Phosphonium-based compound, epoxy resin composition containing same, semiconductor device manufactured using same

Patent metadata

Field	Value
Publication number	US-10385161-B2
Application number	US-201615523501-A
Country	US
Kind code	B2
Filing date	Jan 22, 2016
Priority date	Apr 15, 2015
Publication date	Aug 20, 2019
Grant date	Aug 20, 2019

Abstract

The present invention relates to a phosphonium-based compound represented by chemical formula 1, an epoxy resin composition containing the same, and a semiconductor device manufactured by using the same.

First claim

The invention claimed is:

1. A phosphonium compound, wherein the phosphonium compound is any one of compounds represented by Formulae 1a to 1f:

2. An epoxy resin composition, comprising:
an epoxy resin, a curing agent, an inorganic filler, and a curing catalyst, the curing catalyst including the phosphonium compound according to claim 1 .

3. The epoxy resin composition according to claim 2 , wherein the epoxy resin includes one or more of a bisphenol A type epoxy resin, a bisphenol F type epoxy resin, a phenol novolac type epoxy resin, a tert-butyl catechol type epoxy resin, a naphthalene type epoxy resin, a glycidyl amine type epoxy resin, a cresol novolac type epoxy resin, a biphenyl type epoxy resin, a linear aliphatic epoxy resin, a cycloaliphatic epoxy resin, a heterocyclic epoxy resin, a spiro ring-containing epoxy resin, a cyclohexane dimethanol type epoxy resin, a trimethylol type epoxy resin, or a halogenated epoxy resin.

4. The epoxy resin composition according to claim 2 , wherein the curing agent includes a phenol resin.

5. The epoxy resin composition according to claim 2 , wherein the curing agent includes one or more of a phenolaralkyl type phenol resin, a phenol novolac type phenol resin, a xyloc type phenol resin, a cresol novolac type phenol resin, a naphthol type phenol resin, a terpene type phenol resin, a multifunctional phenol resin, a dicyclopentadiene-based phenol resin, a novolac type phenol resin synthesized from bisphenol A and resol, a polyhydric phenol compound, an acid anhydride, or an aromatic amine.

6. The epoxy resin composition according to claim 2 , wherein the curing catalyst is present in an amount of 0.01 wt % to 5 wt % in the epoxy resin composition.

7. The epoxy resin composition according to claim 2 , wherein the phosphonium compound is present in an amount of 10 wt % to 100 wt % in the curing catalyst.

8. The epoxy resin composition according to claim 2 , wherein the epoxy resin composition has a curing shrinkage of not more than 0.4%, as calculated according to Equation 1:
Curing shrinkage=| C−D|/C× 100  <Equation 1>

wherein C is the length of a specimen obtained by transfer molding of the epoxy resin composition at 175° C. and 70 kgf/cm 2 , and D is the length of the specimen after post-curing the specimen at 170° C. to 180° C. for 4 hours and cooling.

9. The epoxy resin composition according to claim 2 , wherein the epoxy resin composition has a storage stability of about 80% or more, as calculated according to Equation 2:
Storage stability=( F 1− F 0)/ F 0×100  <Equation 2>

wherein F 1 is the flow length (inches) of the epoxy resin composition measured after storing the composition at 25° C./50% RH for 72 hours using a transfer molding press at 175° C. and 70 kgf/cm 2 in accordance with EMMI-1-66, and F0 is the initial flow length (inches) of the epoxy resin composition.

10. A semiconductor device encapsulated with the epoxy resin composition according to claim 2 .

Assignees

• Samsung Sdi Co Ltd

Inventors

• Kim Min Gyum
• Choi Jin Woo
• Kwon Ki Hyeok
• Lee Dong Hwan
• Chung Joo Young
• Cheon Jin Min

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W74/142

  the encapsulations exposing the passive side of the semiconductor body · CPC title

• H10W74/15

  on active surfaces of flip-chip devices, e.g. underfills · CPC title

• H10W74/111

  the semiconductor body being completely enclosed · CPC title

• H10W74/47

  comprising organic materials, e.g. plastics or resins · CPC title