Apparatus and method for regulating surface temperature of polishing pad

Patent metadata

Field	Value
Publication number	US-10414018-B2
Application number	US-201715436559-A
Country	US
Kind code	B2
Filing date	Feb 17, 2017
Priority date	Feb 22, 2016
Publication date	Sep 17, 2019
Grant date	Sep 17, 2019

Abstract

There is disclosed an apparatus which can maintain a surface temperature of a polishing pad at a desired target temperature. The apparatus for regulating a surface temperature of a polishing pad, includes: a pad contact member which is contactable with a surface of the polishing pad and which has a heating flow passage and a cooling flow passage formed therein; a heating-liquid supply pipe coupled to the heating flow passage; a cooling-liquid supply pipe coupled to the cooling flow passage; a first flow control valve attached to the heating-liquid supply pipe; a second flow control valve attached to the cooling-liquid supply pipe; a pad-temperature measuring device configured to measure a surface temperature of the polishing pad; and a valve controller configured to operate the first flow control valve and the second flow control valve based on the surface temperature of the polishing pad.

First claim

What is claimed is:

1. An apparatus for regulating a surface temperature of a polishing pad, comprising:
a pad contact member which is arranged to perform heat exchange with a surface of the polishing pad and which has a heating flow passage and a cooling flow passage formed therein, the heating flow passage and the cooling flow passage extending adjacent to each other and extending in a spiral shape, the heating flow passage and the cooling flow passage including first arc-shaped flow passages and second arc-shaped flow passages, respectively, which are arranged alternately along a direction from a center to a periphery of the pad contact member, the heating flow passage having a first inlet and a first outlet, the cooling flow passage having a second inlet and a second outlet, the first inlet and the second inlet being located at the periphery of the pad contact member, the first outlet and the second outlet being located at the center of the pad contact member;
a heating-liquid supply pipe coupled to the first inlet of the heating flow passage;
a cooling-liquid supply pipe coupled to the second inlet of the cooling flow passage;
a heating-liquid return pipe coupled to the first outlet of the heating flow passage;
a cooling-liquid discharge pipe coupled to the second outlet of the cooling flow passage;
a first flow control valve attached to the heating-liquid supply pipe;
a second flow control valve attached to the cooling-liquid supply pipe;
a pad-temperature measuring device configured to measure a surface temperature of the polishing pad; and
a valve controller configured to operate the first flow control valve and the second flow control valve based on the surface temperature of the polishing pad.

2. The apparatus according to claim 1 , wherein the heating flow passage and the cooling flow passage are symmetrical with respect to a radial direction of the polishing pad.

3. The apparatus according to claim 1 , wherein the valve controller is configured to determine a manipulated variable for the first flow control valve and a manipulated variable for the second flow control valve which are necessary to eliminate a difference between a target temperature and the surface temperature of the polishing pad.

4. The apparatus according to claim 1 , wherein where a manipulated variable for the first flow control valve and a manipulated variable for the second flow control valve are each expressed as a numerical value ranging from 0% to 100%, the valve controller is configured to determine the manipulated variable for one of the first flow control valve and the second flow control valve by subtracting the manipulated variable for the other one of the first flow control valve and the second flow control valve from 100%.

5. The apparatus according to claim 1 , wherein the heating flow passage further includes first oblique flow passages that couple the first arc-shaped flow passages to each other, and the cooling flow passage further includes second oblique flow passages that couple the second arc-shaped flow passages to each other.

6. The apparatus according to claim 1 , wherein each of the first arc-shaped flow passages has a constant curvature, and each of the second arc-shaped flow passages has a constant curvature.

7. The apparatus according to claim 1 , wherein an outermost one of the first arc-shaped flow passages and an outermost one of the second arc-shaped flow passages are located at the periphery of the pad contact member.

8. An apparatus for regulating a surface temperature of a polishing pad, comprising:
a pad contact member which is arranged to perform heat exchange with a surface of the polishing pad and which has a heating flow passage and a cooling flow passage formed therein, the heating flow passage having a first inlet and a first outlet, the cooling flow passage having a second inlet and a second outlet, the first inlet and the second inlet being located at the periphery of the pad contact member, the first outlet and the second outlet being located at the center of the pad contact member;
a heating-liquid supply pipe coupled to the first inlet of to the heating flow passage;
a cooling-liquid supply pipe coupled to the second inlet of to the cooling flow passage, the cooling-liquid supply pipe being separated from the heating-liquid supply pipe;
a heating-liquid return pipe coupled to the first outlet of the heating flow passage;
a cooling-liquid discharge pipe coupled to the second outlet of the cooling flow passage;
a first flow control valve attached to the heating-liquid supply pipe;
a second flow control valve attached to the cooling-liquid supply pipe;
a pad-temperature measuring device configured to measure a surface temperature of the polishing pad; and
a valve controller configured to operate the first flow control valve and the second flow control valve based on the surface temperature of the polishing pad.

9. The apparatus according to claim 8 , wherein the heating flow passage and the cooling flow passage extend adjacent to each other and extend in a spiral shape.

10. The apparatus according to claim 9 , wherein the heating flow passage includes first oblique flow passages, and the cooling flow passage includes second oblique flow passages.

11. The apparatus according to claim 1 , wherein the heating flow passage and the cooling flow passage are point-symmetrical and have a same length.

12. The apparatus according to claim 1 , wherein an outermost one of the first arc-shaped flow passages has the first inlet, an outermost one of the second arc-shaped flow passages has the second inlet.

13. The apparatus according to claim 1 , wherein the first inlet and the second inlet are located symmetrically with respect to the center of the pad contact member.

14. The apparatus according to claim 8 , wherein the heating flow passage and the cooling flow passage are point-symmetrical and have a same length.

15. The apparatus according to claim 8 , wherein the first inlet and the second inlet are located symmetrically with respect to the center of the pad contact member.

Assignees

• Ebara Corp

Inventors

• Maruyama Toru
• Matsuo Hisanori
• Motoshima Yasuyuki
• Eto Yohei
• Komatsu Mitsunori

Classifications

• B24B55/03

  designed as a complete equipment for feeding or clarifying coolant · CPC title

• B24B37/20

  Lapping pads for working plane surfaces · CPC title

• B24B37/30

  for single side lapping of plane surfaces · CPC title

• B24B37/005 Primary

  Control means for lapping machines or devices · CPC title

• B24B37/34

  Accessories · CPC title