Method for electrodeposition on a conductive particulate substrate

US10443144B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10443144-B2
Application numberUS-201515502573-A
CountryUS
Kind codeB2
Filing dateFeb 18, 2015
Priority dateAug 14, 2014
Publication dateOct 15, 2019
Grant dateOct 15, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The present invention relates to a method of electrodepositing a metal on an electrically conductive particulate substrate. There is provided a method of electrodepositing a metal on an electrically conductive particulate substrate comprising the steps of: (i) providing a cathode; (ii) providing an anode formed from the metal to be electrodeposited; (iii) providing the substrate, cathode and anode within an electrodeposition bath comprising an electrolyte; and (iv) providing a voltage between said anode and cathode causing metal ions to flow from the anode to the cathode, wherein a separator is provided between the anode and the cathode.

First claim

Opening claim text (preview).

What is claimed is: 1. A method of electrodepositing a metal on an electrically conductive particulate substrate comprising the steps of: providing a cathode that is distinct from the particulate substrate; providing an anode formed from the metal to be electrodeposited; providing a separator between the anode and the cathode, the separator being a semipermeable membrane that is porous to an electrolyte and to the metal ions, but not to the particulate substrate, the separator being configured to maintain the particulate substrate within a substrate volume proximate to the cathode; providing the particulate substrate within the substrate volume at a concentration that is in a range of from 0.0001 vol % to 5 vol %, where vol % refers to a percentage of the substrate volume that is occupied by the particulate substrate; locating the substrate, cathode and anode within an electrodeposition bath comprising the electrolyte; and applying a voltage between said anode and cathode, thereby causing metal ions to flow from the anode to the cathode. 2. The method according to claim 1 , wherein the substrate has an average longest dimension of less than 10 mm. 3. The method according to claim 2 , wherein the substrate is a nano-scaled carbon particulate. 4. The method according to claim 1 , further comprising applying agitation using at least one agitation device, thereby preventing particle agglomeration. 5. The method according to claim 1 , wherein the electrodeposited metal is a ferromagnetic metal. 6. The method according to claim 5 , further comprising using a magnetic field to capture magnetic metal coated particulate substrate from the electrodeposition bath. 7. The method according to claim 1 , wherein the particulate substrate comprises non-electrically conductive particles coated with electrically conductive coatings. 8. The method according to claim 1 , wherein the method is implemented as a batch process. 9. The method according to claim 6 , wherein the captured substrate is an electrically conductive particulate comprising an electrodeposited metal thereon. 10. The method according to claim 1 , wherein the method is implemented as a continuous process.

Assignees

Inventors

Classifications

  • Agitating of electrolytes; Moving of racks · CPC title

  • C25D7/006Primary

    Nanoparticles · CPC title

  • C25D17/002Primary

    Cell separation, e.g. membranes, diaphragms · CPC title

  • of iron · CPC title

  • Chemistry & Metallurgy · mapped topic

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What does patent US10443144B2 cover?
The present invention relates to a method of electrodepositing a metal on an electrically conductive particulate substrate. There is provided a method of electrodepositing a metal on an electrically conductive particulate substrate comprising the steps of: (i) providing a cathode; (ii) providing an anode formed from the metal to be electrodeposited; (iii) providing the substrate, cathode and an…
Who is the assignee on this patent?
Bae Systems Plc
What technology area does this patent fall under?
Primary CPC classification C25D7/006. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Oct 15 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).