Patterning device defect detection systems and methods
US-2024210336-A1 · Jun 27, 2024 · US
US10408753B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10408753-B2 |
| Application number | US-201213490416-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 6, 2012 |
| Priority date | Jul 6, 2011 |
| Publication date | Sep 10, 2019 |
| Grant date | Sep 10, 2019 |
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A method for calculating electromagnetic scattering properties of a finite periodic structure having a direction of periodicity is disclosed. The method numerically calculates electromagnetic scattering properties using spatial discretization in the direction of periodicity and numerically calculates electromagnetic scattering properties using spectral discretization in a direction orthogonal to the direction of periodicity.
Opening claim text (preview).
The invention claimed is: 1. A method comprising: illuminating, using an illumination system, a finite periodic structure with radiation, wherein the finite periodic structure comprises a direction of periodicity and was formed using a lithographic process of a lithographic apparatus; detecting, using a detection system, an electromagnetic scattering property arising from the illumination of the finite periodic structure using the illumination system; estimating, using a processing unit operatively coupled to the detection system, at least one structural parameter; determining, using the processing unit, at least one model electromagnetic scattering property from the at least one structural parameter; comparing, using the processing unit, the detected electromagnetic scattering property to the at least one model electromagnetic scattering property; determining, using the processing unit, an approximate structure of the finite periodic structure based on the results of the comparison, wherein the model electromagnetic scattering property is calculated by numerically calculating electromagnetic scattering properties using spatial discretization of the finite periodic structure in the direction of periodicity and numerically calculating the electromagnetic scattering properties using spectral discretization of the finite periodic structure in a direction orthogonal to the direction of periodicity; and wherein the approximate structure of the finite periodic structure is configured to be used to make adjustments to the lithographic process for a subsequent substrate. 2. The method of claim 1 , further comprising modeling a pair of matched layers spaced apart on either side of the finite periodic structure in the direction orthogonal to the direction of periodicity. 3. The method of claim 1 , further comprising mod matched layers around an area of illumination of the finite periodic structure. 4. The method of claim 1 , further comprising associatively combining scattering matrices of a plurality of periods of the finite periodic structure. 5. The method of claim 4 , wherein the associatively combining scattering matrices comprises using a Redheffer product. 6. The method of claim 1 , wherein the electromagnetic scattering properties comprise reflection coefficients. 7. The method of claim 1 , wherein the electromagnetic scattering properties comprise diffraction patterns. 8. The method of claim 1 , further comprising: arranging a plurality of the model electromagnetic scattering properties in a library, wherein the comparing comprises matching the detected electromagnetic scattering property to contents of the library. 9. An inspection apparatus comprising: an illumination system configured to illuminate a finite periodic structure having a direction of periodicity with radiation, wherein the finite periodic structure was formed using a lithographic process of a lithographic apparatus; a detector configured to detect an electromagnetic scattering property arising from the illumination of the finite periodic structure using the illumination system; and a processor operatively coupled to the detection system and configured to: estimate at least one structural parameter; determine at least one model electromagnetic scattering property from the at least one structural parameter; compare the detected electromagnetic scattering property to the at least one model electromagnetic scattering property; and determine an approximate structure of the finite periodic structure from a difference between the detected electromagnetic scattering property and the at least one model electromagnetic scattering property, wherein the processor is configured to determine the model electromagnetic scattering property by: modeling a pair of matched layers spaced apart on either side of the finite periodic structure in a direction orthogonal to the direction of periodicity, and numerically calculating electromagnetic scattering properties using spatial discretization of the finite periodic structure in the direction of periodicity and numerically calculating the electromagnetic scattering properties using spectral discretization of the finite periodic structure in the direction orthogonal to the direction of periodicity, and wherein the approximate structure of the finite periodic structure is configured to be used to make adjustments to the lithographic process for a subsequent substrate. 10. The inspection apparatus of claim 9 , wherein the processor is further configured to model other matched layers around an area of illumination of the finite periodic structure. 11. The inspection apparatus of claim 9 , wherein the processor is further configured to associatively combine scattering matrices of a plurality of periods of the finite periodic structure. 12. The inspection apparatus of claim 11 , wherein to associatively combine the scattering matrices the processor is further configured to use a Redheffer product. 13. The inspection apparatus of claim 9 , wherein the electromagnetic scattering properties comprise reflection coefficients. 14. The inspection apparatus of claim 9 , wherein the electromagnetic scattering properties comprise diffraction patterns. 15. The apparatus of claim 9 , wherein the processor is further configured to: arrange a plurality of the model electromagnetic scattering properties in a library; and match the detected electromagnetic scattering property to contents of the library for the comparing. 16. The inspection apparatus of claim 9 , wherein the finite periodic structure is located on a substrate that is exposed using the lithographic apparatus. 17. The inspection apparatus of claim 16 , wherein the processor is further configured to: determine an error in the exposure of the substrate; and make adjustments to exposure of the subsequent substrate.
Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching · CPC title
Modelling or simulating from physical phenomena up to complete wafer processes or whole workflow in wafer productions · CPC title
Diffraction (for sizing particles G01N15/0205) · CPC title
Dimensions, e.g. line width, critical dimension [CD], profile, sidewall angle or edge roughness · CPC title
Scattering, i.e. diffuse reflection (G01N21/25, G01N21/41 take precedence {G01N21/55 takes precedence}) · CPC title
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