Microphone device with integrated pressure sensor

Patent metadata

Field	Value
Publication number	US-10405078-B2
Application number	US-201816206916-A
Country	US
Kind code	B2
Filing date	Nov 30, 2018
Priority date	May 26, 2016
Publication date	Sep 3, 2019
Grant date	Sep 3, 2019

Abstract

A microphone device comprises a microphone die including a microphone motor, an acoustic integrated circuit structured to process signals produced by the microphone motor, and a sensor die stacked on top of the acoustic integrated circuit, wherein the sensor die comprises a pressure sensor. Another microphone comprises a microphone die including a microphone motor and an integrated circuit die. The integrated circuit die comprises an acoustic integrated circuit structured to process signals produced by the microphone motor, a pressure sensor, and a pressure integrated circuit structured to press signals produced by the pressure sensor.

First claim

What is claimed is:

1. A microphone device comprising:
a substrate;
a cover attached to the substrate that forms a housing interior with the substrate;
a microphone die disposed in the housing interior, wherein the microphone die includes a microphone motor including a diaphragm and a backplate opposing the diaphragm;
an acoustic integrated circuit structured to process signals produced by the microphone motor; and
a sensor die disposed in the housing interior and stacked on top of the acoustic integrated circuit, wherein the sensor die comprises a pressure sensor and a one-time programmable memory, wherein the pressure sensor carried by the sensor die is calibrated after the sensor die is integrated into the microphone device and calibration information of the pressure sensor is stored in the one-time programmable memory.

2. The microphone device of claim 1 , wherein the acoustic integrated circuit is disposed in the housing interior and attached to the substrate, and wherein a back surface of the sensor die is attached to the acoustic integrated circuit through a low-pressure adhesive.

3. The microphone device of claim 1 , wherein the acoustic integrated circuit is embedded in the substrate, and wherein the microphone die is disposed at least partially over the acoustic integrated circuit.

4. The microphone device of claim 1 , wherein the microphone motor is a first microphone motor, the diaphragm is a first diaphragm, the backplate is a first backplate, and the microphone die further comprises a second microphone motor including a second diaphragm and a second backplate.

5. The microphone device of claim 4 , wherein voltages of opposite polarities are applied to the first diaphragm and the second diaphragm.

6. The microphone device of claim 4 , wherein voltages of opposite polarities are applied to the first backplate and the second backplate.

7. The microphone device of claim 4 , wherein the first backplate is disposed over the first diaphragm and the second diaphragm is disposed over the second backplate.

8. The microphone device of claim 7 , wherein voltages of a same polarity are applied to the first diaphragm and the second backplate.

9. The microphone device of claim 1 , wherein the microphone motor is a microelectromechanical systems (MEMS) microphone.

10. The microphone device of claim 1 , wherein the sensor die further comprises a temperature sensor.

11. A microphone device comprising:
a substrate;
a cover attached to the substrate that forms a housing interior with the substrate;
a microphone die disposed in the housing interior, wherein the microphone die includes a microphone motor, and wherein the microphone motor includes a diaphragm and a backplate opposing the diaphragm; and
an integrated circuit die comprising an acoustic integrated circuit structured to process signals produced by the microphone motor, a pressure sensor, and a pressure integrated circuit structured to process signals produced by the pressure sensor, wherein the pressure sensor is calibrated after the integrated circuit die is integrated into the microphone device and calibration information of the pressure sensor is stored in a one-time programmable memory included in the integrated circuit die.

12. The microphone device of claim 11 , wherein the integrated circuit die further comprises a temperature sensor.

13. The microphone device of claim 11 , wherein the microphone motor is a first microphone motor, the diaphragm is a first diaphragm, the backplate is a first backplate, and the microphone die further comprises a second microphone motor including a second diaphragm and a second backplate.

14. The microphone device of claim 13 , wherein voltages of opposite polarity are applied to the first backplate and the second backplate.

15. The microphone device of claim 13 , wherein the first diaphragm is disposed between the first backplate and the substrate, and wherein the second backplate is disposed between the second diaphragm and the substrate.

16. The microphone device of claim 15 , wherein voltages of a same polarity are applied to the first diaphragm and the second backplate.

17. The microphone device of claim 13 , wherein voltages of opposite polarity are applied to the first diaphragm and the second diaphragm.

18. The microphone device of claim 11 , further comprising a port formed in the substrate and a mesh that covers the port to protect the housing interior.

19. The microphone device of claim 11 , wherein the pressure sensor includes a piezo-resistive transducer.

20. The microphone device of claim 11 , wherein the pressure sensor is a microelectromechanical systems (MEMS) pressure sensor.

21. The microphone device of claim 11 , wherein the microphone motor is a microelectromechanical systems (MEMS) microphone.

Assignees

• Knowles Electronics Llc

Inventors

• Chandrasekaran Venkataraman
• Furst Claus
• Watson Joshua
• Szczech John

Classifications

• H10W70/681

  comprising holes not having chips therein, e.g. for outgassing, underfilling or bond wire passage · CPC title

• H04R19/04

  Microphones (H04R19/01 takes precedence) · CPC title

• B81B2201/012

  characterised by the shape · CPC title

• B81C1/00238

  Joining a substrate with an electronic processing unit and a substrate with a micromechanical structure · CPC title

• H04R1/04

  Structural association of microphone with electric circuitry therefor (in electric hearing aids H04R25/00) · CPC title