Sensor assembly and method for determining respective positions of a number of mirrors of a lithography system

Patent metadata

Field	Value
Publication number	US-10437155-B2
Application number	US-201715807813-A
Country	US
Kind code	B2
Filing date	Nov 9, 2017
Priority date	May 18, 2015
Publication date	Oct 8, 2019
Grant date	Oct 8, 2019

Abstract

Sensor arrangements, methods for ascertaining a respective position of a number of mirrors of a lithography apparatus, projection systems of a lithography apparatus, and lithography apparatus are disclosed. The sensor arrangement includes at least one position sensor apparatus for providing a position signal for a mirror and an evaluation apparatus for ascertaining the position of the mirror depending on the position signal.

First claim

What is claimed is:

1. A sensor arrangement, comprising:
a number of position sensor apparatuses, each position sensor apparatus comprising:
a measuring unit;
a light source to expose the measuring unit to a modulated light beam so that the measuring unit provides an optical position signal of a position of a mirror of a lithography apparatus during exposure by the modulated light beam; and
a detection unit comprising a plurality of photodetectors to output an electrical position signal by detection of the provided optical position signal; and

an evaluation apparatus configured to ascertain the position of the mirror via the electrical position signal,
wherein:
the measuring unit comprises:
a reference pattern to influence the light beam; and
a mirror arrangement for reflecting the influenced light beam;

the evaluation apparatus comprises a signal-processing unit comprising at least one A/D converter to convert an analog electrical position sensor output by the photodetector into a digital electrical position signal; and
the light source and the signal-processing unit are disposed in an integrated component arranged in a vacuum housing.

2. The sensor arrangement of claim 1 , wherein the light source is configured to generate a pulsed light beam for exposing the measuring unit.

3. The sensor arrangement of claim 2 , further comprising:
a plurality N 3 of position sensor apparatuses disposed in the vacuum housing, a respective position sensor apparatus being assigned to one of a plurality N 2 of actuatable mirrors of the lithography apparatus;
an information collection device in the vacuum housing; and
a cable connecting the information collection device to the evaluation apparatus,
wherein:
the evaluation apparatus is outside of the vacuum housing; and
the evaluation apparatus is configured to transfer the N 3 electrical position signals provided by the N 3 position sensor apparatuses in analog fashion via the cable using multiplexing or using frequency multiplexing.

4. The sensor arrangement of claim 1 , wherein the light source is configured to generate a sinusoidal light beam for exposing the measuring unit.

5. The sensor arrangement of claim 4 , further comprising:
a plurality N 3 of position sensor apparatuses in the vacuum housing, a respective position sensor apparatus being assigned to one of a plurality N 2 of actuatable mirrors of the lithography apparatus;
an information collection device in the vacuum housing; and
a cable connecting the collection device and the evaluation apparatus,
wherein the evaluation apparatus is outside the vacuum housing, and the evaluation device is configured to transfer the N 3 electrical position signals provided by the N 3 position sensor apparatuses in analog fashion via the cable using frequency multiplexing.

6. The sensor arrangement of claim 1 , wherein the light source comprises:
a light-producing unit to produce a light beam; and
a modulator unit to generate the modulated light beam from the light beam produced by the light-producing unit.

7. The sensor arrangement of claim 6 , wherein the light-producing unit comprises a semiconductor laser.

8. The sensor arrangement of claim 6 , further comprising a synchronization device configured to synchronize the signal-processing unit and the light source, wherein the pulse generator comprises the synchronization device, and the pulse generator is configured to synchronize the signal-processing unit and the light source via the sequence of pulses.

9. The sensor arrangement of claim 1 , wherein the light source comprises:
a light-producing unit to produce light beam; and
a pulse generator to actuate the light-producing unit via a sequence of pulses so that the light-producing unit outputs the modulated light beam.

10. The sensor arrangement of claim 1 , further comprising a synchronization device configured to synchronize the signal-processing unit and the light source.

11. The sensor arrangement of claim 10 , wherein:
the A/D converter comprises a sampling unit and a quantization unit; and
the synchronization device is configured to synchronize the sampling unit and the light source to generate the modulated light beam.

12. The sensor arrangement of claim 10 , wherein:
the signal-processing unit comprises the A/D converter and a signal analysis unit disposed downstream of the A/D converter; and
the synchronization device is configured to synchronize the signal analysis unit and the light source to generate the modulated light beam.

13. The sensor arrangement of claim 12 , wherein the A/D converter is configured to multiply sample the electrical position signal.

14. The sensor arrangement of claim 10 , wherein:
the signal-processing unit comprises the A/D converter and a demodulator disposed upstream of the A/D converter; and
the synchronization device is configured to synchronize the demodulator and the light source to generate a sinusoidal light beam.

15. The sensor arrangement of claim 1 , wherein the light source, the signal-processing unit and the photodetectors of the detection unit are provided in the integrated component.

16. The sensor arrangement of claim 1 , further comprising a control apparatus to control actuators which are configured to actuate actuatable mirrors of the lithography apparatus.

17. The sensor arrangement of claim 16 , wherein the control apparatus comprises the evaluation apparatus.

18. The sensor arrangement of claim 1 , wherein the detection unit further comprises an optical unit to image the optical position signal that is provided by the measuring unit onto the photodetectors.

19. The sensor arrangement of claim 1 , further comprising:
a plurality N 3 of position sensor apparatuses in the vacuum housing, a respective position sensor apparatus being to one of a plurality N 2 of actuatable mirrors of the lithography apparatus; and
a data collection device in the vacuum housing,
wherein:
the data collection device and the evaluation apparatus are connected via a data link;
the evaluation apparatus is disposed outside of the vacuum housing;
the evaluation apparatus is configured to collect N 3 electrical position signals provided by the N 3 position sensor apparatuses to form a digital collective signal; and
the evaluation unit is configured to transfer the digital collective signal to the evaluation apparatus via the data link.

20. The sensor arrangement of claim 19 , wherein the data collection device and the evaluation apparatus are connected via a single data link.

21. The sensor arrangement of claim 19 , wherein the data link is a unidirectional data link.

22. The sensor arrangement of claim 19 , wherein the data link comprises:
a vacuum through-connection apparatus for a vacuum-suitable through-connection through the vacuum housing;
a first data line coupled between the data collection apparatus and the vacuum through-connection apparatus; and
a second data line coupled between the vacuum through-connection apparatus and the evaluation apparatus.

23. The sensor arrangement of claim 1 , further comprising:
a plurality N 3 of position sensor apparatuses disposed in the vacuum housing, a respective position sensor apparatus being assigned to one of a plurality N 2 of actuatable mirrors of the lithography apparatus; and
a bus system in the vacuum housing,
wherein:
the bus system is connected to the evaluation apparatus;
the evaluation apparatus is

Assignees

• Zeiss Carl Smt Gmbh

Inventors

• Horn Jan
• Krone Stefan
• Berger Lars

Classifications

• G01B11/026

  by measuring distance between sensor and object (G01B11/0608 takes precedence) · CPC title

• G01B11/002

  for measuring two or more coordinates · CPC title

• G01D5/347

  using displacement encoding scales · CPC title

• G03F7/70258 Primary

  Projection system adjustments, e.g. adjustments during exposure or alignment during assembly of projection system · CPC title

• G03F7/7085

  Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load · CPC title