Reactive 2-component adhesive film system

US10400140B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10400140-B2
Application numberUS-201414894804-A
CountryUS
Kind codeB2
Filing dateJun 5, 2014
Priority dateJun 17, 2013
Publication dateSep 3, 2019
Grant dateSep 3, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Reactive adhesive film, comprising (a) a polymeric film-forming matrix, (b) at least one reactive monomer or reactive resin, and (c) a reagent selected from the group consisting of a radical initiator and an activator, and a reactive 2-component adhesive film system for bonding various materials, such as metal, wood, glass and/or plastic.

First claim

Opening claim text (preview).

The invention claimed is: 1. A solid-form reactive adhesive film, comprising: (a) an inert thermoplastic polyurethane film-forming matrix; (b) an at least one reactive monomer selected from the group consisting of methyl methacrylate, methacrylic acid, cyclohexyl methacrylate, tetrahydrofurfuryl methacrylate, 2-phenoxyethyl methacrylate, di(ethylene glycol)methyl ether methacrylate, and ethylene glycol dimethacrylate; and (c) a reagent selected from the group consisting of a radical initiator and an activator, wherein the solid-form reactive adhesive film has pressure-sensitive adhesive properties. 2. The solid-form reactive adhesive film as claimed in claim 1 , wherein the radical initiator is a peroxide. 3. The solid-form reactive adhesive film as claimed in claim 1 , wherein the activator is an amine, a dihydropyridine derivative, a transition metal salt, or a transition metal complex. 4. The solid-form reactive adhesive film as claimed in claim 1 , wherein: i) the inert thermoplastic polyurethane film-forming matrix is present at 20 to 80% by weight of the at least one reactive monomer; and ii) the radical initiator is present at 3 to 30% by weight. 5. The solid-form reactive adhesive film as claimed in claim 1 , wherein: i) the inert thermoplastic polyurethane film-forming matrix is present at 20 to 80% by weight of the at least one reactive monomer); and ii) the activator is present at more than 0 to 40% by weight. 6. A solid-form reactive adhesive film system comprising two solid-form reactive adhesive films as claimed in claim 1 , wherein the first solid-form reactive adhesive film comprises a radical initiator and the second solid-form reactive adhesive film comprises an activator. 7. A solid-form reactive adhesive film system comprising two or more solid-form reactive adhesive films as claimed in claim 1 , wherein a first solid-form reactive adhesive film comprises a radical initiator and a second solid-form reactive adhesive film comprises an activator and these two solid-form reactive adhesive films are present alternately. 8. The solid-form reactive adhesive film system as claimed in claim 6 , further comprising films, layers, adhesives, backings, release papers and/or release liners. 9. A method for bonding materials of metal, wood, glass and/or plastic materials, where said materials are bonded with the solid-form reactive adhesive film of claim 1 . 10. A method for producing a solid-form reactive adhesive film comprising the steps of: 1. dissolving and/or finely distributing ingredients in one or more solvent(s) and/or water; 2. mixing the dissolved and/or finely distributed ingredients; 3. coating a release liner, a release paper, a backing material, or a pressure-sensitive adhesive with the mixture of dissolved and/or finely distributed ingredients; 4. evaporating the one or more solvent(s) and/or water, thereby forming a solid-form reactive adhesive film; and 5. optionally winding the solid-form reactive adhesive film into a roll, wherein: the ingredients comprise: (a) an inert thermoplastic polyurethane film-forming matrix; (b) an at least one reactive monomer selected from the group consisting of methyl methacrylate, methacrylic acid, cyclohexyl methacrylate, tetrahydrofurfuryl methacrylate, 2-phenoxyethyl methacrylate, di-(ethylene glycol)-methyl ether methacrylate, and ethylene glycol dimethacrylate; and (c) a reagent selected from the group consisting of a radical initiator and an activator; and the solid-form reactive adhesive film has pressure-sensitive adhesive properties. 11. A kit for providing a two-component adhesive film system, comprising: (i) at least one first solid-form reactive adhesive film as claimed in claim 1 comprising a radical initiator; and (ii) at least one second solid-form reactive adhesive film as claimed in claim 1 comprising an activator. 12. A composite bonded by means of the reactive adhesive film system as claimed in claim 6 . 13. A method for bonding two join partners to one another, wherein the join partners are fixed to one another by a self-adhesive bonding system and are ultimately bonded by a reactive adhesive film system as claimed in claim 6 . 14. A composite bonded by the kit as claimed in claim 11 .

Assignees

Inventors

Classifications

  • grafted on to macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds · CPC title

  • Presence of (meth)acrylic polymer · CPC title

  • Polyurethanes · CPC title

  • involving separate application of adhesive ingredients to the different surfaces to be joined · CPC title

  • {Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond} in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00 · CPC title

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What does patent US10400140B2 cover?
Reactive adhesive film, comprising (a) a polymeric film-forming matrix, (b) at least one reactive monomer or reactive resin, and (c) a reagent selected from the group consisting of a radical initiator and an activator, and a reactive 2-component adhesive film system for bonding various materials, such as metal, wood, glass and/or plastic.
Who is the assignee on this patent?
Tesa Se
What technology area does this patent fall under?
Primary CPC classification C09J7/00. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Sep 03 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).