Plasma source and methods for depositing thin film coatings using plasma enhanced chemical vapor deposition

Patent metadata

Field	Value
Publication number	US-10438778-B2
Application number	US-201414486726-A
Country	US
Kind code	B2
Filing date	Sep 15, 2014
Priority date	Aug 4, 2008
Publication date	Oct 8, 2019
Grant date	Oct 8, 2019

Abstract

The present invention provides novel plasma sources useful in the thin film coating arts and methods of using the same. More specifically, the present invention provides novel linear and two dimensional plasma sources that produce linear and two dimensional plasmas, respectively, that are useful for plasma-enhanced chemical vapor deposition. The present invention also provides methods of making thin film coatings and methods of increasing the coating efficiencies of such methods.

First claim

What is claimed is:

1. A plasma source comprising:
i) an array of n electron emitting surfaces; wherein n represents the number of electron emitting surfaces in the array; wherein each electron emitting surface is separated from at least one adjacent electron emitting surface by a gas-containing space,
wherein a restricted opening is disposed in each electron emitting surface in the array,
wherein the restricted opening is configured to face the substrate to be coated,
wherein the electron emitting surfaces are positioned so that a current comprising secondary electrons flows from an electron emitting surface in the array through the restricted opening in the electron emitting surface, through the gas containing space separating at least one adjacent electron emitting surface, and through the restricted opening in the at least one adjacent electron emitting surface to the at least one adjacent electron emitting surface;

ii) at least one precursor gas manifold supplying precursor gas and at least one reactant gas manifold supplying reactant gas, wherein the at least one precursor gas manifold is positioned so that the precursor gas flows into the gas containing space separating the electron emitting surfaces, and the at least one reactant gas manifold is positioned so that reactant gas flows along the electron emitting surfaces;
iii) one or more walls for pressure control, wherein the operating gas pressure between the electron emitting surfaces is 1 millibar to 10 −3 millibar; and
iv) a power source to which the electron emitting surfaces are electrically connected that is configured to supply a voltage that alternates between positive and negative; wherein each electron emitting surface is supplied with a voltage that is out of phase with the voltage supplied to at least one adjacent electron emitting surface, creating a current that flows between adjacent electron emitting surfaces;
wherein the current creates a plasma between adjacent electron emitting surfaces; and wherein the plasma acts as an energy source to energize, partially decompose, or fully decompose the precursor gas proximate to the substrate to be coated,
wherein the current creates a plasma between the electron emitting surfaces that is substantially uniform over its length in the substantial absence of Hall current, and
wherein the plasma source is able to produce a coating at a rate of deposition of at least 0.2 μm/second.

2. The plasma source of claim 1 , wherein n is in the range of 4 to 8.

3. The plasma source of claim 2 , wherein n is equal to 6.

4. The plasma source of claim 2 , wherein n is equal to 8.

5. The plasma source of claim 1 , wherein n is equal to 10.

6. The plasma source of claim 1 , wherein the electron emitting surfaces are each hollow cathodes.

7. The plasma source of claim 1 , wherein each electron emitting surface has a first end and a second end.

8. The plasma source of claim 7 , wherein a first electron emitting surface is aligned parallel to a second electron emitting surface, such that the first end of the first electron emitting surface is adjacent to the first end of the second electron emitting surface, and the second end of the first electron emitting surface is adjacent to the second end of the second electron emitting surface.

9. The plasma source of claim 7 , wherein a first electron emitting surface is aligned in-line with a second electron emitting surface, such that the second end of the first electron emitting surface is adjacent to the first end of the second electron emitting surface.

10. The plasma source of claim 1 , wherein the power source is a bipolar power source.

11. The plasma source of claim 10 , wherein the bipolar power source is configured to supply an alternating voltage.

12. The plasma source of claim 1 , wherein the plasma created by the plasma source is linear.

13. The plasma source of claim 1 , wherein the plasma created by the plasma source is two-dimensional.

14. The plasma source of claim 1 , wherein the gas containing space contains at least one of a precursor gas and a reactant gas.

15. The plasma source of claim 1 , wherein the plasma source is able to produce a coating at a rate of deposition of at least 0.3 μm/second.

16. The plasma source of claim 15 , wherein the plasma source is able to produce a coating at a rate of deposition of at least 0.5 μm/second.

17. The plasma source of claim 1 , wherein the electron emitting surfaces are separated by a dark space.

18. The plasma source of claim 17 , wherein the dark space is filled with an insulating material.

19. The plasma source of claim 1 , wherein an insulating wall is disposed on the outside of the electron emitting surfaces to inhibit plasma formation outside the array.

20. A plasma source comprising:
i) an array of n electron emitting surfaces; wherein n represents the number of electron emitting surfaces in the array; wherein each electron emitting surface is separated from at least one adjacent electron emitting surface,
wherein a restricted opening is disposed in each electron emitting surface in the array,
wherein the restricted opening is configured to face the substrate to be coated,
wherein the electron emitting surfaces are positioned so that a current comprising secondary electrons flows from an electron emitting surface in the array through the restricted opening in the electron emitting surface, and through the restricted opening in at least one adjacent electron emitting surface to the at least one adjacent electron emitting surface;

ii) at least one precursor gas manifold supplying precursor gas and at least one reactant gas manifold supplying reactant gas, wherein the at least one reactant gas manifold is positioned so that reactant gas flows along the electron emitting surfaces;
iii) one or more walls for pressure control, wherein the operating gas pressure between the electron emitting surfaces is 1 millibar to 10 −3 millibar; and
iv) a power source to which the electron emitting surfaces are electrically connected that is configured to supply a voltage that alternates between positive and negative; wherein each electron emitting surface is supplied with a voltage that is out of phase with the voltage supplied to at least one adjacent electron emitting surface, creating a current that flows between adjacent electron emitting surfaces;
wherein the current creates a plasma between adjacent electron emitting surfaces; and wherein the plasma acts as an energy source to energize, partially decompose, or fully decompose the precursor gas proximate to the substrate to be coated,
wherein the current creates a plasma between the electron emitting surfaces that is substantially uniform over its length in the substantial absence of Hall current, and
wherein the plasma source is able to produce a coating at a rate of deposition of at least 0.2 μm/second.

21. The plasma source of claim 20 , wherein n is in the range of 4 to 8.

22. The plasma source of claim 21 , wherein n is equal to 6.

23. The plasma source of claim 21 , wherein n is equal to 8.

24. The plasma source of claim 20 , wherein n is equal to 10.

25. The plasma source of claim 20 , wherein the electron emitting surfaces are each hollow cathodes.

26. The plasma source of claim 20 , wherein each electron emitting surface has a first end and a second end.

27. The plasma source of claim 26 , wherein a first

Assignees

• Agc Flat Glass Na Inc
• Asahi Glass Co Ltd
• Agc Glass Europe S A
• Agc Glass Europe

Inventors

• Maschwitz Peter

Classifications

• H01J37/32596 Primary

  Hollow cathodes · CPC title

• H05H1/46

  using applied electromagnetic fields, e.g. high frequency or microwave energy (H05H1/26 takes precedence) · CPC title

• C23C16/503

  using DC or AC discharges · CPC title

• H05H1/42

  with provisions for introducing materials into the plasma, e.g. powder or liquid {(arc stabilising or constricting arrangements H05H1/3405; coaxial protecting fluids H05H1/341)} · CPC title

• C03C17/245

  by deposition from the vapour phase · CPC title