Flux and solder paste
US-2024278360-A1 · Aug 22, 2024 · US
Pb-free Sn—Ag—Cu—Al or Sn—Cu—Al solder
US10442037B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10442037-B2 |
| Application number | US-201514544833-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 24, 2015 |
| Priority date | Apr 23, 2010 |
| Publication date | Oct 15, 2019 |
| Grant date | Oct 15, 2019 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
A solder alloy includes Sn, optional Ag, Cu, and Al wherein the alloy composition is controlled to provide a strong, impact-and thermal aging-resistant solder joint that has beneficial microstructural features and is substantially devoid of Ag 3 Sn blades.
First claim
Opening claim text (preview).
The invention claimed is: 1. A solder alloy that is solidified on an electrically conductive substrate comprising copper, said solder alloy consisting essentially of 0.95 to about 3.5 weight % Cu, from 0.15 to about 0.25 weight % Al, and balance consisting essentially of Sn, wherein the Al promotes nucleation of pro-eutectic Cu 6 Sn 5 within the solder alloy which pro-eutectic Cu 6 Sn 5 provides additional interface area for Sn nucleation, said solder alloy providing reduced undercooling that is less an 8 degrees C. upon solder solidification on the electrically conductive substrate as compared to a solder alloy free of Al. 2. A solder alloy that is solidified on an electrically conductive substrate comprising copper, said solder alloy consisting essentially of about 0.95 to about 3.05 weight % Cu, 0.15 to about 0.25 weight Al, and balance consisting essentially of Sn, wherein the Al promotes nucleation of pro-eutectic Cu 6 Sn 5 within the solder alloy which nucleation, said solder alloy providing reduced undercooling that is less then 8 degrees C. upon solder solidification on the electrically conductive substrate as compared to a solder alloy free of Al. 3. A solder alloy consisting essentially of 0.95 to about 3.5 weight % Cu, from 0.20 to about 0.25 weight % Al, and balance consisting essentially of Sn, said solder alloy providing reduced undercooling upon solder solidification on an electrically conductive substrate comprising copper as compared to the solder alloy free of Al, wherein said reduced undercooling is less than 8 degrees C. upon solder solidification.
Assignees
Inventors
Classifications
Solder materials or compositions specially adapted therefor · CPC title
Powders, particles or spheres; Preforms made therefrom · CPC title
Interlayers, transition pieces for metallurgical bonding of workpieces · CPC title
- B23K35/262Primary
Sn as the principal constituent · CPC title
Alloys based on tin · CPC title
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Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US10442037B2 cover?
- A solder alloy includes Sn, optional Ag, Cu, and Al wherein the alloy composition is controlled to provide a strong, impact-and thermal aging-resistant solder joint that has beneficial microstructural features and is substantially devoid of Ag 3 Sn blades.
- Who is the assignee on this patent?
- Univ Iowa State Res Found Inc
- What technology area does this patent fall under?
- Primary CPC classification B23K35/262. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Oct 15 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).