Laminite, and element comprising substrate manufactured using same

Patent metadata

Field	Value
Publication number	US-10414869-B2
Application number	US-201414422476-A
Country	US
Kind code	B2
Filing date	Apr 8, 2014
Priority date	Apr 9, 2013
Publication date	Sep 17, 2019
Grant date	Sep 17, 2019

Abstract

The present invention relates to a laminate and a device fabricated using the laminate. The laminate includes a debonding layer including a polyimide resin between a carrier substrate and a flexible substrate. The adhesive strength of the debonding layer to the flexible substrate is changed by a physical stimulus. According to the present invention, the flexible substrate can be easily separated from the carrier substrate without the need for further processing such as laser or light irradiation. Therefore, the use of the laminate facilitates the fabrication of the device having the flexible substrate. The device may be, for example, a flexible display device. In addition, the device can be prevented from deterioration of reliability and occurrence of defects caused by laser or light irradiation. This ensures improved characteristics and high reliability of the device.

First claim

The invention claimed is:

1. A method for producing a device substrate, comprising:
obtaining a laminate comprising a carrier substrate, a debonding layer applied directly on at least one surface of the carrier substrate, and a flexible substrate applied directly on the surface of the debonding layer opposite to the surface of the debonding layer formed on a surface of the carrier substrate, wherein the carrier substrate, debonding layer, and flexible substrate comprise peripheral cross-sectional surfaces;
cutting the flexible substrate without causing chemical changes in the debonding layer to expose additional cross-sectional surfaces in the flexible substrate; and
separating the flexible substrate from the debonding layer that is formed on the carrier substrate,
wherein the cutting is not applied to the surfaces of the carrier substrate and does not expose additional cross-sectional surfaces of the debonding layer,
wherein the cutting step only exposes the additional cross-sectional surfaces of the flexible substrate where the flexible substrate was cut, and
wherein the debonding layer comprises a polyimide resin.

2. The method of claim 1 , wherein the debonding layer has a ratio of peel strength to adhesive strength of 0.001-0.5 with respect to the flexible substrate.

3. The method of claim 1 , wherein said laminate further comprises a device structure formed on the flexible substrate.

4. The method of claim 3 , wherein the device structure is selected from the group consisting of a solar cell, an organic light emitting diode lighting device, a semiconductor device, and a display device.

5. The method of claim 4 , wherein the display device is a flexible organic electroluminescent device.

6. The method of claim 1 , wherein said method does not include a laser irradiation step.

7. The method of claim 1 , wherein said cutting has a force not greater than 0.1 N.

8. The method of claim 1 , wherein the debonding layer has an adhesive strength of at least 1 N/cm to the flexible substrate before the applying step.

9. The method of claim 1 , wherein the debonding layer has a peel strength of not greater than 0.3 N/cm from the flexible substrate after the applying step.

10. The method of claim 1 , wherein the polyimide resin comprises a diamine represented by Formula 4b:

wherein R 22 and R 23 are each independently a C 1 -C 10 alkyl or C 1 -C 10 haloalkyl group, m and n are each independently an integer from 0 to 4, and p is an integer of 0.

11. The method of claim 1 , wherein the polyimide resin has a similarity score not greater than 0.5, as calculated by Equation 1:
Similarity score=α FIT ( k 1 ×Ls dianhydride,i +k 2 ×Ls diamine,j ) k 0 ,

wherein
Ls dianhydride,i =Exp[−k 3 ×Coeff i ]×V i y 0
Ls diamine,j =Exp[−k 4 ×Coeff j ]×V j y 0
k 0 =2.00,
y 0 =−1.00,
k 1 =206.67,
k 2 =124.78,
k 3 =3.20,
k 4 =5.90,
Coeff i and Coeff j are molecular asphericities calculated from the structures of dianhydride i and diamine j as monomers of the polyimide, respectively,
V i and V j are McGowan volumes calculated from the structures of dianhydride i and diamine j as the monomers, respectively, and
α FIT is 1.0 if exp(−4.0×|Coeff i −Coeff j |)+0.08<0.90 and is a constant from 0.1 to 0.95 if exp(−4.0×|Coeff i −Coeff j |)+0.08≥0.90.

12. The method of claim 1 , wherein the polyimide resin has an imidization degree of 60% to 99% when the imidization degree is defined as the percentage of the integrated intensity of the CN bands observed at 1350 to 1400 cm −1 or 1550 to 1650 cm −1 in the IR spectrum after a composition comprising a polyamic acid resin is applied and imidized at a temperature of 200° C. or above with respect to the integrated intensity (100%) of the CN bands observed in the same wavelength range after the composition is imidized at a temperature of 500° C. or above.

13. The method of claim 1 , wherein the polyimide resin has a glass transition temperature of 200° C. or above.

14. The method of claim 1 , wherein the debonding layer has a coefficient of thermal expansion not higher than 30 ppm/° C. at a temperature of 100 to 200° C. and a 1% thermal decomposition temperature (Td1%) of 450° C. or above.

15. The method of claim 1 , wherein the debonding layer has a thickness of 0.05 to 5 μm.

16. The method of claim 1 , wherein the flexible substrate has a structure selected from the group consisting of a thin film glass layer, a polymer layer, and a multilayer laminate thereof.

17. The method of claim 16 , wherein the flexible substrate is a polymer layer and the polymer layer comprises at least one polymer resin selected from the group consisting of polyethersulfone, polyethylene naphthalate, polyethylene terephthalate, polycarbonate, polyimide, polyether imide, polyamide imide, polyester, polyether amide imide, polyester amide imide, and polyarylate.

18. The method of claim 16 , wherein the flexible substrate is a polymer layer and the polymer layer comprises a polyimide resin having an imidization degree of 50 to 99% and a glass transition temperature of 200° C. or above.

Assignees

• Lg Chemical Ltd

Inventors

• Jeong Hye Won
• Kim Kyungjun
• Kim Kyoung Hoon
• Park Chan Hyo
• Shin Bora
• Lee Seung Yup
• Park Hangah
• Lee Jinho
• Im Mira

Classifications

• H10P72/7412

  the auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support · CPC title

• Y10S156/93

  Semiconductive product delaminating, e.g. delaminating emiconductive wafer from underlayer · CPC title

• B32B27/36

  comprising polyesters · CPC title

• C03C2218/355

  Temporary coating · CPC title

• B32B27/08

  of synthetic resin · CPC title