Resin containing phenolic hydroxyl groups, and resist film

US10414850B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10414850-B2
Application numberUS-201615775921-A
CountryUS
Kind codeB2
Filing dateNov 17, 2016
Priority dateDec 2, 2015
Publication dateSep 17, 2019
Grant dateSep 17, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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Abstract

Official abstract text for this publication.

Provided are a resin containing phenolic hydroxyl groups having excellent developability, heat resistance, and substrate followability, a photosensitive composition, a curable composition, and a resist film which contain the resin containing phenolic hydroxyl group. The resin containing phenolic hydroxyl groups obtained by reacting a novolac resin intermediate obtained by reacting a triarylmethane compound (A) with an aldehyde compound (B) as essential components, with an alkene compound (C) having 9 to 24 carbon atoms, a photosensitive composition, a curable composition, and a resist film which contain the resin containing phenolic hydroxyl groups.

First claim

Opening claim text (preview).

The invention claimed is: 1. A resin containing phenolic hydroxyl groups, comprising, as a repeating unit, a structural moiety represented by Structural Formula (1): (wherein R 1 represents any one of a hydrogen atom, an alkyl group, and an aryl group, and X is a structural moiety (α) represented by Structural Formula (2) or a structural moiety (β) represented by Structural Formula (3): wherein k is any one of 0, 1, and 2, R 2 's each independently represent any one of a hydrogen atom, an aliphatic hydrocarbon group, an aromatic ring-containing hydrocarbon group, an alkoxy group, and a halogen atom, 1's are each independently an integer of to 4, R 3 represents any one of a hydrogen atom, an aliphatic hydrocarbon group, an aromatic ring-containing hydrocarbon group, an alkoxy group, and a halogen atom, m is an integer of 1 to 4, asterisks each are a bonding point on any of the three aromatic rings shown in the formula, and two asterisks may be bonded to the same aromatic ring or may be bonded to different aromatic rings: wherein k is any one of 0, 1, and 2, R 2 's each independently represent any one of a hydrogen atom, an aliphatic hydrocarbon group, an aromatic ring-containing hydrocarbon group, an alkoxy group, and a halogen atom, 1's are each independently an integer of to 4, R 3 represents any one of a hydrogen atom, an aliphatic hydrocarbon group, an aromatic ring-containing hydrocarbon group, an alkoxy group, and a halogen atom, n is an integer of 1 to 6, asterisks each are a bonding point on any of the three aromatic rings shown in the formula, and two asterisks may be bonded to the same aromatic ring or may be bonded to different aromatic rings), wherein at least one of R 2 and R 3 present in the resin is an aliphatic hydrocarbon group having 9 to 24 carbon atoms, and 20 mol % or more of X is a structural moiety in which a value of k is 1. 2. A composition comprising the resin containing phenolic hydroxyl groups according to claim 1 . 3. A cured product, which is formed by curing the composition according to claim 2 . 4. The cured product according to claim 3 , which is a resist film. 5. A method of producing a resin containing phenolic hydroxyl groups, comprising: reacting a triarylmethane compound (A) having a molecular structure represented by Structural Formula (4) or (5) with an aldehyde compound (B) as essential components, to thereby obtain a novolac resin intermediate, and reacting the novolac resin intermediate with an alkene compound (C) having 9 to 24 carbon atoms: (wherein k is any one of 0, 1, and 2, R 2 's each independently represent any one of a hydrogen atom, an aliphatic hydrocarbon group, an aromatic ring-containing hydrocarbon group, an alkoxy group, and a halogen atom, 1's are each independently an integer of to 4, R 3 represents any one of a hydrogen atom, an aliphatic hydrocarbon group, an aromatic ring-containing hydrocarbon group, an alkoxy group, and a halogen atom, m is an integer of 1 to 4, and n is an integer of 1 to 6).

Assignees

Inventors

Classifications

  • Condensation products of carbonyl compounds and phenolic compounds, e.g. novolak resins · CPC title

  • with polyhydric phenols · CPC title

  • C08G8/20Primary

    with polyhydric phenols · CPC title

  • of aldehydes · CPC title

  • Macromolecular quinonediazides; Macromolecular additives, e.g. binders {(G03F7/0226 takes precedence)} · CPC title

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What does patent US10414850B2 cover?
Provided are a resin containing phenolic hydroxyl groups having excellent developability, heat resistance, and substrate followability, a photosensitive composition, a curable composition, and a resist film which contain the resin containing phenolic hydroxyl group. The resin containing phenolic hydroxyl groups obtained by reacting a novolac resin intermediate obtained by reacting a triarylmeth…
Who is the assignee on this patent?
Dainippon Ink & Chemicals
What technology area does this patent fall under?
Primary CPC classification C08G8/20. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Sep 17 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).