Circuit card assembly and method of fabricating the same

Patent metadata

Field	Value
Publication number	US-9253871-B2
Application number	US-201314068697-A
Country	US
Kind code	B2
Filing date	Oct 31, 2013
Priority date	Oct 31, 2013
Publication date	Feb 2, 2016
Grant date	Feb 2, 2016

Abstract

A circuit card assembly is provided. The circuit card assembly includes a printed circuit board, at least one electronic component mounted on the printed circuit board, and a frame coupled to the printed circuit board such that the electronic component is disposed between the printed circuit board and the frame. The circuit card assembly also includes a heat transfer device coupled to the frame. The heat transfer device has a heat pipe disposed at least in part between the frame and the printed circuit board. The circuit card assembly further includes a pivotable brace biasing the heat pipe toward the electronic component to facilitate cooling the electronic component.

First claim

What is claimed is:

1. A circuit card assembly comprising:
a printed circuit board;
at least one electronic component mounted on said printed circuit board;
a frame coupled to said printed circuit board such that said electronic component is disposed between said printed circuit board and said frame;
a heat transfer device coupled to said frame, wherein said heat transfer device comprises a heat pipe disposed at least in part between said frame and said printed circuit board…

Assignees

• Gen Electric

Inventors

• Kim Joo Han
• De Bock Hendrik Pieter Jacobus
• Labhart Jay Todd
• Chauhan Shakti Singh
• Kirk Graham Charles
• Connolly Stuart

Classifications

• Y10T29/49002

  Cross-Sectional Technologies · mapped topic

• H05K7/20672

  Electricity · mapped topic

• H05K7/1461 Primary

  Electricity · mapped topic

• H05K1/0203 Primary

  Electricity · mapped topic