Board work system, and method for managing mounting order of components in board work system

Patent metadata

Field	Value
Publication number	US-10375870-B2
Application number	US-201415119082-A
Country	US
Kind code	B2
Filing date	Feb 19, 2014
Priority date	Feb 19, 2014
Publication date	Aug 6, 2019
Grant date	Aug 6, 2019

Abstract

A board work system which optimizes amounting order of components on a circuit board. In a case where an error rate which shows the number of defective dies included in the wafer provided in the wafer-type supply device is input by a user, an integrated control device uses the input value in processing. In addition, in a case where the error rate is not input by the user, the integrated control device decides a value obtained by averaging the number of defective dies of the same type of wafer in production information as the error rate. In addition, the system decides the mounting order of mounting the components of the tape-type supply device or the wafer-type supply device on the circuit board based on the decided error rate, or changes the mounting order after the decision.

First claim

The invention claimed is:

1. A board work system comprising:
a plurality of component supply sections which supply components to be mounted on a circuit board;
a die supply section which is one of the plurality of component supply sections, and supplies dies from a diced wafer; and
a control section which decides or changes a mounting order of mounting the components including the dies on the circuit board, based on an error occurrence rate determined by dividing a number of defective dies on the diced wafer which the die supply section supplies within a predetermined period during production of a plurality of circuit boards by a sum of a number of normal dies on the diced wafer and the number of defective dies.

2. The board work system according to claim 1 ,
wherein the control section decides or changes an order of supply of the plurality of component supply sections including the die supply section so as to reduce supply waiting time during which an operation of starting a next mounting sequence is delayed until the die supply section supplies a normal die, in a mounting sequence in which the die supply section supplies the dies.

3. The board work system according to claim 1 ,
wherein the control section manages each production time of a plurality of modules which mount the components supplied from the component supply section on the circuit board, corrects each production time of the plurality of modules which correspond to a type of a component mounting circuit board to be produced, based on the error occurrence rate, determines a module which becomes a bottleneck among the plurality of modules based on the production time after a correction, and changes the type of the component to be supplied in each of the plurality of modules based on the determination result.

4. The board work system according to claim 1 ,
wherein data related to the defective dies is a wafer map illustrating a position of a defective die in the wafer, and
wherein the control section decides the error occurrence rate also based on the wafer map.

5. The board work system according to claim 1 ,
wherein the control section decides a time which becomes necessary for supplying a die in accordance with a position of picking up the die in the wafer.

6. The board work system according to claim 1 ,
wherein the control section computes a remaining number of the dies of the wafer supplied to the die supply section based on the error occurrence rate, and decides timing of replenishing the wafer to the die supply section based on the computation result.

7. A method for managing a mounting order of a component in a board work system including a plurality of component supply sections which supply components to be mounted on a circuit board; and a die supply section which is one of the plurality of component supply sections, and supplies dies from a diced wafer, the method comprising:
deciding or changing a mounting order of mounting the components including the dies on the circuit board, based on an error occurrence rate determined by dividing a number of defective dies on the diced wafer which the die supply section supplies within a predetermined period during production of a plurality of circuit boards by a sum of a number of normal dies on the diced wafer and the number of defective dies.

8. The board work system according to claim 1 ,
wherein the control section decides or changes a mounting order of mounting the components by alternating between die supply section and another of the plurality of component supply sections based on the error occurrence rate.

9. A board work system comprising:
a plurality of component supply sections which supply components to be mounted on a circuit board;
a die supply section which is one of the plurality of component supply sections, and supplies a die from a diced wafer to a supply position;
a mounting head which is moved to the supply position to suction the die; and
a control section which computes a required supply time which is required for the die supply section to supply the die to the supply position, based on an error occurrence rate determined at least one of division of a number of defective dies on the diced wafer which the die supply section supplies within a predetermined period during production of a plurality of circuit boards by a sum of a number of normal dies on the diced wafer and the number of defective dies and data related to the defective dies included in the wafer, determines whether the die supply section completes conveying the die to the supply position until the mounting head moves to the supply position based on the computed required supply time, and, if determining that the die supply section does not complete, decides or changes a mounting order of mounting the components including the dies on the circuit board.

Assignees

• Fuji Corp

Inventors

• Oyama Shigeto

Classifications

• H10W72/07173

  Means for moving chips, wafers or other parts, e.g. conveyor belts · CPC title

• H10P72/0442

  Apparatus for placing on an insulating substrate, e.g. tape · CPC title

• H05K13/085

  Production planning, e.g. of allocation of products to machines, of mounting sequences at machine or facility level · CPC title

• Y10T29/53174

  Means to fasten electrical component to wiring board, base, or substrate · CPC title

• H01L21/67132

  Electricity · mapped topic