Cleaner composition and preparation of thin substrate

Patent metadata

Field	Value
Publication number	US-10370623-B2
Application number	US-201715488786-A
Country	US
Kind code	B2
Filing date	Apr 17, 2017
Priority date	Apr 26, 2016
Publication date	Aug 6, 2019
Grant date	Aug 6, 2019

Abstract

A cleaner composition consisting essentially of (A) 92.0 wt % to less than 99.9 wt % of an organic solvent, (B) 0.1 wt % to less than 8.0 wt % of a C3-C6 alcohol, and (C) 0.001-3.0 wt % of a quaternary ammonium salt is effective for removing any silicone adhesive residues on a silicon semiconductor substrate. A satisfactory degree of cleanness is achieved within a short time and at a high efficiency without causing corrosion to the substrate.

First claim

The invention claimed is:

1. A cleaner composition for removing any silicone adhesive remaining on a substrate, consisting essentially of
(A) 92.0% to less than 99.9% by weight of an organic solvent exclusive of an alcohol of 3 to 6 carbon atoms,
(B) 0.1% to less than 8.0% by weight of an alcohol of 3 to 6 carbon atoms, and
(C) 0.001% to 3.0% by weight of a quaternary ammonium salt, the total amount of components (A) to (C) being 100% by weight,
wherein the organic solvent (A) is one or two more kinds selected from the group consisting of octane, nonane, decane, undecane, dodecane, tetradecane, hexadecane, isooctane, isononane, isodecane, isododecane, alkylcyclohexanes, p-menthane, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol dibutyl ether and dipropylene glycol dimethyl ether, and
the alcohol (B) is one or two more kinds selected from the group consisting of n-propyl alcohol, isopropyl alcohol, 1-butanol, 2-butanol, isobutyl alcohol, tert-butyl alcohol, 1-pentanol, 2-pentanol, 3-pentanol, 2-methyl-1-butanol, isopentyl alcohol, sec-butyl alcohol, tert-pentyl alcohol, 3-methyl-2-butanol, neopentyl alcohol, 1-hexanol, 2-methyl-1-pentanol, 4-methyl-2-pentanol and 2-ethyl-1-butanol and the cleaning composition is free of water.

2. The cleaner composition of claim 1 wherein component (C) is tetrabutylammonium hydroxide.

3. The cleaner composition of claim 1 wherein the substrate is a semiconductor substrate.

4. The cleaner composition of claim 1 , wherein the alcohol (B) is one or more kinds selected from the group consisting of n-propyl alcohol, isopropyl alcohol, 1-butanol, 2-butanol, isobutyl alcohol, tert-butyl alcohol, 1-pentanol, 2-pentanol, 3-pentanol, 2-methyl-1-butanol, isopentyl alcohol, sec-butyl alcohol, tert-pentyl alcohol, 3-methyl-2-butanol, neopentyl alcohol, 1-hexanol, 2-methyl-1-pentanol, 4-methyl-2-pentanol, and 2-ethyl-1-butanol.

5. A method for preparing a thin substrate, comprising the steps of
(a) forming an adhesive layer on a substrate or handle substrate from an adhesive composition and bonding the substrate and the handle substrate via the adhesive layer,
(b) processing the substrate bonded to the handle substrate,
(c) separating the substrate as processed from the handle substrate, the adhesive layer remaining on the substrate after separation, and
(d) cleaning away the adhesive layer on the substrate with the cleaner composition, wherein the cleaner composition consisting essentially of
(A) 92.0% to less than 99.9% by weight of an organic solvent exclusive of an alcohol of 3 to 6 carbon atoms,
(B) 0.1% to less than 8.0% by weight of an alcohol of 3 to 6 carbon atoms, and
(C) 0.001% to 3.0% by weight of a quaternary ammonium salt, the total amount of components (A) to (C) being 100% by weight,
wherein the organic solvent (A) is one or two more kinds selected from the group consisting of octane, nonane, decane, undecane, dodecane, tetradecane, hexadecane, isooctane, isononane, isodecane, isododecane, alkylcyclohexanes, p-menthane, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol dibutyl ether and dipropylene glycol dimethyl ether, and
the alcohol (B) is one or two more kinds selected from the group consisting of n-propyl alcohol, isopropyl alcohol, 1-butanol, 2-butanol, isobutyl alcohol, tert-butyl alcohol, 1-pentanol, 2-pentanol, 3-pentanol, 2-methyl-1-butanol, isopentyl alcohol, sec-butyl alcohol, tert-pentyl alcohol, 3-methyl-2-butanol, neopentyl alcohol, 1-hexanol, 2-methyl-1-pentanol, 4-methyl-2-pentanol and 2-ethyl-1-butanol and the cleaning composition is free of water.

6. The method of claim 5 wherein the adhesive composition comprises a silicone compound.

7. The method of claim 6 wherein the silicone compound is a (partial) dehydration condensate of a linear or branched organopolysiloxane having at least two silicon-bonded hydroxyl groups with an organopolysiloxane resin comprising R 3 SiO 1/2 units wherein R is a monovalent hydrocarbon group and SiO 2 units and containing a hydroxyl group.

Assignees

• Shinetsu Chemical Co

Inventors

• Ueno Masaya
• Yanagisawa Hideyoshi

Classifications

• H10P72/7416

  used during dicing or grinding · CPC title

• H10P72/744

  Details of chemical or physical process used for separating the auxiliary support from a device or a wafer · CPC title

• H10P90/123

  by grinding or lapping · CPC title

• H10P72/74

  using temporarily an auxiliary support · CPC title

• H10P70/56

  Cleaning of wafer backside · CPC title