a printed circuit board in the liquid crystal display, a connecting location of the metal heat dissipation member and…
Assignees
Inventors
Classifications
Electricity · mapped topic
- H05K7/20963Primary
Electricity · mapped topic
- G02F1/133382Primary
Physics · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9075261B2 cover?
- A chip heat dissipation structure and a liquid crystal display having thereof are provided. The chip heat dissipation structure includes a metal heat dissipation member contacted with a chip. The metal heat dissipation member is connected to a metal protection cover of a printed circuit board. The metal heat dissipation member is perpendicular to the metal protection cover. The present inventio…
- Who is the assignee on this patent?
- Zhang Yanxue, Hsiao Yu-Chun, Shenzhen China Star Optoelect
- What technology area does this patent fall under?
- Primary CPC classification H05K7/20963. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Jul 07 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).