Power semiconductor module

Patent metadata

Field	Value
Publication number	US-10381283-B2
Application number	US-201615747871-A
Country	US
Kind code	B2
Filing date	Jul 4, 2016
Priority date	Jul 30, 2015
Publication date	Aug 13, 2019
Grant date	Aug 13, 2019

Abstract

The present invention discloses a power semiconductor module, comprising: a substrate; a semiconductor provided on a top side of the substrate; and a package formed on the semiconductor and the substrate, wherein the package has openings at a top side thereof, through which terminal contacts of the semiconductor and the substrate are exposed outside and accessible from outside.

First claim

What is claimed is:

1. A power semiconductor module, comprising:
a substrate;
a semiconductor provided on a top side of the substrate; and
a package formed on the semiconductor and the substrate,
wherein the package has openings at a top side thereof, through which terminal contacts of the semiconductor and the substrate are exposed outside and accessible from outside;
wherein a control terminal and a first power terminal of the semiconductor are connected to respective contact areas of the substrate,
wherein the contact area of the substrate connected to the control terminal is accessible from outside through a first opening of the openings in the package,
wherein a terminal contact of a second power terminal of the semiconductor is accessible from outside through a second opening of the openings in the package,
wherein the second power terminal is provided on a top side of the semiconductor, the control terminal and the first power terminal are provided on a bottom side of the semiconductor facing the substrate; and
wherein the control terminal and the first power terminal are connected to respective contact areas of the substrate by a bottom side connecting layer between the semiconductor and the substrate, and the contact area of the substrate connected to the control terminal by the bottom side connecting layer is accessible from outside through the first opening in the package.

2. The power semiconductor module according to claim 1 ,
wherein the terminal contacts of the semiconductor and the substrate that are exposed outside and accessible from outside are pressure-contacted with a circuit board.

3. The power semiconductor module according to claim 2 ,
wherein the terminal contact of the semiconductor that is exposed outside and accessible from outside is provided with a bearing surface thereon.

4. The power semiconductor module according to claim 2 , further comprising:
a base plate; and
an insulating film formed on a top side of the base plate,
wherein the substrate is provided on a top side of the insulating film.

5. The power semiconductor module according to claim 1 ,
wherein the terminal contact of the semiconductor that is exposed outside and accessible from outside is provided with a bearing surface thereon.

6. The power semiconductor module according to claim 1 , further comprising:
a base plate; and
an insulating film formed on a top side of the base plate,
wherein the substrate is provided on a top side of the insulating film.

7. The power semiconductor module according to claim 6 ,
wherein the package is made of a material that is thermomechanically adapted to that of the substrate and the base plate.

8. The power semiconductor module according to claim 1 , wherein the package is a molding compound molded on the substrate and the semiconductor.

9. The power semiconductor module according to claim 1 , wherein a contact area of the substrate at the periphery of the substrate is accessible from the periphery of the power semiconductor module.

10. The power semiconductor module according to claim 1 , wherein the openings in the package are arranged in such a way that they are offset from one another.

11. The power semiconductor module according to claim 5 , further comprising:
a base plate; and
an insulating film formed on a top side of the base plate,
wherein the substrate is provided on a top side of the insulating film.

12. The power semiconductor module according to claim 5 ,
wherein the bearing surface is copper based bearing surface, and is connected to the semiconductor by a top side connecting layer between the bearing surface and the semiconductor,
wherein the top side connecting layer is a silver sintering layer formed by silver sintering the bearing surface to the semiconductor.

13. The power semiconductor module according to claim 12 , further comprising:
a base plate; and
an insulating film formed on a top side of the base plate,
wherein the substrate is provided on a top side of the insulating film.

Assignees

• Danfoss Silicon Power Gmbh

Inventors

• Osterwald Frank
• Eisele Ronald
• Ulrich Holger

Classifications

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/736

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W72/07354

  changes in dispositions · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W72/352

  comprising metals or metalloids, e.g. solders · CPC title