Semiconductor device

Patent metadata

Field	Value
Publication number	US-10375817-B2
Application number	US-201715480920-A
Country	US
Kind code	B2
Filing date	Apr 6, 2017
Priority date	Apr 15, 2016
Publication date	Aug 6, 2019
Grant date	Aug 6, 2019

Abstract

An electronic device has a control board having a plurality of wiring layers, a metal-made housing supporting the control board, and a fixing screw for fixing the control board to the housing through a washer. The control board includes a through hole penetrating from a third surface to a fourth surface, a through electrode formed inside the through hole, and a power system GND pattern formed on any wiring layer of the wiring layers. The power system GND pattern and the housing are electrically coupled through the through electrode, the washer, and the fixing screw.

First claim

What is claimed is:

1. An electronic device comprising:
a wiring substrate which has a first surface, a second surface opposite the first surface, and a plurality of wiring layers arranged between the first surface and the second surface; and
a metal-made case which supports the wiring substrate,
wherein the wiring substrate includes
a first through hole which penetrates from one surface to other surface, of a surface on which an uppermost wiring layer of the wiring layers is formed and a surface on which a lowermost wiring layer is formed,
a through electrode which is formed inside the first through hole, and
a conductor pattern which is formed on a wiring layer positioned on a side inner, in a substrate thickness direction, than the uppermost and lowermost layers, of the wiring layers,

wherein the conductor pattern and the case are electrically coupled through the through electrode,
wherein the wiring substrate is fixed to the case using a plurality of metal-made coupling members,
wherein, of the coupling members, at least one first coupling member is electrically coupled to the conductor pattern,
wherein the wiring substrate is electrically coupled to the conductor pattern on the first surface and the second surface, and has a ground terminal which is externally and mechanically connected to a lead wire to which a ground potential is supplied,
wherein the coupling members are provided at a plurality of points, respectively, and
wherein, of the coupling members provided at the points, the at least one first coupling member is disposed at a straight distance nearest to the ground terminal in plan view and is electrically and mechanically connected to the case.

2. The electronic device according to claim 1 ,
wherein the conductor pattern and the case are electrically coupled through another conductor pattern formed on at least any one surface, of the surface on which the uppermost wiring layer is formed and the surface on which the lowermost wiring layer is formed.

3. The electronic device according to claim 1 ,
wherein the conductor pattern and the case are electrically coupled through another conductor pattern arranged along at least one part of an outer peripheral part of a coupling member for fixing the wiring substrate and the case.

4. The electronic device according to claim 3 ,
wherein the conductor pattern and the case are electrically coupled through the another conductor pattern and a plate conductor member being in contact with the another conductor pattern.

5. The electronic device according to claim 1 ,
wherein the coupling members are fixing screws, and
wherein at least one first fixing screw as the at least one first coupling member is electrically and mechanically connected to the metal-made case of a motor.

6. The electronic device according to claim 5 ,
wherein the wiring substrate is a control board for controlling the motor.

7. The electronic device according to claim 6 ,
wherein, of the fixing screws as the coupling members arranged at the points, a plurality of fixing screws including the at least one first fixing screw are electrically coupled to the case.

8. The electronic device according to claim 7 ,
wherein the coupling members including the coupling member at the straight distance nearest to the ground terminal in the plan view and electrically coupled to the conductor pattern are arranged in a region overlapping a region in which the conductor pattern is formed.

9. The electronic device according to claim 1 ,
wherein, a first conductor pattern different from the conductor pattern and a second conductor pattern as the conductor pattern are separately formed on the wiring layer on which the conductor pattern is formed.

10. The electronic device according to claim 8 ,
wherein the ground terminal is arranged in a region overlapping a region in which the second conductor pattern is formed in plan view.

11. The electronic device according to claim 1 ,
wherein the through electrode is formed in a region overlapping a region of the conductor pattern on which the ground terminal is formed in plan view.

12. The electronic device according to claim 11 ,
wherein the through electrode includes a plurality of through electrodes.

13. The electronic device according to claim 11 ,
wherein the through electrodes are provided to surround the coupling member for electrically coupling the conductor pattern and the case in plan view.

14. The electronic device according to claim 1 ,
wherein the conductor pattern is electrically coupled to a switching element mounted on any of the first surface and the second surface of the wiring substrate.

15. The electronic device according to claim 1 ,
wherein the wiring substrate is fixed to the case using a metal-made coupling member,
wherein the first surface is a surface of the uppermost layer of the wiring substrate,
wherein the second surface is a surface of the lowermost layer of the wiring substrate,
wherein the coupling member is arranged in a second through hole opened to the surface of the uppermost layer and the surface of the lowermost layer of the wiring substrate,
wherein the through electrode is formed from a conductor film formed on an inner wall of the second through hole, and
wherein the conductor pattern is electrically coupled to the case through the conductor film and the coupling member.

16. The electronic device according to claim 15 ,
wherein the coupling member is a pin member which is press-fitted to the case.

17. The electronic device according to claim 1 ,
wherein a conductive member intervenes between the through electrode and the case, to be in contact with the through electrode and the case, and
wherein the conductor pattern is electrically coupled to the case through the through electrode and the conductive member.

18. The electronic device according to claim 1 ,
wherein a projecting part projecting to a side of the wiring substrate is formed on the case,
wherein the wiring substrate is fixed to the case using a metal coupling member in a manner that the projecting part is in contact with the through electrode, and
wherein the conductor pattern is electrically coupled to the case through the through electrode and the projecting part.

Assignees

• Renesas Electronics Corp

Inventors

• Motohashi Norikazu
• Nishiyama Tomohiro
• Shimizu Tadashi
• Nishizono Shinji

Classifications

• H05K5/0065

  wherein modules are associated together, e.g. electromechanical assemblies, modular structures · CPC title

• H05K2201/09618

  Via fence, i.e. one-dimensional array of vias · CPC title

• H05K1/115

  Via connections; Lands around holes or via connections (H05K1/112 takes precedence) · CPC title

• H05K9/0039

  Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing (printed shielding conductors, ground planes or power planes for reduction of cross-talk or noise in printed circuits H05K1/0218) · CPC title

• H05K2201/10166

  Transistor · CPC title