Magnetic sensor and method of manufacturing the same

Patent metadata

Field	Value
Publication number	US-10429453-B2
Application number	US-201715458499-A
Country	US
Kind code	B2
Filing date	Mar 14, 2017
Priority date	Mar 15, 2016
Publication date	Oct 1, 2019
Grant date	Oct 1, 2019

Abstract

The magnetic sensor includes a semiconductor substrate having Hall elements on a front surface of the semiconductor substrate, an adhesive layer formed on a back surface of the semiconductor substrate, and a magnetic flux converging plate formed on the adhesive layer. The magnetic flux converging plate is formed on the back surface of the semiconductor substrate through formation of the magnetic flux converging plate by electroplating on a base conductive layer formed on a plating substrate prepared separately from the semiconductor substrate, application of an adhesive for forming the adhesive layer onto a surface of the magnetic flux converging plate so that the magnetic flux converging plate adheres to the back surface of the semiconductor substrate, and peeling off of the plating substrate afterward from the base conductive layer formed on the magnetic flux converging plate.

First claim

What is claimed is:

1. A magnetic sensor, comprising:
a semiconductor substrate having Hall elements on a front surface thereof;
an adhesive layer directly in contact with a back surface of the semiconductor substrate opposite to the front surface;
a magnetic flux converging plate having a first surface in contact with the adhesive layer, such that the adhesive layer bonds the first surface of the magnetic flux converging plate to the back surface of the semiconductor substrate; and
a conductive layer on a second surface of the magnetic flux converging plate opposite to the first surface.

2. A magnetic sensor according to claim 1 , wherein the semiconductor substrate has a thickness of from 100 μm to 400 μm.

3. A magnetic sensor according to claim 1 , wherein the magnetic flux converging plate has a thickness of from 20 μm to 50 μm.

4. A magnetic sensor, comprising:
a semiconductor substrate having Hall elements on a front surface thereof;
an adhesive layer directly in contact with a back surface of the semiconductor substrate opposite to the front surface;
a magnetic flux converging plate having a first surface in contact with the adhesive layer, such that the adhesive layer bonds the first surface of the magnetic flux converging plate to the back surface of the semiconductor substrate, wherein the magnetic sensor further comprising a conductive layer comprising copper on a second surface of the magnetic flux converging plate opposite to the first surface.

5. A magnetic sensor according to claim 4 , wherein the semiconductor substrate has a thickness of from 100 μm to 400 μm.

6. A magnetic sensor according to claim 4 , wherein the magnetic flux converging plate has a thickness of from 20 μm to 50 μm.

Assignees

• Sii Semiconductor Corp
• Ablic Inc

Inventors

• Hioka Takaaki
• Ebihara Mika
• Takahashi Hiroshi
• Kishi Matsuo
• TAKAHAMA Miei

Classifications

• G01R33/07 Primary

  Hall effect devices · CPC title

• G01R3/00

  Apparatus or processes specially adapted for the manufacture {or maintenance} of measuring instruments {, e.g. of probe tips} · CPC title

• G01D5/142 Primary

  using Hall-effect devices (measuring magnetic variables using Hall-effect or other galvanomagnetic devices G01R33/06) · CPC title

• G01R33/077

  Vertical Hall-effect devices · CPC title

• G01R33/0052 Primary

  Manufacturing aspects; Manufacturing of single devices, i.e. of semiconductor magnetic sensor chips (devices based on galvano-magnetic effect or the like H10N50/85) · CPC title