Integrated card-guide adapter heat sink

Patent metadata

Field	Value
Publication number	US-10426054-B1
Application number	US-201816218130-A
Country	US
Kind code	B1
Filing date	Dec 12, 2018
Priority date	Dec 12, 2018
Publication date	Sep 24, 2019
Grant date	Sep 24, 2019

Abstract

An integrated adapter configured to hold two first circuit card assemblies in a larger second circuit card assembly space includes a thermally-conductive frame and two vertical thermally-conductive guide rails in the inboard region of the frame front. A channel is formed in each of the two guide rails, extending from the guide rail top to the guide rail bottom on the respective outboard side, thereby defining a front rail and a back rail, each configured to receive and support an edge of a first circuit card assembly, and the frame is configured to be attached to a second circuit card assembly, thereby forming an integrated adapter circuit card. Various circuit card sizes can be adapted for use, including supporting two 3U circuit cards in a 6U circuit card space. A method of making the integrated adapter is also disclosed.

First claim

The invention claimed is:

1. An integrated adapter configured to hold two first circuit card assemblies in a second circuit card assembly space, comprising:
a thermally-conductive frame defining a front, a back, a top, a bottom, a left side, a right side, and an inboard region; and
two vertical thermally-conductive guide rails disposed on the front of the thermally-conductive frame in the inboard region, each of the two thermally-conductive guide rails defining a guide rail top, a guide rail bottom, an inboard side, and an outboard side;
wherein:
a channel is formed in each of the two thermally-conductive guide rails, extending from the guide rail top to the guide rail bottom on the respective outboard side, thereby defining a front rail and a back rail;
the front rail and back rail on each of the two thermally-conductive guide rails together are configured to receive and support an edge of a first circuit card assembly;
the thermally-conductive frame is configured to be matably attached to a second circuit card assembly, thereby forming an integrated adapter circuit card;
the integrated adapter circuit card is configured to be positioned in the second circuit card assembly space; and
the second circuit card assembly is larger than the first circuit card assembly.

2. The integrated adapter of claim 1 , wherein:
the first circuit card assembly comprises a 3U form factor; and
the second circuit card assembly comprises a 6U form factor.

3. The integrated adapter of claim 1 , wherein:
the first circuit card assembly comprises a form factor selected from the group consisting of a 3U form factor and a 6U form factor; and
the second circuit card assembly comprises a 9U form factor.

4. The integrated adapter of claim 1 , wherein the thermally-conductive frame comprises one or more of nickel, aluminum, titanium, copper, iron, cobalt, and alloys thereof.

5. The integrated adapter of claim 1 , wherein the thermally-conductive frame comprises 6061 aluminum alloy.

6. The integrated adapter of claim 1 , wherein the thermally-conductive frame is formed by one or more of extrusion, forging, additive manufacturing, subtractive manufacturing, and casting.

7. The integrated adapter of claim 1 , wherein:
each of the thermally-conductive guide rails are formed by one or more of extrusion, forging, additive manufacturing, subtractive manufacturing, casting, and molding; and
each of the thermally-conductive guide rails comprises one or more of nickel, aluminum, titanium, copper, iron, cobalt, and alloys thereof.

8. The integrated adapter of claim 1 , wherein the integrated adapter is formed as a single component.

9. The integrated adapter of claim 1 , wherein:
the thermally-conductive frame is formed as a single component;
each of the thermally-conductive guide rails is formed as a single component; and
each of the thermally-conductive guide rails is matably attached to the thermally-conductive frame by one or more of welding, brazing, threaded fasteners, rivets, interference fit, or an adhesive.

10. The integrated adapter of claim 1 , wherein:
the thermally-conductive frame is formed as a single component;
each of the thermally-conductive guide rails is formed as a single component;
the thermally-conductive frame comprises one or more of nickel, aluminum, titanium, copper, iron, cobalt, and alloys thereof;
each of the thermally-conductive guide rails comprises a non-metallic material; and
each of the thermally-conductive guide rails is matably attached to the thermally-conductive frame by one or more of threaded fasteners, rivets, interference fit, and an adhesive.

11. The integrated adapter of claim 10 , wherein:
the thermally-conductive frame comprises a material having a first thermal conductivity ranging from 80-350 W/m-K;
each of the two thermally-conductive guide rails comprises a material having a second thermal conductivity; and
the first thermal conductivity is greater than the second thermal conductivity.

12. A method of making an integrated adapter configured to hold two first circuit card assemblies in a second circuit card assembly space, comprising the steps of:
forming a thermally-conductive frame defining a front, a back, a top, a bottom, a left side, a right side, and an inboard region;
wherein:
the thermally-conductive frame is configured to be matably attached to a second circuit card assembly, thereby forming an integrated adapter circuit card; and
the integrated adapter circuit card is configured to be positioned in the second circuit card assembly space;

forming two thermally-conductive guide rails, each defining a guide rail top, a guide rail bottom, an inboard side, and an outboard side;
wherein:
a channel is formed in each of the two thermally-conductive guide rails, extending from the guide rail top to the guide rail bottom on the respective outboard side, thereby defining a front rail and a back rail; and
the front rail and back rail on each of the two thermally-conductive guide rails together are configured to receive and support an edge of a first circuit card assembly; and

attaching each of the two thermally-conductive guide rails to the thermally-conductive frame on the front in the inboard region;
wherein:
the thermally-conductive frame is configured to be matably attached to a second circuit card assembly, thereby forming an integrated adapter circuit card;
the integrated adapter circuit card is configured to be positioned in the second circuit card assembly space; and
the second circuit card assembly is larger than the first circuit card assembly.

13. The integrated adapter of claim 12 , wherein:
the first circuit card assembly comprises a 3U form factor; and
the second circuit card assembly comprises a 6U form factor.

14. The integrated adapter of claim 12 , wherein:
the first circuit card assembly comprises a form factor selected from the group consisting of 3U form factor and 6U form factor; and
the second circuit card assembly comprises a 9U form factor.

15. The integrated adapter of claim 12 , wherein the thermally-conductive frame comprises one or more of nickel, aluminum, titanium, copper, iron, cobalt, and alloys thereof.

16. The integrated adapter of claim 12 , wherein the thermally-conductive frame comprises 6061 aluminum alloy.

17. The integrated adapter of claim 12 , wherein the thermally-conductive frame is formed by one or more of extrusion, forging, additive manufacturing, subtractive manufacturing, and casting.

18. The integrated adapter of claim 12 , wherein:
each of the thermally-conductive guide rails are formed by one or more of extrusion, forging, additive manufacturing, subtractive manufacturing, casting, and molding; and
each of the thermally-conductive guide rails comprises one or more of nickel, aluminum, titanium, copper, iron, cobalt, and alloys thereof.

19. The integrated adapter of claim 12 , wherein:
the thermally-conductive frame is formed as a single component;
each of the thermally-conductive guide rails are formed as a single component;
the thermally-conductive frame comprises one or more of nickel, aluminum, titanium, copper, iron, cobalt, and alloys thereof;
each of the thermally-conductive guide rails comprises a non-metallic material; and
each of the thermally-conductive guide rails is matably attached to the thermally-conductive frame by one or more of threaded fasteners, rivets, interference fit, or an adhesive.

20. The integrated adapter of claim 19 , wherein:
the thermally-condu

Assignees

• Hamilton Sundstrand Corp

Inventors

• Trotman Alexander
• Trotman Kenneth

Classifications

• G06F1/20

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• H05K7/1445

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• H05K7/20509

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