Semiconductor device and manufacturing method of the same

Patent metadata

Field	Value
Publication number	US-10388773-B2
Application number	US-201515310244-A
Country	US
Kind code	B2
Filing date	Jul 7, 2015
Priority date	Jul 14, 2014
Publication date	Aug 20, 2019
Grant date	Aug 20, 2019

Abstract

A semiconductor device includes: a drift layer; a base layer on the drift layer; a collector layer and a cathode layer opposite to the base layer; multiple trenches penetrating the base layer; a gate electrode in each trench; an emitter region in a surface portion of the base layer and contacting each trench; a first electrode connected to the base layer and the emitter region; and a second electrode connected to the collector layer and the cathode layer. The gate electrodes in a diode region of a semiconductor substrate are controlled independently from the gate electrodes in the IGBT region. A voltage not forming an inversion layer in the base layer is applied to the gate electrodes in the diode region.

First claim

The invention claimed is:

1. A semiconductor device comprising:
a semiconductor substrate including a drift layer having a first conductive type;
a base layer having a second conductive type and disposed on the drift layer;
a collector layer having the second conductive type and a cathode layer having the first conductive type which are disposed on the drift layer opposite to the base layer;
a plurality of trenches penetrating the base layer and reaching the drift layer;
a gate insulation film disposed on a sidewall of each trench;
a gate electrode disposed on the gate insulation film;
an emitter region disposed in a surface portion of the base layer, contacting each trench, and having the first conductive type;
a first electrode electrically connected to the base layer and the emitter region; and
a second electrode electrically connected to the collector layer and the cathode layer, wherein:
the semiconductor substrate includes an IGBT region for functioning as an IGBT element and a diode region for functioning as a diode element;
the plurality of trenches are disposed in each of the IGBT region and the diode region;
at least a part of gate electrodes disposed in the diode region is controlled independently from at least a part of gate electrodes disposed in the IGBT region;
a voltage not forming an inversion layer, which connects between the first electrode and the drift layer, in the base layer is applied to the at least the part of gate electrodes disposed in the diode region;
the at least the part of gate electrodes in the diode region has an electric potential equal to the emitter region in the diode region;
the gate electrode in the diode region is connected to the emitter region in the diode region via the first electrode;
the gate electrode in the IGBT region is insulated from the first electrode by an interlayer insulation film;
the gate electrode in the diode region is connected to the first electrode via a contact hole disposed in the interlayer insulation film;
each gate electrode disposed in the IGBT region includes an element gate electrode and a dummy gate electrode;
the element gate electrode and the dummy gate electrode are controlled independently from each other;
a voltage for functioning the IGBT element is applied to the element gate electrode; and
the voltage not forming the inversion layer, which connects between the first electrode and the drift layer, in the base layer is applied to the dummy gate electrode; and
the at least the part of gate electrodes disposed in the diode region and the dummy gate electrode are connected to a common gate pad different from the other gate pad which is connected to the element gate electrode.

2. The semiconductor device according to claim 1 , wherein:
the at least the part of gate electrodes disposed in the diode region is electrically connected to the first electrode; and
the at least the part of gate electrodes disposed in the diode region has an electric potential equal to the emitter region.

3. The semiconductor device according to claim 1 , wherein:
the first electrode in the diode region is electrically connected to the gate electrode in the diode region via the contact hole.

4. The semiconductor device according to claim 1 , wherein:
the element gate electrode and the dummy gate electrode are arranged alternately in a direction perpendicular to a longitudinal direction of the trenches, which is in parallel to a surface of the semiconductor substrate.

5. The semiconductor device according to claim 1 , further comprising:
a body region disposed in another surface portion of the base layer, wherein:
the emitter region is disposed on both sidewalls of each trench; and
the body region is sandwiched between the emitter region on a sidewall of one trench and the emitter region on another sidewall of an adjacent trench.

6. The semiconductor device according to claim 1 , wherein:
the body region does not contact each trench.

Assignees

• Denso Corp

Inventors

• Sumitomo Masakiyo
• Takahashi Shigeki

Classifications

• H10W72/926

  Multiple bond pads having different sizes · CPC title

• H01L27/0635

  Electricity · mapped topic

• H01L29/66348

  Electricity · mapped topic

• H01L29/8613

  Electricity · mapped topic

• H01L29/4236

  Electricity · mapped topic