Mask and manufacturing method therefor
US-2015259779-A1 · Sep 17, 2015 · US
Laminate, method for producing same, and method for producing device structure using same
US8980409B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8980409-B2 |
| Application number | US-201214111330-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 12, 2012 |
| Priority date | Apr 15, 2011 |
| Publication date | Mar 17, 2015 |
| Grant date | Mar 17, 2015 |
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Abstract
Official abstract text for this publication.
The invention provides a laminate of a substrate, a polyimide film, and a coupling treatment layer interposed therebetween, which provides different delamination strengths between the substrate and the polyimide film to form a prescribed pattern. The invention also provides a method for producing such a laminate formed from at least a substrate and a polyimide film, whereby, using a film obtained by plasma treatment of at least the surface facing the substrate as the polyimide film, coupling agent treatment is performed on at least one of the surfaces facing the substrate and the polyimide film to form a coupling treatment layer, deactivation treatment is performed on a portion of the coupling treatment layer to form a pre-determined pattern, and then pressing and heating are performed with the substrate and polyimide film overlapping.
First claim
Opening claim text (preview).
The invention claimed is: 1. A laminate comprising a substrate, a polyimide film, and a coupling treatment layer interposed therebetween, wherein delamination strength between the substrate and the polyimide film is different between good adhesion parts and easily peeling parts, forming a prescribed pattern. 2. The laminate according to claim 1 , wherein 180-degree peel strength between the substrate and the polyimide film in the easily peeling part is ½ or low…
Assignees
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Classifications
Operations & Transport · mapped topic
Operations & Transport · mapped topic
Operations & Transport · mapped topic
Chemistry & Metallurgy · mapped topic
- B32B38/10Primary
Operations & Transport · mapped topic
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Frequently asked questions
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- What does patent US8980409B2 cover?
- The invention provides a laminate of a substrate, a polyimide film, and a coupling treatment layer interposed therebetween, which provides different delamination strengths between the substrate and the polyimide film to form a prescribed pattern. The invention also provides a method for producing such a laminate formed from at least a substrate and a polyimide film, whereby, using a film obtain…
- Who is the assignee on this patent?
- Okuyama Tetsuo, Ouya Kazuyuki, Tsuchiya Toshiyuki, and 3 more
- What technology area does this patent fall under?
- Primary CPC classification B32B38/10. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Mar 17 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).