Polypropylene-based resin expanded beads, and polypropylene-based resin expanded beads molded article

Patent metadata

Field	Value
Publication number	US-9230710-B2
Application number	US-201314381467-A
Country	US
Kind code	B2
Filing date	Feb 8, 2013
Priority date	Mar 5, 2012
Publication date	Jan 5, 2016
Grant date	Jan 5, 2016

Abstract

An electrostatic dissipative, polypropylene-based resin expanded bead having an expanded core layer of a polypropylene-based resin, and a cover layer that covers the expanded core layer and that is composed of a mixed resin containing electrically conductive carbon black, wherein the mixed resin includes a polypropylene resin which forms a continuous phase and a polyethylene resin which forms dispersed phases dispersed in the continuous phase, with the electrically conductive carbon black being unevenly distributed to the dispersed phases side. In-mold molding of the expanded beads gave a molded article.

First claim

The invention claimed is:

1. An electrostatic dissipative, polypropylene-based resin expanded bead comprising a polypropylene-based expanded core layer, and a polyolefin-based resin cover layer that covers the expanded core layer,
said expanded bead being obtained by foaming and expanding a composite resin particle, which has a polypropylene-based resin core layer covered with a polyolefin-based resin cover layer containing electrically conductive carbon black, in such a way that said expanded bead has an apparent density of 10 to 120 kg/m 3 ,
wherein the polyolefin-based resin that constitutes the polyolefin-based resin cover layer of said expanded bead is a mixed resin containing a polypropylene-based resin and a polyethylene-based resin,
wherein, in the polyolefin-based resin cover layer, the polypropylene-based resin forms a continuous phase, the polyethylene-based resin forms dispersed phases, and the electrically conductive carbon black is unevenly distributed to the dispersed phases side,
wherein the electrically conductive carbon black is present in an amount of 5 to 30 parts by weight per 100 parts by weight of a total amount of the polypropylene-based resin and the polyethylene-based resin, and
wherein a weight ratio of the polypropylene-based resin to the polyethylene-based resin which is 99.5:0.5 to 50:50.

2. The polypropylene-based resin expanded bead according to claim 1 , wherein the polyolefin-based cover layer of said expanded bead has an average thickness of 0.2 μm or more.

3. The polypropylene-based resin expanded bead according to claim 2 , wherein the electrically conductive carbon black is Ketjen black and present in an amount of 5 to 15 parts by weight per 100 parts by weight of the mixed resin of the polypropylene-based resin and the polyethylene-based resin.

4. A molded article that is obtained by in-mold molding of the polypropylene-based resin expanded beads according to claim 2 , said molded article having a surface resistivity of 1×10 5 to 1×10 10 Ω.

5. The polypropylene-based resin expanded bead according to claim 1 , wherein the electrically conductive carbon black is Ketjen black and present in an amount of 5 to 15 parts by weight per 100 parts by weight of the mixed resin of the polypropylene-based resin and the polyethylene-based resin.

6. A molded article that is obtained by in-mold molding of the polypropylene-based resin expanded beads according to claim 5 , said molded article having a surface resistivity of 1×10 5 to 1×10 10 Ω.

7. A molded article that is obtained by in-mold molding of the polypropylene-based resin expanded beads according to claim 1 , said molded article having a surface resistivity of 1×10 5 to 1×10 10 Ω.

8. The polypropylene-based resin expanded bead according to claim 1 , wherein the polyethylene-based resin is present in an amount of 0.5 part by weight or more and less than 20 parts by weight per 100 parts by weight of a total amount of the polypropylene-based resin and the polyethylene-based resin.

9. The polypropylene-based resin expanded bead according to claim 8 , wherein the polyolefin-based resin cover layer is in a substantially unexpanded state.

10. The polypropylene-based resin expanded bead according to claim 9 , wherein the polyolefin-based cover layer of said expanded bead has an average thickness of 0.2 μm or more.

11. The polypropylene-based resin expanded bead according to claim 10 , wherein the electrically conductive carbon black is Ketjen black and present in an amount of 5 to 15 parts by weight per 100 parts by weight of the mixed resin of the polypropylene-based resin and the polyethylene-based resin.

12. The polypropylene-based resin expanded bead according to claim 9 , wherein the electrically conductive carbon black is Ketjen black and present in an amount of 5 to 15 parts by weight per 100 parts by weight of the mixed resin of the polypropylene-based resin and the polyethylene-based resin.

13. The polypropylene-based resin expanded bead according to claim 8 , wherein the polyolefin-based cover layer of said expanded bead has an average thickness of 0.2 μm or more.

14. The polypropylene-based resin expanded bead according to claim 13 , wherein the electrically conductive carbon black is Ketjen black and present in an amount of 5 to 15 parts by weight per 100 parts by weight of the mixed resin of the polypropylene-based resin and the polyethylene-based resin.

15. The polypropylene-based resin expanded bead according to claim 8 , wherein the electrically conductive carbon black is Ketjen black and present in an amount of 5 to 15 parts by weight per 100 parts by weight of the mixed resin of the polypropylene-based resin and the polyethylene-based resin.

16. A molded article that is obtained by in-mold molding of the polypropylene-based resin expanded beads according to claim 8 , said molded article having a surface resistivity of 1×10 5 to 1×10 10 Ω.

17. The polypropylene-based resin expanded bead according to claim 1 , wherein the polyolefin-based resin cover layer is in a substantially unexpanded state.

18. The polypropylene-based resin expanded bead according to claim 17 , wherein the polyolefin-based cover layer of said expanded bead has an average thickness of 0.2 μm or more.

19. The polypropylene-based resin expanded bead according to claim 18 , wherein the electrically conductive carbon black is Ketjen black and present in an amount of 5 to 15 parts by weight per 100 parts by weight of the mixed resin of the polypropylene-based resin and the polyethylene-based resin.

20. The polypropylene-based resin expanded bead according to claim 17 , wherein the electrically conductive carbon black is Ketjen black and present in an amount of 5 to 15 parts by weight per 100 parts by weight of the mixed resin of the polypropylene-based resin and the polyethylene-based resin.

Assignees

• Jsp Corp

Inventors

• Chiba Takuya
• Oikawa Masaharu
• Shinohara Mitsuru

Classifications

• C08J2201/038

  Use of an inorganic compound to impregnate, bind or coat a foam, e.g. waterglass · CPC title

• C08J2423/06

  Polyethene · CPC title

• B29B9/06

  in the form of filamentary material, e.g. combined with extrusion · CPC title

• B29K2023/12

  PP, i.e. polypropylene · CPC title

• B29K2105/04

  cellular or porous · CPC title