Propylene-based resin foam particle and foam particle molded body

US10385178B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10385178-B2
Application numberUS-201415111760-A
CountryUS
Kind codeB2
Filing dateDec 24, 2014
Priority dateJan 17, 2014
Publication dateAug 20, 2019
Grant dateAug 20, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The present invention is concerned with expanded propylene resin beads including a core layer being in a foamed state and constituted of a propylene-based resin composition (a) and a cover layer constituted of an olefin-based resin (b), the propylene-based resin composition (a) satisfying the following (i) and (ii), and the olefin-based resin (b) satisfying the following (iii) or (iv). (i) A mixture of 75% by weight to 98% by weight of a propylene-based resin (a1) having a melting point of 100° C. to 140° C. and 25% by weight to 2% by weight of a propylene-based resin (a2) having a melting point of 140° C. to 165° C. (ii) A difference between the melting point of the resin (a2) and the melting point of the resin (a1) is 15° C. or more. (iii) A crystalline olefin-based resin having a melting point TmB that is lower than a melting point TmA of the composition (a) and having a relation of 0° C.<[TmA−TmB]≤80° C. (iv) A non-crystalline olefin-based resin having a softening point TsB that is lower than TmA and having a relation of 0° C.<[TmA−TsB]≤100° C.

First claim

Opening claim text (preview).

The invention claimed is: 1. Expanded propylene resin beads comprising a core layer being in a foamed state and comprising a propylene-based resin composition (a) and a cover layer comprising an olefin-based resin (b), the propylene-based resin composition (a) satisfying the following (i) and (ii), and the olefin-based resin (b) satisfying the following (iii) or (iv): (i) the propylene-based resin composition (a) is a mixture of 85% by weight to 98% by weight of a propylene-based resin (a1) having a melting point of 100° C. to 140° C. and 15% by weight to 2% by weight of a propylene-based resin (a2) having a melting point of 140° C. or more and less than 165° C., provided that a sum total of the propylene-based resin (a1) and the propylene-based resin (a2) is 100% by weight; (ii) a difference between the melting point of the propylene-based resin (a2) and the melting point of the propylene-based resin (a1) [(melting point of a2)−(melting point of a1)] is 15° C. or more; (iii) the olefin-based resin (b) is a crystalline olefin-based resin having a melting point (TmB) that is lower than a melting point (TmA) of the propylene-based resin composition (a), with a difference between the melting point (TmA) and the melting point (TmB) [TmA−TmB] being more than 0° C. and 80° C. or less; and (iv) the olefin-based resin (b) is a non-crystalline olefin-based resin having a softening point (TsB) that is lower than the melting point (TmA) of the propylene-based resin composition (a), with a difference between the melting point (TmA) and the softening point (TsB) [TmA−TsB] being more than 0° C. and 100° C. or less, wherein the propylene-based resin (a1) is a propylene-based random copolymer produced in the presence of a metallocene-based polymerization catalyst, and the propylene-based resin (a2) is a propylene-based copolymer and wherein a melt flow rate range for the propylene-based resin (a1) is from 1 to 100 g/10 min. and a melt flow range for the propylene-based resin (a2) is from 6 to 20 g/10 min. 2. The expanded propylene resin beads according to claim 1 , wherein in a first time DSC curve obtained by the heat flux differential scanning calorimetry when heated from ambient temperature to 200° C. at a heating rate of 2° C./min, the expanded propylene resin beads show a main endothermic peak in which a peak top temperature of the endothermic peak is 100° C. to 140° C. and one endothermic peak on the high temperature side of the main endothermic peak appears, and the main endothermic peak calorific value of 70% to 95% relative to a total endothermic peak calorific value. 3. The expanded propylene resin beads according to claim 1 , wherein in the item (ii), the difference in melting point between the propylene-based resin (a2) and the propylene-based resin (a1) [(melting point of a2)−(melting point of a1)] is 15 to 25° C. 4. The expanded propylene resin beads according to claim 1 , wherein the propylene-based resin (a1) and the propylene-based resin (a2) are a propylene-based resin produced in the presence of a metallocene-based polymerization catalyst. 5. The expanded propylene resin beads according to claim 1 , wherein the propylene-based resin composition (a) has a flexural modulus of 800 MPa to 1,200 MPa. 6. The expanded propylene resin beads according to claim 1 , wherein the propylene-based resin composition (a) has a content of the propylene-based resin (a1) of more than 90% by weight and 98% by weight or less and a content of the propylene-based resin (a2) of 2% by weight or more and less than 10% by weight. 7. The expanded propylene resin beads according to claim 1 , wherein the olefin-based resin (b) is a propylene-based resin produced in the presence of a metallocene-based polymerization catalyst. 8. The expanded propylene resin beads according to claim 1 , wherein the olefin-based resin (b) is an ethylene-based resin produced in the presence of a metallocene-based polymerization catalyst. 9. An expanded propylene resin beads molded article obtained through in-mold molding of the expanded propylene resin beads according to claim 1 . 10. The expanded propylene resin beads according to claim 1 , wherein the propylene-based resin (a1) has a melting point of 110° C. to 140° C. 11. The expanded propylene resin beads according to claim 1 , wherein the propylene-based resin (a1) has a melting point of 120° C. to 140° C. 12. The expanded propylene resin beads according to claim 1 , wherein the propylene-based resin (a1) has a melting point of 125° C. or more and less than 140° C. 13. The expanded propylene resin beads according to claim 1 , wherein the propylene-based resin (a1) has a melting point of 130° C. or more and less than 140° C. 14. The expanded propylene resin beads according to claim 1 , wherein the propylene-based resin (a1) has a melting point of 135° C. or more and less than 140° C. 15. The expanded propylene resin beads according to claim 1 , wherein the propylene-based resin (a2) has a melting point of 145° C. or more and less than 165° C. 16. The expanded propylene resin beads according to claim 1 , wherein the propylene-based resin (a2) has a melting point of 150° C. or more and less than 165° C. 17. The expanded propylene resin beads according to claim 1 , wherein the propylene-based resin (a2) has a melting point of 150° C. to 160° C. 18. The expanded propylene resin beads according to claim 1 , wherein the melt flow rate range for the propylene-based resin (a1) is from 2 to 8 g/10 min.

Assignees

Inventors

Classifications

  • Ethene-propene or ethene-propene-diene copolymers · CPC title

  • Ethene-propene or ethene-propene-diene copolymers · CPC title

  • Copolymers of propene (C08J2323/16 takes precedence) · CPC title

  • by sintering expandable particles · CPC title

  • Surface treatment · CPC title

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Frequently asked questions

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What does patent US10385178B2 cover?
The present invention is concerned with expanded propylene resin beads including a core layer being in a foamed state and constituted of a propylene-based resin composition (a) and a cover layer constituted of an olefin-based resin (b), the propylene-based resin composition (a) satisfying the following (i) and (ii), and the olefin-based resin (b) satisfying the following (iii) or (iv). …
Who is the assignee on this patent?
Jsp Corp
What technology area does this patent fall under?
Primary CPC classification C08J9/16. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Aug 20 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).