Microphone device with integrated pressure sensor

Patent metadata

Field	Value
Publication number	US-10149031-B2
Application number	US-201715604414-A
Country	US
Kind code	B2
Filing date	May 24, 2017
Priority date	May 26, 2016
Publication date	Dec 4, 2018
Grant date	Dec 4, 2018

Abstract

A microphone device comprises a microphone die including a first microphone motor and a second microphone motor, an acoustic integrated circuit structured to process signals produced by the first microphone motor and the second microphone motor, and a sensor die stacked on top of the acoustic integrated circuit, wherein the sensor die comprises a pressure sensor. Another microphone comprises a microphone die including a first microphone motor and a second microphone motor and an integrated circuit die. The integrated circuit die comprises an acoustic integrated circuit structured to process signals produced by the first microphone motor and the second microphone motor, a pressure sensor, and a pressure integrated circuit structured to press signals produced by the pressure sensor.

First claim

What is claimed is:

1. A microphone device comprising:
a substrate;
a port formed in the substrate;
a cover attached to the substrate that forms a housing interior with the substrate;
a microphone die disposed in the housing interior and on top of the port, wherein the microphone die includes a first microphone motor and a second microphone motor, wherein the first microphone motor includes a first diaphragm and a first backplate opposing the first diaphragm, and wherein the second microphone motor includes a second diaphragm and a second backplate opposing the second diaphragm;
an acoustic integrated circuit structured to process signals produced by the first microphone motor and the second microphone motor; and
a sensor die disposed in the housing interior and stacked on top of the acoustic integrated circuit, wherein the sensor die comprises a pressure sensor and a one-time programmable memory, wherein the pressure sensor carried by the sensor die is calibrated after the sensor die is integrated into the microphone device and calibration information of the pressure sensor is stored in the one-time programmable memory.

2. The microphone device of claim 1 , wherein the acoustic integrated circuit is disposed in the housing interior and attached to the substrate.

3. The microphone device of claim 2 , wherein a back surface of the sensor die is attached to the acoustic integrated circuit through a low-pressure adhesive.

4. The microphone device of claim 1 , wherein the acoustic integrated circuit is embedded in the substrate.

5. The microphone device of claim 4 , wherein the microphone die is disposed at least partially over the acoustic integrated circuit.

6. The microphone device of claim 1 , wherein the second microphone motor is disposed alongside the first microphone motor, and wherein the first microphone motor and the second microphone motor are in a differential output configuration.

7. The microphone device of claim 6 , wherein voltages of opposite polarities are applied to the first diaphragm and the second diaphragm.

8. The microphone device of claim 6 , wherein the second diaphragm and the second backplate are flipped compared to the first diaphragm and the first backplate.

9. The microphone device of claim 8 , wherein the acoustic integrated circuit is an application specific integrated circuit (ASIC) die.

10. The microphone device of claim 1 , wherein the first microphone motor and the second microphone motor are microelectro mechanical system (MEMS) microphones, and wherein the pressure sensor is a MEMS pressure sensor.

11. The microphone device of claim 1 , wherein the sensor die further comprises a temperature sensor.

12. A microphone device comprising:
a substrate;
a port formed in the substrate;
a cover attached to the substrate that forms a housing interior with the substrate;
a microphone die disposed in the housing interior and on top of the port, wherein the microphone die includes a first microphone motor and a second microphone motor, wherein the first microphone motor includes a first diaphragm and a first backplate opposing the first diaphragm, and wherein the second microphone motor includes a second diaphragm and a second backplate opposing the second diaphragm; and
an integrated circuit die disposed in the housing interior and attached to the substrate, wherein the integrated circuit die comprises an acoustic integrated circuit structured to process signals produced by the first microphone motor and the second microphone motor, a pressure sensor, and a pressure integrated circuit structured to process signals produced by the pressure sensor, wherein the pressure sensor is calibrated after the integrated circuit die is integrated into the microphone device and calibration information of the pressure sensor is stored in a one-time programmable memory included in the integrated circuit die.

13. The microphone device of claim 12 , wherein the second microphone motor is disposed alongside the first microphone motor, and wherein the first microphone motor and the second microphone motor are in a differential output configuration.

14. The microphone of claim 13 , wherein voltages of opposite polarities are applied to the first diaphragm and the second diaphragm.

15. The microphone of claim 13 , wherein the second diaphragm and the second backplate are flipped compared to the first diaphragm and the first backplate.

16. The microphone device of claim 12 , wherein the integrated circuit die further comprises a temperature sensor.

Assignees

• Knowles Electronics Llc

Inventors

• Chandrasekaran Venkataraman
• Furst Claus
• Watson Joshua
• Szczech John

Classifications

• H10W70/681

  comprising holes not having chips therein, e.g. for outgassing, underfilling or bond wire passage · CPC title

• H04R3/005 Primary

  for combining the signals of two or more microphones (specially adapted for hearing aids H04R25/407) · CPC title

• B81C1/00238

  Joining a substrate with an electronic processing unit and a substrate with a micromechanical structure · CPC title

• H04R19/04

  Microphones (H04R19/01 takes precedence) · CPC title

• B81B7/02

  containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS] (B81B7/04 takes precedence) · CPC title