Method for preparing 3(4),8(9)-bisformyltricyclo[5.2.1.02,6]decane
US-12202796-B2 · Jan 21, 2025 · US
US10377692B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10377692-B2 |
| Application number | US-87562710-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 3, 2010 |
| Priority date | Sep 9, 2009 |
| Publication date | Aug 13, 2019 |
| Grant date | Aug 13, 2019 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
A photoresist composition comprising a resin which comprises a structural unit derived from a compound having an acid-labile group and which is insoluble or poorly soluble in an alkali aqueous solution but becomes soluble in an alkali aqueous solution by the action of an acid, an acid generator and a compound represented by the formula (I′): wherein R 51 , R 52 , R 53 and R 54 independently each represent a C1-C8 alkyl group, and A 11 represents a C3-C36 divalent saturated cyclic hydrocarbon group which can contain one or more heteroatoms and which have one or more substituents or a C6-C20 divalent aromatic hydrocarbon group which can contain one or more heteroatoms and which have one or more substituents.
Opening claim text (preview).
What is claimed is: 1. A photoresist composition comprising a resin which comprises a structural unit derived from a compound represented by the formula (a1-1): wherein R a4 represents a hydrogen atom or a methyl group, R a6 represents a C1-C8 aliphatic hydrocarbon group or a C3-C10 saturated cyclic hydrocarbon group, L a1 represents *—O— or *—O—(CH 2 ) k1 —CO—O— in which * represents a binding position to —CO—, and k1 represents an integer of 1 to 7, and m1 represents an integer of 0 to 14; a structural unit derived from a compound represented by the formula (a2-0): wherein R 8 represents a hydrogen atom, a halogen atom, a C1-C6 alkyl group or a C1-C6 halogenated alkyl group, R 9 is independently in each occurrence a halogen atom, a hydroxyl group, a C1-C6 alkyl group, a C1-C6 alkoxy group, a C2-C4 acyl group, a C2-C4 acyloxy group, an acryloyl group or a methacryloyl group, ma represents an integer of 0 to 4, and a structural unit derived from a compound selected from the group consisting of styrene, a compound having no acid-labile group but having a lactone ring and a compound represented by formula (a2-1): wherein R a14 represents a hydrogen atom or a methyl group, R a15 and R a16 each independently represent a hydrogen atom, a methyl group or a hydroxyl group, L a3 represents *—O— or *—O—(CH 2 ) k2 —CO—O— in which * represents a binding position to —CO—, and k2 represents an integer of 1 to 7, and o1 represents an integer of 0 to 10, which resin is insoluble or poorly soluble in an alkali aqueous solution but becomes soluble in an alkali aqueous solution by the action of an acid; no other acid generator than an acid generator represented by formula (B1) in which Q 1 and Q 2 each independently represent a fluorine atom or a C1-C6 perfluoroalkyl group; wherein L b1 represents *—CO—O-L b2 -, *—CO—O-L b4 -CO—O-L b3 , *-L B7 -O-L b6 -, *—CO—O-L b8 -O—, or *—CO—O-L b10 -O-L b9 -CO—O— in which L b2 represents a single bond or a C1-C15 alkanediyl group, L b3 represents a single bond or a C1-C12 alkanediyl group, L b4 represents a single bond or a C1-C13 alkanediyl group, with proviso that total carbon number of L b3 and L b4 is 1 to 13, L b6 represents a C1-C15 alkanediyl group, L b7 represents a C1-C15 alkanediyl group, with proviso that total carbon number of L b6 and L b7 is 1 to 16, L b8 represents a C1-C14 alkanediyl group, L b9 represents a C1-C11 alkanediyl group, L b10 represents a C1-C11 alkanediyl group, with proviso that total carbon number of L b9 and L b10 is 1 to 12, and * represents a binding position to —C(Q 1 )(Q 2 )-, wherein Y represents a C3-C18 saturated cyclic hydrocarbon group which can have one or more substituents, and one or more methylene groups in the saturated cyclic hydrocarbon group can be replaced by —O—,—CO—, or —SO 2 — and wherein Z + represents an organic cation represented by formula (b2-1): where R b4 , R b5 and R b6 each independently represent a C1-C30 aliphatic hydrocarbon group which can have one or more substituents selected from the group consisting of a hydroxyl group, a C1-C12 alkoxy group and a C6-C18 aromatic hydrocarbon group, a C3-C36 saturated cyclic hydrocarbon group which can have one or more substituents selected from the group consisting of a halogen atom, a C2-C4 acyl group and a glycidyloxy group, or a C6-C18 aromatic hydrocarbon group which can have one or more substituents selected from the group consisting of a halogen atom, a hydroxyl group, a C1-C36 aliphatic hydrocarbon group, a C3-C36 saturated cyclic hydrocarbon group or a C1-C12 alkoxy group; and a compound represented by the formula (I′): wherein the cation part represents a cation by any one of the following formulae: and the anion part represents an anion represented by any one of the following formulae 2. A process for producing a photoresist pattern comprising the following steps (1) to (5): (1) a step of applying the photoresist composition according to claim 1 on a substrate, (2) a step of forming a photoresist film by conducting drying, (3) a step of exposing the photoresist film to radiation, (4) a step of baking the exposed photoresist film, and (5) a step of developing the baked photoresist film with an alkaline developer, thereby forming a photoresist pattern. 3. The process according to claim 2 wherein the photoresist film is exposed using an electron beam lithography system or an extreme ultraviolet lithography system in step (3). 4. The photoresist composition according to claim 1 wherein the resin consists of a structural unit derived from the compound represented by formula (a1-1), a structural unit derived from a compound represented by formula (a2-0), and a structural unit derived from a compound selected from the group consisting of styrene, a compound having no acid-labile group but having a lactone ring and a compound represented by formula (a2-1).
the macromolecular compound having an alicyclic moiety in a side chain · CPC title
with perfluoro compounds, e.g. for dry lithography (G03F7/0048 takes precedence) · CPC title
with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors · CPC title
characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing · CPC title
Photosensitive materials (G03F7/12, G03F7/14 take precedence) · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.