Workpiece treating method, temporary fixing composition, semiconductor device, and process for manufacturing the same

Patent metadata

Field	Value
Publication number	US-10407598-B2
Application number	US-201615763446-A
Country	US
Kind code	B2
Filing date	Jul 26, 2016
Priority date	Sep 28, 2015
Publication date	Sep 10, 2019
Grant date	Sep 10, 2019

Abstract

In a method in which a workpiece, while being temporarily fixed on a support via a temporary fixing material, is processed and/or transported and thereafter the support and the workpiece are separated from each other by an irradiation separation method, a technique is shown which prevents the photo-degradation of the workpiece.
A workpiece treating method includes a step of forming a stack including a support, a temporary fixing material and a workpiece wherein the temporary fixing material includes a layer (I) that contains a polymer (A) including a structural unit (A1); a step of processing the workpiece and/or transporting the stack; a step of applying light to the layer (I) through the support; and a step of separating the support and the workpiece from each other.

First claim

The invention claimed is:

1. A workpiece treating method comprising:
a step (1) of forming a stack including a support, a temporary fixing material and a workpiece wherein the temporary fixing material comprises a layer (I) that contains a polymer (A) including a structural unit represented by the formula (A2) below, and the workpiece is held on the temporary fixing material;
a step (2) of processing the workpiece and/or transporting the stack;
a step (3) of applying light to the layer (I) through the support; and
a step (4) of separating the support and the workpiece from each other,

wherein in the formula (A2),
Ar is a condensed polycyclic aromatic ring;
—OR 1 is a group bonded to the condensed polycyclic aromatic ring wherein R 1 is a hydrogen atom or a hydrocarbon group with 1 to 20 carbon atoms and when a plurality of —OR 1 are present, the —OR 1 groups may be the same as or different from one another;
R 2 is a group bonded to the condensed polycyclic aromatic ring and indicates a halogen atom or a hydrocarbon group with 1 to 20 carbon atoms wherein when a plurality of R 2 are present, the R 2 groups may be the same as or different from one another;
R 3 groups are each a hydrogen atom or an organic group and the R 3 groups may be the same as or different from one another; and
a1 is an integer of 2 or greater and b is an integer of 0 or greater.

2. The workpiece treating method according to claim 1 , wherein the temporary fixing material further comprises an adhesive layer (II).

3. The workpiece treating method according to claim 2 , wherein the stack has the support, the layer (I), the adhesive layer (II) and the workpiece stacked in the order named.

4. The workpiece treating method according to claim 1 , wherein the step (1) comprises forming a workpiece having at least a wiring layer, on the temporary fixing material.

5. The workpiece treating method according to claim 4 , wherein the processing in the step (2) comprises arranging at least one selected from semiconductor wafers and semiconductor chips onto the wiring layer.

6. The workpiece treating method according to claim 1 , wherein the light in the step (3) is a UV light.

7. The workpiece treating method according to claim 6 , wherein the UV light is a UV light having a wavelength of 300 to 400 nm.

8. The workpiece treating method according to claim 1 , wherein the thickness of the layer (I) is 0.1 to 500 μm.

9. The workpiece treating method according to claim 1 , wherein the condensed polycyclic aromatic ring in the formula (A2) is a naphthalene ring.

10. The workpiece treating method according to claim 1 , wherein R 1 in the formula (A2) is a hydrogen atom or an alkynyl group.

11. A temporary fixing composition comprising a polymer (A) including a structural unit represented by the following formula (A2):

wherein in the formula (A2),
Ar is a condensed polycyclic aromatic ring;
—OR 1 is a group bonded to the condensed polycyclic aromatic ring wherein R 1 is a hydrogen atom or a hydrocarbon group with 1 to 20 carbon atoms and when a plurality of —OR 1 are present, the —OR 1 groups may be the same as or different from one another;
R 2 is a group bonded to the condensed polycyclic aromatic ring and indicates a halogen atom or a hydrocarbon group with 1 to 20 carbon atoms wherein when a plurality of R 2 are present, the R 2 groups may be the same as or different from one another;
R 3 groups are each a hydrogen atom or an organic group and the R 3 groups may be the same as or different from one another; and
a1 is an integer of 2 or greater and b is an integer of 0 or greater.

12. The temporary fixing composition according to claim 11 , further comprising a solvent.

13. The temporary fixing composition according to claim 11 , wherein the proportion of the content of the polymer (A) is not less than 50 mass % of the solid content of the temporary fixing composition taken as 100 mass %.

14. A semiconductor device manufacturing process comprising:
a step (1) of forming a stack including a support, a temporary fixing material and a wiring layer wherein the temporary fixing material comprises a layer (I) that contains a polymer (A) including a structural unit represented by the formula (A2) below, and the wiring layer is formed on the temporary fixing material;
a step (2) of arranging at least one selected from semiconductor wafers and semiconductor chips onto the wiring layer;
a step (3) of applying light to the layer (I) through the support; and
a step (4) of separating the support and the wiring layer from each other,

wherein in the formula (A2),
Ar is a condensed polycyclic aromatic ring;
—OR 1 is a group bonded to the condensed polycyclic aromatic ring wherein R 1 is a hydrogen atom or a hydrocarbon group with 1 to 20 carbon atoms and when a plurality of —OR 1 are present, the —OR 1 groups may be the same as or different from one another;
R 2 is a group bonded to the condensed polycyclic aromatic ring and indicates a halogen atom or a hydrocarbon group with 1 to 20 carbon atoms wherein when a plurality of R 2 are present, the R 2 groups may be the same as or different from one another;
R 3 groups are each a hydrogen atom or an organic group and the R 3 groups may be the same as or different from one another; and
a1 is an integer of 2 or greater and b is an integer of 0 or greater.

15. A semiconductor device obtained by the semiconductor device manufacturing process described in claim 14 .

Assignees

• Jsr Corp

Inventors

• Mori Takashi
• Mizuno Hikaru

Classifications

• H10P72/7422

  used to protect an active side of a device or wafer · CPC title

• H10P72/744

  Details of chemical or physical process used for separating the auxiliary support from a device or a wafer · CPC title

• H10P72/743

  used as a support during manufacture of interconnect decals or build up layers · CPC title

• H10P72/74 Primary

  using temporarily an auxiliary support · CPC title

• H10P72/7448

  the bond interface between the auxiliary support and the wafer comprising two or more, e.g. multilayer adhesive or adhesive and release layer · CPC title