Exterior forming method and exterior forming structure of electronic component

Patent metadata

Field	Value
Publication number	US-10377169-B2
Application number	US-201615137622-A
Country	US
Kind code	B2
Filing date	Apr 25, 2016
Priority date	Apr 23, 2015
Publication date	Aug 13, 2019
Grant date	Aug 13, 2019

Abstract

Disclosed herein are an exterior forming method and an exterior forming structure of an electronic component. The exterior forming method of an electronic component may include mounting an injection-molded product, which is injection molded as an electronic component, to an upper portion a heat transferring base unit, mounting a printing film having an ink layer for a heat transfer to the upper portion of the heat transferring base unit such that the ink layer faces an upper surface of the injection-molded product, and heat-transferring the ink layer on the upper surface of the injection-molded product by rotating a heating roll while closely attached at an upper portion of the printing film. The exterior forming method may also include forming an UV coating layer on an upper portion of the ink layer that is heat-transferred on the injection-molded product.

First claim

What is claimed is:

1. A method for forming an exterior of an electronic component, the method comprising:
(a) mounting an injection-molded product, which is injection molded as an electronic component, to an upper portion of a heat transferring base unit;
(b) mounting a printing film having an ink layer for a heat transfer to the upper portion of the heat transferring base unit such that the ink layer faces an upper surface of the injection-molded product; and
(c) heat-transferring the ink layer on the upper surface of the injection-molded product by rotating a heating roll while closely attached at an upper portion of the printing film.

2. The method of claim 1 , wherein:
in (a), a mounting groove is formed in the upper portion of the heat transferring base unit, and
a position of the injection-molded product is fixed as a lower end portion of the injection-molded product is mounted through the mounting groove.

3. The method of claim 1 , wherein:
in (a), at the upper surface of the injection-molded product, at least one of a SR (Solder Resist) layer and an EMC (Epoxy Molding Compound) layer is additionally formed.

4. The method of claim 1 , wherein:
in (a), the injection-molded product is a home key to verify fingerprints provided for a mobile device having a fingerprint-verifying sensor.

5. The method of claim 1 , wherein:
in (b), the printing film comprises a film member and the ink layer provided at a surface of the film member, and
one end portion of the film member is fixed to a first fixing member protruding upward from one side of the heat transferring base unit, and
the other end portion of the film member is fixed to a second fixing member protruding upward from the other side of the heat transferring base unit, and
the ink layer is provided at a lower surface of the film member while facing the upper surface of the injection-molded product, and a size of an area at which the ink layer is formed is larger than an area of the upper surface of the injection-molded product.

6. The method of claim 5 , wherein:
in (b), the one end portion and the other end portion of the film member are fixed to have fixing heights identical with respect to each other, and
the film member is horizontally mounted to the upper portion of the heat transferring base unit while having a predetermined distance from the upper surface of the injection-molded product.

7. The method of claim 1 , wherein:
through (c),
the ink layer being heat-transferred to the upper surface of the injection-molded product by heating roll comprises a plurality of functional ink layers, and
the plurality of functional ink layers comprises a first ink layer to provide adhesive force in between the injection-molded product and the ink layer while formed at the upper surface of the injection-molded product; a second ink layer to implement a color while formed at an upper portion of the first ink layer; and a third ink layer to protect the color implemented by the second ink layer and provide gloss while formed at an upper portion of the second ink layer.

8. A method for forming an exterior of an electronic component, the method comprising:
(a) mounting an injection-molded product, which is injection molded as an electronic component, to an upper portion of a heat transferring base unit;
(b) mounting a printing film having an ink layer for a heat transfer to the upper portion of the heat transferring base unit such that the ink layer faces an upper surface of the injection-molded product;
(c) heat-transferring the ink layer on the upper surface of the injection-molded product by rotating a heating roll while closely attached at an upper portion of the printing film; and
(d) forming an UV coating layer on an upper portion of the ink layer that is heat-transferred on the injection-molded product.

9. The method of claim 8 , wherein:
a mounting groove is formed in the upper portion of the heat transferring base unit, and
a position of the injection-molded product is fixed as a lower end portion of the injection-molded product is mounted through the mounting groove.

10. The method of claim 8 , wherein:
in (a), at the upper surface of the injection-molded product, at least one of a SR (Solder Resist) layer and an EMC (Epoxy Molding Compound) layer is additionally formed.

11. The method of claim 8 , wherein:
in (a), the injection-molded product is a home key to verify fingerprints provided for a mobile device having a fingerprint-verifying sensor.

12. The method of claim 8 , wherein:
in (b), the printing film comprises a film member and the ink layer provided at a surface of the film member, and
one end portion of the film member is fixed at a first fixing member protruding upward from one side of the heat transferring base unit, and
the other end portion of the film member is fixed at a second fixing member protruding upward from the other side of the heat transferring base unit, and
the ink layer is provided at a lower surface of the film member while facing the upper surface of the injection-molded product, and a size of an area at which the ink layer is formed is larger than an area of the upper surface of the injection-molded product.

13. The method of claim 12 , wherein:
in (b), the one end portion and the other end portion of the film member are fixed to have fixing heights identical with respect to each other, and
the film member is horizontally mounted to the upper portion of the heat transferring base unit while having a predetermined distance with respect to the upper surface of the injection-molded product.

14. The method of claim 8 , wherein:
through (c),
the ink layer being heat-transferred to the upper surface of the injection-molded product by the heating roll comprises a plurality of functional ink layers, and
the plurality of functional ink layers comprises a first ink layer to provide adhesive force in between the injection-molded product and the ink layer while formed at the upper surface of the injection-molded product; a second ink layer to implement a color while formed at an upper portion of the first ink layer; and a third ink layer to protect the color implemented by use of the second ink layer and provide gloss while formed at an upper portion of the second ink layer.

15. The method of claim 8 , wherein:
(d) comprises (d-1) mounting injection-molded product having the ink layer heat-transferred thereon to an UV-coating jig, and applying UV material on the upper portion of the ink layer;
(d-2) mounting a sheet member to an upper portion of the UV-coating jig and driving a roller on an upper portion of the sheet member; and
(d-3) hardening and forming an UV coating layer on the upper portion of the ink layer by radiating UV.

Assignees

• Samsung Electronics Co Ltd
• Cict

Inventors

• Yoon Sung Woon
• Lee Sung-Hai
• Lee Kyo Ree
• Kim Hui-Cheol
• Youn Dae-Keun

Classifications

• B41J2/325

  by selective transfer of ink from ink carrier, e.g. from ink ribbon or sheet · CPC title

• B29C66/8362

  Rollers, cylinders or drums moving relative to and tangentially to the parts to be joined · CPC title

• B44C1/1712 Primary

  Decalcomanias applied under heat and pressure, e.g. provided with a heat activable adhesive · CPC title

• B32B37/0053

  Constructional details of laminating machines comprising rollers; Constructional features of the rollers · CPC title

• H01H2239/074

  Actuation by finger touch · CPC title