Method for cutting substrate of irregular pattern and display device

Patent metadata

Field	Value
Publication number	US-10414683-B2
Application number	US-201615206880-A
Country	US
Kind code	B2
Filing date	Jul 11, 2016
Priority date	Jun 26, 2013
Publication date	Sep 17, 2019
Grant date	Sep 17, 2019

Abstract

A method for cutting a substrate of irregular pattern comprises: forming a cutting line on the substrate, wherein the closed region enclosed by the cutting line is the irregular pattern that is required; forming a trough line at the cutting line; and applying an external force to the substrate so as to divide the substrate at the trough line. The method can remarkably improve accuracy and efficiency of cutting a substrate of irregular pattern.

First claim

The invention claimed is:

1. A method for cutting a substrate into an irregular pattern, comprising:
forming a cutting line on the substrate, wherein the cutting line encloses a region having the irregular pattern, the substrate is a glass substrate or a quartz substrate;
cutting the substrate along the cutting line by using a laser beam to form a trough line at the cutting line; and
applying an external force onto the substrate so as to divide the substrate at the trough line,
wherein forming the cutting line on the substrate comprises:
coating the substrate with photoresist to cover the entire substrate; and
performing exposure by means of a mask plate and development, such that the photoresist generates an entirely-retained region and a completely-removed region, wherein a boundary line of the photoresist entirely-retained region coincides with the cutting line.

2. The method according to claim 1 , wherein applying the external force on the substrate so as to divide the substrate at the trough line comprises:
applying the external force on the substrate so as to divide the substrate at the trough line through ultrasonic wave.

3. The method according to claim 2 , wherein a frequency range for the ultrasonic wave is between 20 KHz to 500 MHz.

4. The method according to claim 1 , after applying the external force on the substrate so as to divide the substrate at the trough line, further comprising:
performing a corner-trimming and/or edge-grinding process on an edge of the substrate comprising the irregular pattern.

Assignees

• Boe Technology Group Co Ltd
• Beijing Boe Display Tech Co

Inventors

• Jiang Liyuan
• Zheng Yaokun
• Qu Lianjie
• Wang Yajie
• Jiang Yanqi

Classifications

• B23K2103/50

  Inorganic materials other than metals or composite materials · CPC title

• Y10T29/49996

  Successive distinct removal operations · CPC title

• C03B33/074

  Glass products comprising an outer layer or surface coating of non-glass material · CPC title

• C03B33/04

  Cutting or splitting in curves, especially for making spectacle lenses · CPC title

• B23K26/40

  taking account of the properties of the material involved · CPC title